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Four-probe resistance measurements of nickel wires written with a scanning tunneling microscope/scanning electron microscope systemEHRICHS, E. E; SMITH, W. F; DE LOZANNE, A. L et al.Ultramicroscopy. 1992, Vol 42-44, Num B, pp 1438-1442, issn 0304-3991Conference Paper

Autonomic visual solder joint inspectionBESL, P. J; DELP, E. J; RAMESH JAIN et al.IEEE journal of robotics and automation. 1985, Vol 1, Num 1, pp 42-56, issn 0882-4967Article

Controlled impedance interconnections: theories, problems, applications. IFUJITSUBO, W. S.Electri.onics. 1986, Vol 32, Num 12, pp 56-58, issn 0745-4309Article

Shielding effectiveness of «pigtail» connectionsHEJASE, H. A. N; ADAMS, A. T; HARRINGTON, R. F et al.IEEE transactions on electromagnetic compatibility. 1989, Vol 31, Num 1, pp 63-68, issn 0018-9375, 6 p.Article

Power surge boosts seized metal bondingSHELLEY, T.Eureka (Beckenham). 1993, Vol 13, Num 12, pp 20-21, issn 0261-2097Article

Pb-Sn alloy microstructure: potential reliability indicator for interconnectsO'CLOCK, G. D. JR; PETERS, M. S; PATER, J. R et al.IEEE transactions on components, hybrids, and manufacturing technology. 1987, Vol 10, Num 1, pp 82-88, issn 0148-6411Article

Connexion non réfrigérées pour matériel cryoélectriqueABRAMOV, G. I; ROZEJN, L. I.Èlektrotehnika (Moskva, 1963). 1987, Num 9, pp 21-25, issn 0013-5860Article

Design and testing of a pair of current leads using bismuth compound superconductorUEDA, K; BOHNO, T; TAKITA, K et al.IEEE transactions on applied superconductivity. 1993, Vol 3, Num 1, pp 400-403, issn 1051-8223, 2Conference Paper

Current trends in through hole component insertion technology. IElectri.onics. 1986, Vol 32, Num 9, pp 34-37, issn 0745-4309Article

Durchkontaktieren von Leiterplatten ohne Galvanik : Polymer-Leitpasten gewinnen an Bedeutung = Through connection of PC boards without electroplatingCAPELLE, D.Metalloberfläche. 1991, Vol 45, Num 1, pp 29-31, issn 0026-0797, 3 p.Article

Improvement of interior defects for MLC end-termination and a platable silver paint preparationKUNIMINE, N.Ferroelectrics (Print). 1986, Vol 68, Num 1-2-3-4, pp 199-206, issn 0015-0193Article

Study on cause of quenching at the joint between multifilamentary superconducting cable and normal conducting cable using 3-D femTAKAHASHI, N; NAKATA, T; FUJII, Y et al.IEEE transactions on magnetics. 1992, Vol 28, Num 5, pp 2826-2828, issn 0018-9464, 2Conference Paper

Improved soldered joints of technical current-carrying superconductorsGONCHAROV, I. N; MIU, L.Cryogenics (Guildford). 1988, Vol 28, Num 3, pp 183-184, issn 0011-2275Article

L'état thermique d'une connexion cryoélectriqueRUDMAN, I. KH; GRENADEROVA, L. A; GRINCHENKO, N. G et al.Izvestiâ Akademii nauk SSSR. Ènergetika i transport. 1988, Num 2, pp 111-116, issn 0002-3310Article

Small low-temperature indium compression feedthroughsKESSEL, R; SAPP, R. C.Review of scientific instruments. 1986, Vol 57, Num 11, pp 2897-2898, issn 0034-6748Article

Wire, cable, and fiber optics technical reportsElectri.onics. 1986, Vol 32, Num 13, pp 41-44, issn 0745-4309Article

Laser micro processing: Facts and trendsSCHMIDT, M; ESSER, G.SPIE proceedings series. 2003, pp 163-171, isbn 0-8194-4869-9, 9 p.Conference Paper

Best practice use of the CISPR AMN/LISNWILLIAMS, T; ORFORD, G. R.IEE conference publication. 1999, pp 173-179, issn 0537-9989, isbn 0-85296-716-0Conference Paper

Inductance characteristics of pipe-type oxide superconductor for various configurationsNAKAMURA, K; ABE, Y; INUKAI, E et al.IEEE transactions on applied superconductivity. 1993, Vol 3, Num 1, pp 413-416, issn 1051-8223, 2Conference Paper

Development of ultra fine wire and fine pitch bonding technologyYAMASHITA, T; KANAMORI, T; IGUCHI, Y et al.IEICE transactions. 1991, Vol 74, Num 8, pp 2369-2377, issn 0917-1673Article

Electrolytic copper migration in accelerated tests. I: Polyethylene glycol-400 doped with ammonium perchlorateVAUGHEN, B. K; ROTH, J. A; STEPPAN, J. J et al.Journal of the Electrochemical Society. 1988, Vol 135, Num 8, pp 2027-2033, issn 0013-4651Article

Des matériaux magiques: les alliages à mémoire de forme = Magical materials: shape memory alloysRICHARDEAU, A.L' Ingénieur constructeur ETP. 1988, Num 352-353, pp 44-45, issn 0046-9513Article

Optimierung bei Gabelschaltungen von Kabeln = L'optimisation des circuits multifilaires de câbles = The optimization of multipath cable circuitsRASQUIN, W.ETZ-Archiv. 1987, Vol 9, Num 3, pp 87-89, issn 0170-1703Article

Factors to consider when specifying hazard-free cordsetsSTELLMAN, R. H.Electri.onics. 1987, Vol 33, Num 8, pp 12-13, issn 0745-4309Article

Back-face only electrical connections of thickness mode piezoelectric transducersMARTIN, R. W; SILVERSTEIN, F. E; PROCTOR, A. H et al.IEEE transactions on ultrasonics, ferroelectrics, and frequency control. 1986, Vol 33, Num 6, pp 778-781, issn 0885-3010Article

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