Pascal and Francis Bibliographic Databases

Help

Search results

Your search

kw.\*:("Couche barrière")

Document Type [dt]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Publication Year[py]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Discipline (document) [di]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Language

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Author Country

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Results 1 to 25 of 1215

  • Page / 49
Export

Selection :

  • and

ETUDE DE L'INFLUENCE DES PARAMETRES D'ANODISATION SUR LA COUCHE BARRIERE DE L'OXYDE ANODIQUE DE ZIRCONIUMKHARCHENKO EH P.1979; IZVEST. VYSSH. UCHEBN. ZAVED., KHIM. KHIM. TEKHNOL.; SUN; DA. 1979; VOL. 22; NO 10; PP. 1234-1238; BIBL. 7 REF.Article

Organic photodiodes on newspaperLAMPRECHT, B; THÜNAUER, R; OSTERMANN, M et al.Physica status solidi. A. Applied research. 2005, Vol 202, Num 5, pp R50-R52, issn 0031-8965Article

Analyses Auger et XPS de l'interface de TiO/Si = Auger analysis and XPS of TiO/Si interfaceGRIGOROV, K; SPORKEN, R; RIGA, J et al.Le Vide (1995). 1996, Vol 52, Num 279, pp 121-124, issn 1266-0167Conference Paper

Préparation de plastiques renforcés de fibres synthétiques à partir de polymères à chaînes rigidesTROSTYANSKAYA, E. B; SHADCHINA, Z. M; LEBEDEVA, O. V et al.Kompozicionnye polimernye materialy. 1984, Num 21, pp 50-52Article

On the transport of point defects in passive filmsZHANG, L; MACDONALD, D. D.Electrochimica acta. 1998, Vol 43, Num 7, pp 679-691, issn 0013-4686Article

A study of failure mechanism on the electromigration structure for the copper-coral backendKAMAT, Nitin R; LIM, James Y.International workshop on thermal investigations of ICs and systems. 2003, pp 55-58, isbn 2-84813-020-2, 1Vol, 4 p.Conference Paper

Evaluation of sheet resistance and electrical linewidth measurement techniques for copper damascene interconnectSMITH, Stewart; WALTON, Anthony J; ROSS, Alan W. S et al.IEEE transactions on semiconductor manufacturing. 2002, Vol 15, Num 2, pp 214-222, issn 0894-6507Conference Paper

Improved gain and loss performance of 1.3 μm quantum dot lasers using high growth temperature GaAs spacer layerWALKER, C. L; SANDALL, I. C; SMOWTON, P. M et al.Lasers and Electro-optics Society. 2004, isbn 0-7803-8557-8, 2Vol, Vol1, 212-213Conference Paper

Investigation of barrier layers on ceramics for silicon thin film solar cellsSLAOUI, A; RUSU, M; FOSCA, A et al.sans titre. 2002, pp 90-93, isbn 0-7803-7471-1, 4 p.Conference Paper

The development of dielectric barrier discharges in gas gaps and on surfacesGIBALOV, Valentin I; PIETSCH, Gerhard J.Journal of physics. D, Applied physics (Print). 2000, Vol 33, Num 20, pp 2618-2636, issn 0022-3727Article

Thermal stability of copper interconnects fabricated by dry-etching processIGARASHI, Y; YAMANOBE, T; ITO, T et al.Thin solid films. 1995, Vol 262, Num 1-2, pp 124-128, issn 0040-6090Article

EFFECTS OF ELECTROLYTE ANIONS ON THE FORMATION OF BARRIER TYPE OXIDE FILMS OEN ALTAKAHASHI H; SAITO Y; NAGAYAMA M et al.1982; KINZOKU HYOMEN GIJUTSU; ISSN 0026-0614; JPN; DA. 1982; VOL. 33; NO 5; PP. 225-231; ABS. ENG; BIBL. 17 REF.Article

