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A METALLIZATION PROVIDING TWO LEVELS OF INTERCONNECT FOR BEAM-LEADED SILICON INTEGRATED CIRCUITS.RYDEN WD; LABUDA EF.1977; I.E.E.E.J. SOLID-STATE CIRCUITS; U.S.A.; DA. 1977; VOL. 12; NO 4; PP. 376-382; BIBL. 17 REF.Article

140 GHz broadband crossbar stripline mixers with over 20 GHz instantaneous RF bandwidthNGUYEN, C; CHANG, K.Electronics Letters. 1984, Vol 20, Num 11, issn 0013-5194, 441Article

AN EVALUATION OF TECHNIQUES FOR BONDING BEAM-LEAD DEVICES TO GOLD THICK FILMS.DAWES CJ.1976; SOLID STATE TECHNOL.; U.S.A.; DA. 1976; VOL. 19; NO 3; PP. 23-28; BIBL. 10 REF.Article

MICROWAVE BEAM-LEAD TRANSISTOR.TSURUMIYA K; HIRANO Y; TAKAHASHI A et al.1974; FUJITSU SCI. TECH. J.; JAP.; DA. 1974; VOL. 10; NO 2; PP. 105-124; BIBL. 7 REF.Article

TECHNOLOGIE DES ELEMENTS CAPACITIFS A CONNEXION DEPASSANTEHALAS I; KAMPA J.1977; PRACE OSRODKA BADAWCZO-ROZWOJOW-ELEKTRON. PROZNIOW.; POLOGNE; DA. 1977; VOL. 5; NO 10; PP. 53-59; ABS. ANGL. RUSSE; BIBL. 7 REF.Article

A TWO-TOOL, PARALLEL-GAP, BEAM-LEAD BONDER FOR HYBRID CIRCUITSSCHELHORN RL.1972; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 12; NO 10; PP. 145-151 (5 P.)Serial Issue

ETUDE DE L'INFLUENCE DES CARACTERISTIQUES GEOMETRIQUES DES POUTRES SUR LA RESISTANCE THERMIQUE DES DISPOSITIFS "BEAM-LEAD".AMOUROUX C.1975; DGRST-7470410; FR.; DA. 1975; PP. 1-15; H.T. 7; BIBL. 3 REF.; (RAPP. FINAL, ACTION CONCERTEE: COMITE COMPOSANTS CIRCUITS MICROMINIATURISES)Report

ANALYSIS AND DEVELOPMENT OF A THERMOCOMPRESSION BOND SCHEDULE FOR BEAM LEAD DEVICESADAMS JR; BONHAM HB.1972; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1972; VOL. 8; NO 3; PP. 22-26; BIBL. 6 REF.Serial Issue

PRELOADING COMPLIANT BONDING TAPE WITH BEAM-LEAD INTEGRATED CIRCUITS.GRUSZKA RF.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 61-65Article

WIRELESS BONDING TECHNIQUES.AWATAR SINGH.1976; J. INSTIT. ENGRS (INDIA), ELECTRON. TELECOMMUNIC. ENGNG DIV.; INDIA; DA. 1976; VOL. 56; NO 3; PP. 85-87; BIBL. 15 REF.Article

THE HIGH TEMPERATURE DEFORMATION PROPERTIES OF GOLD AND THERMOCOMPRESSION BONDING.CONDRA LW; SVITAK JJ; PENSE AW et al.1975; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1975; VOL. 11; NO 4; PP. 290-296; BIBL. 25 REF.Article

LE "BEAM-LEAD": UNE FORMULE CONTROVERSEE BIEN QUE TRES ATTRAYANTE.LE CAIN M.1976; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1976; NO 217; PP. 28-30Article

PACKAGING THE FAST, HOT ICS1973; E.E./SYST. ENGNG TODAY; U.S.A.; DA. 1973; VOL. 32; NO 3; PP. 48-50Serial Issue

PACKAGE DEVELOPMENT FOR A LARGE MULTI-CHIP ARRAY.CLEFORD AP; PAYNE JR.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 9; PP. 47-54 (4P.); BIBL. 6 REF.Article

PREDICTING THE THERMAL PERFORMANCES OF BEAM-LEADED ICSPRESTON SB.1972; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 12; NO 10; PP. 69-82 (8 P.); BIBL. 3 REF.Serial Issue

35 GHz integrated circuit rectifying antenna with 33% efficiencyYOO, T.-W; CHANG, K.Electronics Letters. 1991, Vol 27, Num 23, issn 0013-5194, p. 2117Article

POUR VOS MONTAGES HYPERFREQUENCES: DES DIODES PIN ET SCHOTTKY EN "BEAM LEAD"WARGIN JJ.1981; ELECTRON. IND.; FRA; DA. 1981; NO 8; PP. 35-38Article

94-6 HZ BEAM-LEAD BALANCED MIXERPARRISH PT; CARDIASMENOS AG; GALIN I et al.1981; IEEE TRANS. MICROWAVE THEORY TECH.; ISSN 0018-9480; USA; DA. 1981; VOL. 29; NO 11; PP. 1150-1157; BIBL. 18 REF.Article

CHIPS-IN-TAPE. A STUDY IN AUTOMATED HYBRID IC ASSEMBLY.LUDWIG DP.1978; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1978; VOL. 18; NO 4; PP. 77-86 (7P.)Article

DESIGN AND MANUFACTURE OF A MICROWAVE LOW-NOISE TRANSISTOR HAVING BEAM-LEADS.PESTIE JP; FOURRIER JY.1977; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1977; VOL. 24; NO 2; PP. 73-79; BIBL. 10 REF.Article

EVALUATING THE ECONOMIC FACTORS OF AUTOMATED CHIP BONDING.SALZER JM.1975; INSULAT. CIRCUITS; U.S.A.; DA. 1975; VOL. 21; NO 2; PP. 29-31; BIBL. 10 REF.Article

A SPECTROSCOPIC MONITOR FOR SPUTTER-ETCHING PROCESSESBERNSTEIN T; LABUDA EF.1973; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1973; VOL. 10; NO 1; PP. 108-110; BIBL. 10 REF.Serial Issue

CONVERSION LOSS OF AN MIC BALANCED MIXER: CALCULATION AND MEASUREMENTSSCHUEPPERT B.1982; ELECTRON. LETT.; ISSN 0013-5194; GBR; DA. 1982; VOL. 18; NO 19; PP. 823-824; BIBL. 2 REF.Article

DOMINANT DIFFUSION MECHANISM IN RHSI FORMATIONMGBENU EN.1978; THIN SOLID FILMS; NLD; DA. 1978; VOL. 50; PP. L13-L16; BIBL. 12 REF.Article

OXYGEN EMBRITTLEMENT OF COPPER LEADS.PANOUSIS NT; WONSIEWICZ BC; CONDRA LW et al.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 2; PP. 127-132; BIBL. 11 REF.Article

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