Initial development work on a high throughput low cost flip chip on board assembly processMCGOVERN, L. P; BALDWIN, D. F; PH.D et al.SPIE proceedings series. 1997, pp 284-289, isbn 0-930815-50-5Conference Paper

Silicon TSV Interposers for Photonics and VLSI PackagingVODRAHALLI, N; LI, C. Y; KOSENKO, V et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7928, issn 0277-786X, isbn 978-0-8194-8465-9 0-8194-8465-2, 792806.1-792806.7Conference Paper

Design & parameter optimization of flip-chip bonderSHIM, Hyoungsub; KANG, Heuiseok; JEONG, Hoon et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, pp 60480G.1-60480G.8, issn 0277-786X, isbn 0-8194-6084-2, 1VolConference Paper

Hybrid-Integrated Silicon Photonic Bridge Chips for Ultralow Energy Inter-Chip CommunicationsTHACKER, Hiren D; SHUBIN, Ivan; RON HO et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7944, issn 0277-786X, isbn 978-0-8194-8481-9, 79440B.1-79440B.11Conference Paper

Filled no-flow underfilling: Process and materialsWUSHENG YIN; HWANG, Hong-Sik; LEE, Ning-Cheng et al.SPIE proceedings series. 2003, pp 262-274, isbn 0-8194-5189-4, 13 p.Conference Paper

Advanced copper column based solder bump for flip-chip interconnectionYAMADA, H; TOGASAKI, T; TATEYAMA, K et al.SPIE proceedings series. 1997, pp 417-422, isbn 0-930815-50-5Conference Paper

Reduced oxide soldering activation (ROSA) : Enabling technology for soldering of Flip chip assembliesHILLMAN, D.SPIE proceedings series. 1997, pp 586-591, isbn 0-930815-50-5Conference Paper

Polymer flip-chip bonding of pressure sensors on flexible kapton film for neonatal cathetersCHUNYAN LI; SAUSER, Frank E; AZIZKHAN, Richard et al.IEEE International Conference on Micro Electro Mechanical Systems. 2004, pp 749-752, isbn 0-7803-8265-X, 1Vol, 4 p.Conference Paper

The effect of flux on the wetting of autocatalytic Ni-Cu-P by In-Sn solderLIN, K.-L; CHEN, C.-J.The International journal of microcircuits and electronic packaging. 1999, Vol 22, Num 2, pp 115-120, issn 1063-1674Article

Connection of VLSI chips to printed circuit board using stacked solder bumpsSASAKI, S; KISHIMOTO, T; MATSUI, N et al.Electronics Letters. 1987, Vol 23, Num 23, pp 1238-1240, issn 0013-5194Article

Comment on Enhancement of flip-chip white light-emitting diodes with a one-dimensional photonic crystalLIU, Zong-Yuan; SHENG LIU; KAI WANG et al.Optics letters. 2010, Vol 35, Num 11, issn 0146-9592, p. 1758Article

Stud bump bond packaging with reduced process stepsZHAOWEI ZHONG.Soldering & surface mount technology. 2001, Vol 13, Num 2, pp 35-38, issn 0954-0911Article

Systemintegration in der Mikroelektronik (Nürnberg, 4-6 Mai 1999) = System integration in micro electronicsReichl, Herbert.Systemintegration in der Mikroelektronik. Kongress. 1999, isbn 3-8007-2456-1, 282 p., isbn 3-8007-2456-1Conference Proceedings

Flip-chip joined 8x8 array of bottom-emitting 850-nm light-emitting diodes for interconnect applicationsHEREMANS, P; MERKEN, P; GENOE, J et al.SPIE proceedings series. 1998, pp 10-15, isbn 0-8194-2727-6Conference Paper

Implementing high density, Cu/BCB thin film interconnect on glass substrates for a portable telecom applicationDESHPANDE, U; CHAZEN, D; SKINNER, M et al.SPIE proceedings series. 1997, pp 472-475, isbn 0-930815-50-5Conference Paper

Reliability evaluation of underfill in flip-chip organic BGA packagesBANKS, D. R; POFAHL, R. G; SYLVESTER, M. F et al.SPIE proceedings series. 1997, pp 124-125, isbn 0-930815-50-5Conference Paper

Solder Jet Technology updateWALLACE, D. B; HAYES, D. J.SPIE proceedings series. 1997, pp 681-684, isbn 0-930815-50-5Conference Paper

Lead-free solder bump technologies for flip-chip electronic packaging applicationsKARIM, Zaheed S; CHOW, Alice; CHEUNG, Edwin et al.SPIE proceedings series. 2002, pp 570-575, isbn 0-8194-4500-2, 2VolConference Paper

Development of a reliable packaging process for flip chip on ceramicsZHAOWEI ZHONG.Microelectronics international. 2001, Vol 18, Num 1, pp 19-22, issn 1356-5362Article

New flip-chip bonding technology NSD (non conductive Film stud-bump Direct Interconnection) method using resin encapsulation sheet : Examination of joint reliability on ALIVH substrateNISHIDA, Kazuto; NISHIKAWA, Hidenobu; SHIMIZU, Kazumichi et al.SPIE proceedings series. 2000, pp 287-292, isbn 0-930815-62-9Conference Paper

Advanced three-dimensional packaging technology for high-density CCD micro-camera system moduleYAMADA, Hiroshi; TOGASAKI, Takashi; TERUI, Takashi et al.SPIE proceedings series. 2000, pp 241-246, isbn 0-930815-62-9Conference Paper

Electro-plated flipchip wafer bumping interconnect technology solutions for the 21^st centuryFLYNN, T; ARGENTO, C. W; O'BRIEN, J et al.SPIE proceedings series. 1999, pp 8-12, isbn 0-930815-58-0Conference Paper

Development of a C4-BGA assembly process : Innovations in C4 flux and underfill materialsPENDSE, R. D; COURTIS, M; SERRANO, B et al.SPIE proceedings series. 1997, pp 455-461, isbn 0-930815-50-5Conference Paper

300 Gb/s bidirectional fiber-coupled optical transceiver module based on 24 TX + 24 RX holey CMOS ICDOANY, Fuad E; SCHOW, Clint L; RYLYAKOV, Alexander V et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7944, issn 0277-786X, isbn 978-0-8194-8481-9, 79440I.1-79440I.7Conference Paper

New Technology for Microfabrication and Testing of a Thermoelectric Device for Generating Mobile Electrical PowerPRASAD, Narasimha S; TAYLOR, Patrick J; TRIVEDI, Sudhir B et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7764, issn 0277-786X, isbn 978-0-8194-8260-0, 776409.1-776409.6Conference Paper