HYDROGEN EMBRITTLEMENT IN COPPER AND NICKEL PLATING. INFLUENCE AS UNDERCOATS FOR CHROMIUMPARTHASARADHY NV.1974; METAL FINISHG; U.S.A.; DA. 1974; VOL. 72; NO 8; PP. 36-41; BIBL. 18 REF.Article

EFFICACITE DES COUCHES-BARRIERES EN CUIVRE COMME PROTECTION CONTRE L'INTERACTION DU NICKEL AVEC LE BOREARABEJ BG; LEVINSKIJ YU V; ORLOV KV et al.1974; FIZ. KHIM. OBRABOT. MATER.; S.S.S.R.; DA. 1974; NO 4; PP. 122-125; BIBL. 1 REF.Article

Interfacial Reactions in Sn-Ag/Co CouplesCHEN, Sinn-Wen; CHEN, Tung-Kai; CHANG, Jui-Shen et al.Journal of electronic materials. 2014, Vol 43, Num 2, pp 636-639, issn 0361-5235, 4 p.Article

Stability of AuSn eutectic solder cap on Au socket during reflowYU, D. Q; OPPERMANN, H; KLEFF, J et al.Journal of materials science. Materials in electronics. 2009, Vol 20, Num 1, pp 55-59, issn 0957-4522, 5 p.Article

Comparison of metal-organic chemical vapour deposition TiN thin films with different process cyclesYI, Leeward; WENJIE ZHANG; JIN WU et al.Semiconductor science and technology. 2006, Vol 21, Num 3, pp 250-253, issn 0268-1242, 4 p.Article

Direct deposition of Cu\barrier stacks on dielectric/nonconductive layers using supercritical CO2KONDOH, E; HISHIKAWA, M; YANAGIHARA, M et al.IEEE international interconnect technology conference. 2004, pp 33-35, isbn 0-7803-8308-7, 1Vol, 3 p.Conference Paper

The effect of geometry in the characterization of barrier profile in vias by transmission electron microscopyCHEN, Li-Chien; LEE, Tan-Chen; HUANG, Jui-Yen et al.International Symposium on the Physical & Failure Analysis of Integrated Circuits. 2004, pp 323-325, isbn 0-7803-8454-7, 1Vol, 3 p.Conference Paper

Spin-polarized resonant tunneling in magnetic tunnel junctionsYUASA, S; NAGAHAMA, T; SUZUKI, Y et al.Science (Washington, D.C.). 2002, Vol 297, Num 5579, pp 234-237, issn 0036-8075Article

Contact hole size reducing methods by using water-soluble organic over-coating material(WASOOM) as a barrier layer toward 0.15um contact hole; resist flow technique ICHUN, Jun-Sung; BAKSHI, Shekhar; BARNETT, Stan et al.SPIE proceedings series. 2000, pp 620-626, isbn 0-8194-3617-8Conference Paper

Formation and decay mechanisms of excimer molecules in dielectric barrier dischargesADLER, F; MÜLLER, S.Journal of physics. D, Applied physics (Print). 2000, Vol 33, Num 14, pp 1705-1715, issn 0022-3727Article

Influence of the H2 and Ar on the neonBALTOG, A; RAICIU, E; MUSA, G et al.Contributions to plasma physics (1985). 2000, Vol 40, Num 5-6, pp 537-544, issn 0863-1042Article

Study on the interface of ferrite/Sendust filmLIN, J. C; CHEN, L. J; CHEN, C. J et al.Journal of magnetism and magnetic materials. 1994, Vol 133, Num 1-3, pp 508-510, issn 0304-8853Conference Paper

Oxygenated-graphene-enabled recombination barrier layer for high performance dye-sensitized solar cellSHANMUGAM, Mariyappan; DURCAN, Chris; GEDRIM, Robin Jacobs et al.Carbon (New York, NY). 2013, Vol 60, pp 523-530, issn 0008-6223, 8 p.Article

  • Page / 49