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Results 1 to 25 of 1339

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Fabrication of Ni-P/palygorskite core-shell linear powder via electroless depositionSUMIN ZHOU; LI WANG; SHIMING SHEN et al.Applied surface science. 2011, Vol 257, Num 23, pp 10211-10217, issn 0169-4332, 7 p.Article

Electroless nickel/gold plating on copper based semiconductorsSTRANDJORD, Andrew J. G; POPELAR, Scott F; ERICKSON, Curt A et al.SPIE proceedings series. 2000, pp 196-201, isbn 0-930815-62-9Conference Paper

A novel method of reducing agent contacting pattern for metal ceramic composite membrane fabricationAGARWAL, Amrita; PUJARI, Murali; UPPALURI, Ramgopal et al.Applied surface science. 2014, Vol 320, pp 52-59, issn 0169-4332, 8 p.Article

Development and evaluation of electroless ag-PTFE composite coatings with anti-microbial and anti-corrosion propertiesZHAO, Q; LIU, Y; WANG, C et al.Applied surface science. 2005, Vol 252, Num 5, pp 1620-1627, issn 0169-4332, 8 p.Article

Photography as a metal plating processWRIGHT, M.Journal of imaging technology. 1986, Vol 12, Num 6, pp 323-324, issn 0747-3583Article

Environment-friendly Pd free surface activation technics for ABS surfaceZENGNIAN SHU; XU WANG.Applied surface science. 2012, Vol 258, Num 14, pp 5328-5331, issn 0169-4332, 4 p.Article

Investigation of the substrate activation mechanism and electroless Ni-P coating ductility and adhesionKHOPERIA, T. N.Microelectronic engineering. 2003, Vol 69, Num 2-4, pp 391-398, issn 0167-9317, 8 p.Conference Paper

Deposition, characterization and electrochemical evaluation of Ni-P-nano diamond composite coatingsMAZAHERI, Hamed; REZA ALLAHKARAM, Saeed.Applied surface science. 2012, Vol 258, Num 10, pp 4574-4580, issn 0169-4332, 7 p.Article

Optical and electron beam lithography for electroless copper multilevel metallizationSHACHAM-DIAMAND, Y; ANGYAL, M; DEDHIA, A et al.Journal of vacuum science & technology. B. Microelectronics and nanometer structures. Processing, measurement and phenomena. 1992, Vol 10, Num 6, pp 2958-2961, issn 1071-1023Conference Paper

ELECTROLESS TERNARY ALLOYSMALLORY GO.1978; PLATING IN THE ELECTRONICS INDUSTRY SYMPOSIUM. 7/1979/SAN FRANCISCO CA; USA; WINTER PARK: AMERICAN ELECTROPLATERS' SOCIETY; DA. 1978; PP. 1-2Conference Paper

SINGLE-STEP ACTIVATION COMPOSITION TREATS NON-CATALYTIC METALLIC SUBSTRATES.1978; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1978; VOL. 18; NO 2; PP. 112Article

AUTOMATICALLY REPLENISHED ELECTROLESS COPPER.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 5; PP. 26-28Article

Facile fabrication of superhydrophobic Bi/Bi2O3 surfaces with hierarchical micro-nanostructures by electroless deposition or electrodepositionLING CAO; XIAOQING LU; FANG PU et al.Applied surface science. 2014, Vol 288, pp 558-563, issn 0169-4332, 6 p.Article

Preparation of PMMA-Ni core-shell composite particles by electroless plating on polyelectrolyte-modified PMMA beadsLIN, Kuan-Ju; WU, Hong-Mao; YU, Yi-Hsiuan et al.Applied surface science. 2013, Vol 282, pp 741-745, issn 0169-4332, 5 p.Article

Adhesion enhancement between electroless nickel and polyester fabric by a palladium-free processYINXIANG LU; LONGLONG XUE; FENG LI et al.Applied surface science. 2011, Vol 257, Num 7, pp 3135-3139, issn 0169-4332, 5 p.Article

Electroless copper plating on 3-mercaptopropyltriethoxysilane modified PET fabric challenged by ultrasonic washingYINXIANG LU.Applied surface science. 2009, Vol 255, Num 20, pp 8430-8434, issn 0169-4332, 5 p.Article

The influence of surface microchemistry in protective film formation on multi-phase magnesium alloysGRAY-MUNRO, J. E; LUAN, B; HUNTINGTON, L et al.Applied surface science. 2008, Vol 254, Num 9, pp 2871-2877, issn 0169-4332, 7 p.Article

The study of electroless deposition of nickel on graphite fibersZIYUAN SHI; XUEZHI WANG; ZHIMIN DING et al.Applied surface science. 1999, Vol 140, Num 1-2, pp 106-110, issn 0169-4332Article

Aqueous pretreatments of polyetherimide to facilitate the bonding of electrolessly deposited copperKARAS, B. R; FOUST, D. F; DUMAS, W. V et al.Journal of adhesion science and technology. 1992, Vol 6, Num 7, pp 815-828, issn 0169-4243Article

Uniformity of electroless copper depositionHONMA, H; FUJINAMI, T.Hyomen gijutsu. 1991, Vol 42, Num 7, pp 736-739, issn 0915-1869Article

Electroless copper : an alternative to formaldehydeDARKEN, J.Transactions of the Institute of Metal Finishing. 1991, Vol 69, pp 66-69, issn 0020-2967, 2Conference Paper

Dépôt métallique sur céramique par procédé électroless : applications aux membranes minéralesLegault, Fabienne; Cot, Louis.1988, 204 p.Thesis

Environmentally benign electroless nickel plating using supercritical carbon-dioxide on hydrophilically modified acrylonitrile-butadiene-styreneTENGSUWAN, Siwach; OHSHIMA, Masahiro.Applied surface science. 2014, Vol 311, pp 189-200, issn 0169-4332, 12 p.Article

Electroless plating of PVC plastic through new surface modification method applying a semi-IPN hydrogel filmWANG, Ming-Qiu; JUN YAN; DU, Shi-Guo et al.Applied surface science. 2013, Vol 277, pp 249-256, issn 0169-4332, 8 p.Article

Fabrication and microwave properties of hollow nickel spheres prepared by electroless plating and template corrosion methodGUIQIN WANG; LIFANG WANG; YULIN GAN et al.Applied surface science. 2013, Vol 276, pp 744-749, issn 0169-4332, 6 p.Article

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