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PRECIPITATION CHIMIQUE DE L'ALLIAGE CU-PDZLATKOVSKAYA TN; DEGTYAREV MV; KITAEV GA et al.1977; IZVEST. VYSSH. UCHEBN. ZAVED., KHIM. KHIM. TEKHNOL.; S.S.S.R.; DA. 1977; VOL. 20; NO 6; PP. 946-947; BIBL. 7 REF.Article

Thermodynamic modelling of the Cu-Pd-H systemWEIMING HUANG; OPALKA, Susanne M; DA WANG et al.Calphad. 2007, Vol 31, Num 3, pp 315-329, issn 0364-5916, 15 p.Article

ANODIC DISSOLUTION, OXYGEN REDUCTION AND CORROSION OF GOLD ALLOYS = DISSOLUTION ANODIQUE, REDUCTION DE L'OXYGENE ET CORROSION DES ALLIAGES D'ORKUHN AT.1981; SURF. TECHNOL.; ISSN 0376-4583; CHE; DA. 1981; VOL. 13; NO 1; PP. 17-31; BIBL. 30 REF.Article

Electrical and mechanical properties of B2 ordered Pd-Cu-based alloysGOLIKOVA, N. N; LAPTEVSKII, A. S; SYUTKINA, V. I et al.Physics of metals and metallography. 1996, Vol 82, Num 3, pp 306-312, issn 0031-918XArticle

The atomic size effect in surface segregation = L'effet de dimension atomique dans la ségrégation de surfaceVAN LANGEVELD, A. D.Thin solid films. 1985, Vol 129, Num 1-2, pp 161-180, issn 0040-6090Article

A practical method for determining backscattering factors and matrix correction in quantitative AES analysis of binary alloys = Une méthode pratique de détermination des facteurs de rétrodiffusion et de correction de matrice dans l'analyse quantitative des alliages binaires par spectrométrie des électrons AugerSTREUBEL, P; BERNDT, H.Surface and interface analysis. 1984, Vol 6, Num 2, pp 48-55, issn 0142-2421Article

Influence de la structure et de la composition d'alliages semi-précieux sur leur comportement in vitro et in vivo = Effect of structure and composition of semi precious alloys on their behavior in vitro and in vivoCHARNAY, R; GUIRALDENQ, P; BRUGIRARD, J et al.Métaux. Corrosion industrie. 1984, Vol 59, Num 705, pp 161-171, issn 0026-1084Article

Zur Bildung palladiumreicher metallischer Glaeser in binaeren und ternaeren Systemen mit Kupfer, Silber und Gold als einer sowie mit Phosphor oder Arsen als weiterer Komponente = To the formation of palladium-rich metallic glasses in binary and ternary systems with copper, silver and gold as one with phosphorus or arsenic as a further componentELLNER, M; EL-BORAGY, M; PREDEL, B et al.Physica status solidi. A. Applied research. 1983, Vol 80, Num 2, pp 519-533, issn 0031-8965Article

ON THE BACKSCATTERING FACTOR IN QUANTITATIVE AUGER ELECTRON SPECTROSCOPY OF BINARY ALLOYSBERNDT H; STREUBEL P; MEISEL A et al.1980; CRYST. RES. TECH.; DDR; DA. 1980-12; VOL. 15; NO 12; PP. 1433-1438; BIBL. 14 REF.Article

EXPERIMENTELLE BESTIMMUNG DER INTEGRALEN MISCHUNGSENTHALPIEN IN DEN BINAEREN SYSTEMEN PD-CU UND SI-CU BEI 1600 K = EXPERIMENTAL DETERMINATION OF THE INTEGRAL MIXING ENTHALPIES IN THE BINARY PD-CU AND SI-CU SYSTEMS AT 1600 KARPSHOFEN I; GERLING U; SOMMER F et al.1981; Z. METALLKD.; DEU; DA. 1981-12; VOL. 72; NO 12; PP. 842-846; BIBL. 16 REF.Article

Electrical resistivity of ten selected binary alloy systems = Résistivité électrique de dix systèmes d'alliages binaires sélectionnésHO, C. Y; ACKERMAN, M. W; WU, K. Y et al.Journal of physical and chemical reference data. 1983, Vol 12, Num 2, pp 183-322, issn 0047-2689Article

Electronic structure in random alloys: cooperation of structural and chemical disorders = Structure électronique dans les alliages aléatoires: coopération de désordres structuraux et chimiquesMASEK, J; KUDRNOVSKY, J.Solid state communications. 1986, Vol 58, Num 1, pp 67-70, issn 0038-1098Article

