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Tailoring phase and oxidation states of Cu by varying oxygen gas flow rates in rf sputter deposition for photovoltaic devicesLIM, Kyounga; PARK, Juyun; RAMSIER, Rex D et al.Applied surface science. 2012, Vol 258, Num 8, pp 4097-4099, issn 0169-4332, 3 p.Article

AUFDAMPFVERFAHREN. WO STEHT MAN IN DEN U.S.A = PROCEDE DE DEPOT EN PHASE VAPEUR. OU EN EST-ON AUX U.S.A..HOLZBOCK WG.1974; OBERFLAECHE; DTSCH.; DA. 1974; VOL. 14; NO 7; PP. 402-411 (5 P.)Article

Room temperature surface passivation of silicon for screen printed c-Si solar cells by HiTUS reactive sputter depositionKAMINSKI, P. M; BASS, K; CLAUDIO, G et al.Applied surface science. 2014, Vol 301, pp 51-55, issn 0169-4332, 5 p.Conference Paper

Improved thermoelectric performance of a film device induced by densely columnar Cu electrodeMING TAN; YUAN DENG; YANMING HAO et al.Energy (Oxford). 2014, Vol 70, pp 143-148, issn 0360-5442, 6 p.Article

Macroscopic model for columnar growth of amorphous films by sputter depositionBALES, G. S; ZANGWILL, A.Journal of vacuum science and technology. A. Vacuum, surfaces, and films. 1991, Vol 9, Num 1, pp 145-149, issn 0734-2101Article

Recollections of fifty years with splutteringSIGMUND, Peter.Thin solid films. 2012, Vol 520, Num 19, pp 6031-6049, issn 0040-6090, 19 p.Article

Superhydrophobic hierarchical surfaces fabricated by anodizing of oblique angle deposited Al―Nb alloy columnar filmsFUJII, Takashi; AOKI, Yoshitaka; HABAZAKI, Hiroki et al.Applied surface science. 2011, Vol 257, Num 19, pp 8282-8288, issn 0169-4332, 7 p.Conference Paper

CHARACTERIZATION OF SILVER COATINGS DEPOSITED FROM A HOLLOW CATHODE SOURCEAMH G; MCLEOD PS; WILLIAMS DG et al.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 663-665; BIBL. 11 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

METALIZING NONCONDUCTORS. VIII. SPUTTERINGGROSHART E.1973; METAL FINISHG; U.S.A.; DA. 1973; VOL. 11; NO 1; PP. 44-48Serial Issue

BREVET 2.132.033 (B) (7209791). A 21 MARS 1972. DISPOSITIF DE REVETEMENT DE PLAQUES DE GRANDE SURFACE EN VERRE OU AUTRES MATIERES PAR PULVERISATION CATHODIQUEsdPatent

BREVET 2.139.841 (B) (7214368). A 18 AVRIL 1972. PROCEDE DE DEPOT DE COUCHES MAGNETISABLES SUR UN SUBSTRAT PAR PULVERISATION CATHODIQUEsdPatent

VERBESSERUNG DES VERSCHLEISSVERHALTENS VON METALLISCHEN OBERFLAECHEN DURCH VAKUUMTECHNOLOGIEN = AMELIORATION DU COMPORTEMENT A L'USURE DE SURFACES METALLIQUES PAR DES TECHNOLOGIES FAISANT APPEL AU VIDEBOLLINGER H; SCHULZE D; WILLBERG R et al.1976; NEUE HUETTE; DTSCH.; DA. 1976; VOL. 21; NO 3; PP. 145-149; BIBL. 10 REF.Article

LOIS DE VARIATION EN FONCTION DE LA TEMPERATURE DE LA COMPOSANTE IONIQUE DE LA PULVERISATION CATHODIQUE DES METAUX REFRACTAIRES DANS UNE ATMOSPHERE D'OXYGENEADYLOV AA; VEKSLER VI; REZNIK AM et al.1975; IZVEST. AKAD. NAUK NZ. S.S.R., FIZ.-MAT. NAUK; S.S.S.R.; DA. 1975; VOL. 19; NO 2; PP. 81-83; BIBL. 5 REF.Article

INVESTIGATION OF HOLLOW CATHODE EFFECTS ON THE STRUCTURE OF BULK FILMSSTOWELL WR; CHAMBERS D.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 653-656; BIBL. 5 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

BREVET 2.260.451 (A1) (7504327). A 12 FEVRIER 1975. PROCEDE D'ELABORATIONS D'UNE CONFIGURATION DE COUCHE SUR UN SUBSTRATsdPatent

BREVET 2.279.861 (A1) (7514548). A 9 MAI 1975. PROCEDE ET APPAREIL POUR FORMER DES REVETEMENTS PAR PULVERISATION IONIQUEsdPatent

COLUMNAR GRAINS AND TWINS IN HIGH-PURITY SPUTTER-DEPOSITED COPPERDAHLGREN SD.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 832-836; BIBL. 13 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

SPUTTERING OF RHODIUM FILMSCOX REL; HERSEE SD.1972; THIN SOLID FILMS; NETHERL.; DA. 1972; VOL. 11; NO 2; PP. 323-328; BIBL. 3 REF.Serial Issue

EFFECTS OF DEPOSITION PARAMETERS ON PROPERTIES OF RF SPUTTERED MOLYBDENUM FILMSNOWICKI RS; BUCKLEY WD; MACKINTOSH WD et al.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 4; PP. 675-679; BIBL. 14 REF.; (CONF. STRUCT. PROP. RELATIONSHIPS THICK FILMS BULK COATINGS. PROC.; SAN FRANCISCO; 1974)Conference Paper

SPUTTER COATINGS. ITS PRINCIPLES AND POTENTIALTHORNTON JA.1973; S.A.E. TRANS.; U.S.A.; DA. 1973; VOL. 82; NO 3; PP. 1787-1805; BIBL. 1 P. 1/2Article

Upgrading the Berg-model for reactive sputtering processesBERG, S; SÄRHAMMAR, E; NYBERG, T et al.Thin solid films. 2014, Vol 565, pp 186-192, issn 0040-6090, 7 p.Article

Formation of highly ordered arrays of dimples on tantalum at the nanoscaleEL-SAYED, Hany; SINGH, Sherdeep; GREINER, Mark T et al.Nano letters (Print). 2006, Vol 6, Num 12, pp 2995-2999, issn 1530-6984, 5 p.Article

Characterisation of molybdenum intermediate layers in Cu-C system with SIMS methodMAYERHOFER, K. E; SCHRANK, C; EISENMENGER-SITTNER, C et al.Applied surface science. 2005, Vol 252, Num 1, pp 266-270, issn 0169-4332, 5 p.Conference Paper

Carbon nanotubes grown from individual gas phase prepared iron catalyst particlesSCHÄFFREL, F; KRAMBERGER, C; RELLINGHAUS, B et al.Physica status solidi. A, Applications and materials science (Print). 2007, Vol 204, Num 6, pp 1786-1790, issn 1862-6300, 5 p.Conference Paper

Sputtering: the material erosion toolRAMANA MURTY, M. V.Surface science. 2002, Vol 500, Num 1-3, pp 523-544, issn 0039-6028Article

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