PRINCIPLES OF THICK FILM MATERIALS FORMULATION.WALTON B.1975; RADIO ELECTRON. ENGR; G.B.; DA. 1975; VOL. 45; NO 3; PP. 139-143; BIBL. 14 REF.Article

THICK FILM TECHNOLOGY IN 1975.HAMER DW.1975; CERAM. INDUSTRY; U.S.A.; DA. 1975; VOL. 105; NO 2; PP. 20-21Article

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REALISATION DE CIRCUITS ACTIFS HYBRIDES A COUCHE EPAISSECHMIELEWSKI JW; KSEPKO J.1973; ZESZ. NAUK. POLITECH. GDANSK., ELEKTRON.; POLSKA; DA. 1973; NO 31; PP. 79-91; ABS. ANGL. RUSSE; BIBL. 14 REF.Article

LASER TRIMMING OF THICK FILM CIRCUITS.STEER P.1974; ELECTRON. COMPON.; G.B.; DA. 1974; VOL. 16; NO 15; PP. 14-15Article

THICK-FILM MATERIALS AND TECHNIQUES.ULRICH DR.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 7; PP. 276-285; BIBL. 30 REF.Article

HYBRIDSCHALTUNGEN IN DICKFILMTECHNIK = CIRCUITS HYBRIDES A COUCHES EPAISSESWINIGER F.1973; P.T.T. BULL. TECH.; SUISSE; DA. 1973; VOL. 51; NO 2; PP. 68-73; ABS. FR. ITALSerial Issue

IN-HOUSE ARTWORK AND SCREEN FABRICATION FOR PROTOTYPE THICK FILM CIRCUITRYSOOKIKIAN V.1972; SOLID STATE TECHNOL.; U.S.A.; DA. 1972; VOL. 15; NO 6; PP. 42-47Serial Issue

Thick film composition reproducibility and its impact on yieldsWILSON, K. M; RESUTEK, J. L.Solid state technology. 1982, Vol 25, Num 3, pp 115-118, issn 0038-111XArticle

THICK FILM MICROELECTRONIC CIRCUITS1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 99-103; (3 P.)Article

FACILITIES, EQUIPMENT, AND MANUFACTURING OPERATIONS FOR CIRCUIT DEPOSITION AND TESTING.COTE RE.1975; SOLID STATE TECHNOL.; U.S.A.; DA. 1975; VOL. 18; NO 1; PP. 49-52Article

Experiences in obtaining cross belt uniformity of ±1°C in a 24 inch wide thick film conveyor furnaceDIMOCK, Fred.SPIE proceedings series. 2002, pp 860-863, isbn 0-930815-66-1, 4 p.Conference Paper

Processing polymer thick film circuitry with radiation curingGREEN, W. J.Journal of radiation curing. 1983, Vol 10, Num 2, pp 4-7, issn 0361-6428Article

A PASTE MANUFACTURER'S VIEW OF THE HYBRID INDUSTRYTAIT R.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 6; PP. 801-811Article

LIFE-SAVING RESISTOR TRIMMING.LACOURTE N.1978; SOLID STATE TECHNOL.; U.S.A.; DA. 1978; VOL. 20; NO 10; PP. 76-77 (2P.)Article

EVALUATION METHODS FOR THE EXAMINATION OF THICK FILM MATERIALS.COLEMAN MV.1975; RADIO ELECTRON. ENGR; G.B.; DA. 1975; VOL. 45; NO 3; PP. 121-131; BIBL. 4 REF.Article

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A CASE FOR COPPER THICK-FILM PASTE.GRIER JD.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 6; PP. 58-61; BIBL. 1 REF.Article

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AN INTEGRATED APPROACH FOR THICK-FILM TECHNOLOGYSARMA GH.1980; J. INSTIT. ELECTRON. TELECOMMUNIC. ENGRS; IND; DA. 1980; VOL. 26; NO 2; PP. 136Article

AN INTRODUCTION TO THE NAVY MANUFACTURING TECHNOLOGY PROGRAM FOR COMPUTERIZED THICK-FILM PRINTINGZARNOW DF.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 315-327; BIBL. 4 REF.Article

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THICK FILM HYBRID MICROCIRCUITS - GENERAL APPLICATIONS.WHITELAW D.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 4; PP. 335-338; (SEMICOND. TECHNOL. 1976. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1976)Conference Paper