Synthesis of PVP stabilized Cu/Pd nanoparticles with citrate complexing agent and its application as an activator for electroless copper depositionLO, Sylvia H. Y; WANG, Yung-Yun; WAN, Chi-Chao et al.Journal of colloid and interface science. 2007, Vol 310, Num 1, pp 190-195, issn 0021-9797, 6 p.Article

Structure of vicinal surfaces of alloys : Cu-Pd(17%)(1 15)LE GOFF, E; ARFAOUI, I; BARBIER, L et al.Surface science. 2001, Vol 481, Num 1-3, pp 215-225, issn 0039-6028Article

The surface composition of Pd-Cu alloys: a comparative investigation of photoelectric work function measurements, Auger electron spectroscopy and calculations based on a broken bond approximation = La composition de surface des alliages Pd-Cu: une étude comparative des mesures de travail de sortie photoélectrique, de la spectroscopie électronique Auger et des calculs basés sur une approximation de liaison briséeVAN LANGEVELD, A. D; HENDRICKX, H. A. C. M; NIEUWENHUYS, B. E et al.Thin solid films. 1983, Vol 109, Num 2, pp 179-192, issn 0040-6090Article

Rapid fabrication of Cu/Pd nano/micro-particles porous-structured catalyst using hydrogen bubbles dynamic template and their enhanced catalytic performance for formic acid electrooxidationOJANI, Reza; ABKAR, Zeynab; HASHEMINEJAD, Ehteram et al.International journal of hydrogen energy. 2014, Vol 39, Num 15, pp 7788-7797, issn 0360-3199, 10 p.Article

The Y-Cu-Pd ternary system at 600°C (0-25 at.% Y): a reinvestigationKOTUR, B. Ya; MICHOR, H; BAUER, E et al.Journal of alloys and compounds. 2000, Vol 296, Num 1-2, pp 285-289, issn 0925-8388Article

Saturation of relaxation absorption in amorphous metals at very high acoustic powers = Saturation de l'absorption de relaxation dans les métaux amorphes pour des puissances acoustiques très élevéesARNOLD, W; DOUSSINEAU, P; LEVELUT, A et al.Journal de physique. Colloques. 1982, Vol 43, Num 9, pp C9.553-C9.556, issn 0449-1947Article

DETERMINATION OF THE INTEGRAL MIXING ENTHALPIES IN THE CU-PD-SI LIQUID TERNARY ALLOY SYSTEM AT 1600 KARPSHOFEN I; POOL MJ; SOMMER F et al.1983; Z. METALLKD.; ISSN 0044-3093; DEU; DA. 1983-01; VOL. 74; NO 1; PP. 25-32; BIBL. 22 REF.Article

SEARCH FOR THE MOST STABLE PD-SI-CU METALLIC GLASS USING THE PHASE DIAGRAM APPROACHMASSALSKI TB; KIM YW; VASSAMILLET LF et al.1981; MATER. SCI. ENG.; NLD; DA. 1981-01; VOL. 47; NO 1; PP. P1-P11; BIBL. 10 REF.Article

USE OF FORMIC ACID TO OBTAIN COATINGS ON DIELECTRIC MATERIALSFOFANOV GM; SOSNITSKIJ VN; DASHKO LN et al.1981; Z. PRIKL. HIM.; ISSN 0044-4618; SUN; DA. 1981; VOL. 54; NO 8; PP. 1871-1873; BIBL. 12 REF.Article

Binary and ternary amorphous palladium alloys. Characterization, activity and selectivity in hydrogenation of dienesVARGA, M; MULAS, G; COCCO, G et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2001, Vol 304-06, pp 462-466, issn 0921-5093Conference Paper

Nanometre fcc clusters versus bulk bcc alloy : the structure of Cu-Pd catalystsSHAH, V; LIQIU YANG.Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties. 1999, Vol 79, Num 8, pp 2025-2049, issn 1364-2804Article

Properties of PdCu(110) single crystal alloy surfaces : temperature-induced processes in the surface microstructureLOBODA-CACKOVIC, J.Vacuum. 1996, Vol 47, Num 12, pp 1405-1411, issn 0042-207XArticle

Infrared and EXAFS study of compositional effects in nanoscale colloidal palladium-copper alloysBRADLEY, J. S; VIA, G. H; BONNEVIOT, L et al.Chemistry of materials. 1996, Vol 8, Num 8, pp 1895-1903, issn 0897-4756Article

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