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Numerical analysis of the process-induced stresses in silicon microstructures : application to micromachined cantileverSENEZ, Vincent; HOFFMANN, Thomas; ARMIGLIATO, Aido et al.Smart materials and structures. 2006, Vol 15, Num 1, pp S47-S56, issn 0964-1726Article

A physical model to predict stiction ir MEMSMERLIJN VAN SPENGEN, W; PUERS, Robert; DE WOLF, Ingrid et al.Journal of micromechanics and microengineering (Print). 2002, Vol 12, Num 5, pp 702-713, issn 0960-1317Article

19th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2008)GROESENEKEN, Guido; DE WOLF, Ingrid; MOUTHAAN, Anton et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, issn 0026-2714, 508 p.Conference Proceedings

A comprehensive model to predict the charging and reliability of capacitive RF MEMS switchesMERLIJN VAN SPENGEN, W; PUERS, Robert; MERTENS, Robert et al.Journal of micromechanics and microengineering (Print). 2004, Vol 14, Num 4, pp 514-521, issn 0960-1317, 8 p.Article

Characterization and failure analysis of MEMS: High resolution optical investigation of small out-of-plane movements and fast vibrationsVAN SPENGEN, W. Merlijn; PUERS, R; MERTENS, R et al.Microsystem technologies. 2004, Vol 10, Num 2, pp 89-96, issn 0946-7076, 8 p.Article

The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnectsHSU, Yung-Yu; GONZALEZ, Mario; BOSSUYT, Frederick et al.Thin solid films. 2011, Vol 519, Num 7, pp 2225-2234, issn 0040-6090, 10 p.Article

Impact of design factors and environment on the ESD sensitivity of MEMS micromirrorsSANGAMESWARAN, Sandeep; DE COSTER, Jeroen; GROESENEKEN, Guido et al.Microelectronics and reliability. 2010, Vol 50, Num 9-11, pp 1383-1387, issn 0026-2714, 5 p.Conference Paper

The investigation of microsystems using Raman spectroscopyDE WOLF, Ingrid; CHEN JIAN; VAN SPENGEN, W. Merlijn et al.Optics and lasers in engineering. 2001, Vol 36, Num 2, pp 213-223, issn 0143-8166Article

A Systematical Method to Determine the Internal Pressure and Hermeticity of MEMS PackagesBO WANG; DE COSTER, Jeroen; SIMONE, Severi et al.Journal of microelectromechanical systems. 2014, Vol 23, Num 4, pp 862-870, issn 1057-7157, 9 p.Article

Polysilicon MEMS accelerometers exposed to shocks : numerical-experimental investigationGHISI, Aldo; KALICINSKI, Stanislaw; MARIANI, Stefano et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 3, issn 0960-1317, 035023.1-035023.12Article

A low frequency electrical test set-up for the reliability assessment of capacitive RF MEMS switchesMERLIJN VAN SPENGEN, W; PUERS, Robert; MERTENS, Robert et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 5, pp 604-612, issn 0960-1317, 9 p.Article

Raman spectroscopy as a stress sensor in packaging: Correct formulae for different sample surfacesJIAN CHEN; DE WOLF, Ingrid.Proceedings - Electronic Components Conference. 2002, pp 1310-1317, issn 0569-5503, isbn 0-7803-7430-4, 8 p.Conference Paper

Mechanical characterization of poly-SiGe layers for CMOS-MEMS integrated applicationMODLINSKI, Robert; WITVROUW, Ann; VERBIST, Agnes et al.Journal of micromechanics and microengineering (Print). 2010, Vol 20, Num 1, issn 0960-1317, 015014.1-015014.7Article

High speed, 3D optical imaging and failure analysis of high- and low-frequency movements in micro-electromechanical systems (MEMS) with nanometer resolutionVAN SPENGEN, W. Merlijn; DE WOLF, Ingrid; PUERS, Robert et al.SPIE proceedings series. 2001, pp 268-276, isbn 0-8194-4286-0Conference Paper

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structuresYU YANG; BENDER, Hugo; ARSTILA, Kai et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, pp 1517-1520, issn 0026-2714, 4 p.Conference Paper

Erythroderma with lichenoid granulomatous features induced by erythropoietinWOLF, Ingrid H; SMOLLE, J; CERRONI, L et al.Journal of cutaneous pathology. 2005, Vol 32, Num 5, pp 371-374, issn 0303-6987, 4 p.Article

Treatment of lentigo maligna (melanoma in situ) with the immune response modifier imiquimodWOLF, Ingrid H; CERRONI, Lorenzo; KODAMA, Kazuo et al.Archives of dermatology (1960). 2005, Vol 141, Num 4, pp 510-514, issn 0003-987X, 5 p.Article

Dermoscopic diagnosis of vascular lesionsWOLF, Ingrid H.Clinics in dermatology. 2002, Vol 20, Num 3, pp 273-275, issn 0738-081XArticle

Reliability challenges for barrier/liner system in high aspect ratio through silicon viasYUNLONG LI; VAN HUYLENBROECK, Stefaan; VAN BESIEN, Els et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 1949-1952, issn 0026-2714, 4 p.Conference Paper

Poly-SiGe-Based MEMS Thin-Film EncapsulationBIN GUO; BO WANG; HASPESLAGH, Luc et al.Journal of microelectromechanical systems. 2012, Vol 21, Num 1, pp 110-120, issn 1057-7157, 11 p.Article

Alpha particle radiation effects in RF MEMS capacitive switchesRUAN, J; PAPANDREOU, E; LAMHAMDI, M et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, pp 1241-1244, issn 0026-2714, 4 p.Conference Paper

An analytical model for hot carrier degradation in nanoscale CMOS suitable for the simulation of degradation in analog IC applicationsMARICAU, E; DE WIT, P; GIELEN, G et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, pp 1576-1580, issn 0026-2714, 5 p.Conference Paper

Analysis of traps effect on AlGaN/GaN HEMT by luminescence techniquesBOUYA, M; MALBERT, N; LABAT, N et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, pp 1366-1369, issn 0026-2714, 4 p.Conference Paper

Ball grid array (BGA) solder joint intermittency real-time detectionROTH, N; WONDRAK, W; WILLIKENS, A et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, pp 1155-1160, issn 0026-2714, 6 p.Conference Paper

Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing testsEL BROUJI, H; BRIAT, O; VINASSA, J.-M et al.Microelectronics and reliability. 2008, Vol 48, Num 8-9, pp 1473-1478, issn 0026-2714, 6 p.Conference Paper

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