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Bead-based single protein micro-array realized through electrostatic self-assembly of carboxylated beadsSIVAGNANAM, Venkataragavalu; SAYAH, Abdeljalil; GIJS, Martin A. M et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 1355-1358, issn 0167-9317, 4 p.Conference Paper

Directed self-assembly of block copolymers for next generation nanolithographyJEONG, Seong-Jun; JU YOUNG KIM; BONG HOON KIM et al.Materials today (Kidlington). 2013, Vol 16, Num 12, pp 468-476, issn 1369-7021, 9 p.Article

Mechanism and prevention of lift-off in lead-free solderingSUGANUMA, Katsuaki.SPIE proceedings series. 2000, pp 303-307, isbn 0-930815-62-9Conference Paper

Nanoimprint and micro-contact printing tri-layer processesCHEN, Y; LEBIB, A; LI, S et al.EPJ. Applied physics (Print). 2000, Vol 12, Num 3, pp 223-229, issn 1286-0042Article

Photonic crystal structures on nonflat surfaces fabricated by dry lift-off soft UV nanoimprint lithographyTANGYOU SUN; ZHIMOU XU; HAIFENG XU et al.Journal of micromechanics and microengineering (Print). 2013, Vol 23, Num 12, issn 0960-1317, 125002.1-125002.7Article

Novel Approaches to Realizing Chemical Lift-off of GaN Epilayer from Sapphire SubstrateHORNG, Ray-Hua; TSAI, Tsung-Yen; YEN, Cheng-Ying et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7954, issn 0277-786X, isbn 978-0-8194-8491-8, 795417.1-795417.8Conference Paper

Sintering and reorganization of electrochemically etched mesoporous germanium layers in various atmospheresGARRALAGA ROJAS, E; HENSEN, J; BAUR, C et al.Solar energy materials and solar cells. 2011, Vol 95, Num 1, pp 292-295, issn 0927-0248, 4 p.Conference Paper

New method to determine process window considering pattern failureYANG, Seung-Hune; MOON, Seongho; SER, Junghoon et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7823, issn 0277-786X, isbn 978-0-8194-8337-9, 78230H.1-78230H.7, 2Conference Paper

Stress-induced large-area lift-off of crystalline Si films : Transparent conducting oxides (TCO)DROSS, F; ROBBELEIN, J; VANDEVELDE, B et al.Applied physics. A, Materials science & processing (Print). 2007, Vol 89, Num 1, pp 149-152, issn 0947-8396, 4 p.Article

Metal lift-off using physical vapour depositionO'SULLIVAN, J; BURGESS, S; RIMMER, N et al.Microelectronic engineering. 2002, Vol 64, Num 1-4, pp 473-478, issn 0167-9317Conference Paper

Silicon IC process compatible thin metal film post-processing moduleWIJNGAARDS, D; BARTEK, M; WOLFFENBUTTEL, R. F et al.Sensors and actuators. A, Physical. 1998, Vol 68, Num 1-3, pp 419-428, issn 0924-4247Conference Paper

Detection of toxic gases using a composite of single-walled carbon nanotubes with polyanilineRAN YOO; HYANG HEE CHOI; SEUNG HYUN LEE et al.International journal of nanotechnology. 2013, Vol 10, Num 8-9, pp 749-755, issn 1475-7435, 7 p.Article

Multispectral Plasmon Induced Transparency in Coupled Meta-AtomsTARTAR, Alp; YANIK, Ahmet A; ALTUG, Hatice et al.Nano letters (Print). 2011, Vol 11, Num 4, pp 1685-1689, issn 1530-6984, 5 p.Article

Patterning of Bi2Sr2CaCu2O8+x and SrTiO3 films using lift- off technique combined with MODKAWATA, T; IWASAKI, H; YUFUNE, S et al.Physica. C. Superconductivity. 2006, Vol 445-48, pp 873-875, issn 0921-4534, 3 p.Conference Paper

Issues on nanoimprint lithography with a single-layer resist structureJUNG, G. Y; WU, W; TONG, W. M et al.Applied physics. A, Materials science & processing (Print). 2005, Vol 81, Num 7, pp 1331-1335, issn 0947-8396, 5 p.Article

New developments in soft lithographyBREHMER, Martin; CONRAD, Lars; FUNK, Lutz et al.Journal of dispersion science and technology. 2003, Vol 24, Num 3-4, pp 291-304, issn 0193-2691, 14 p.Conference Paper

Chemical nano-patterning using hot embossing lithographySCHIFT, H; HEYDERMAN, L. J; PADESTE, C et al.Microelectronic engineering. 2002, Vol 61-62, pp 423-428, issn 0167-9317Conference Paper

A Raman scattering study of GaAs : As films lifted off GaAs substrateJIANG, D.-S; LI, X.-P; SUN, B.-Q et al.Journal of physics. D, Applied physics (Print). 1999, Vol 32, Num 6, pp 629-631, issn 0022-3727Article

Effects of lift-off procedures on mechanical and chemical properties of photoresistsIMBER, N; HERSHCOVITZ, M; ASHUR, A et al.Microelectronics international. 1997, Vol 42, Num JAN, pp 14-15, issn 1356-5362, 19 [3 p.]Article

Thin-film multimaterial optoelectronic integrated circuitsJOKERST, N. M; BROOKE, M. A; VENDIER, O et al.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1996, Vol 19, Num 1, pp 97-106, issn 1070-9894Conference Paper

Micropatterning and transferring of polymeric semiconductor thin films by hot lift-off and polymer bonding lithography in fabrication of organic field effect transistors (OFETs) on flexible substrateXINHONG YU; ZHE WANG; SUNYANG YU et al.Applied surface science. 2011, Vol 257, Num 22, pp 9264-9268, issn 0169-4332, 5 p.Article

Determination of the band-gap of MgS and MgS-rich Zn1-xMgxSySe1-y alloys from optical transmission measurementsDAVIDSON, Ian A; MOUG, Richard T; IZDEBSKI, Frauke et al.Physica status solidi. B. Basic research. 2010, Vol 247, Num 6, pp 1396-1398, issn 0370-1972, 3 p.Article

Biomimetic Nanowire Coatings for Next Generation Adhesive Drug Delivery SystemsFISCHER, Kathleen E; ALEMAN, Benjamin J; TAO, Sarah L et al.Nano letters (Print). 2009, Vol 9, Num 2, pp 716-720, issn 1530-6984, 5 p.Article

Three-dimensional integration of heterogeneous silicon micro-structures by liftoff and stamping transferONOE, Hiroaki; IWASE, Eiji; MATSUMOTO, Kiyoshi et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 9, pp 1818-1827, issn 0960-1317, 10 p.Article

Improvement in breakdown voltage characteristics of SiC Schottky barrier diode by incorporating a guard ring-assisted field limiting ring and an internal ringKIM, Seong-Jin; KIM, Shin; YU, Soon-Jae et al.Physica status solidi. A, Applications and materials science (Print). 2006, Vol 203, Num 15, pp 3873-3881, issn 1862-6300, 9 p.Article

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