DRUCKLUFTWIRTSCHAFT = COMPRESSED-AIR ECONOMYDOMKE W.1981; GIESSEREI; DEU; DA. 1981-08-31; VOL. 68; NO 18; PP. 534-541Conference Paper

VERBESSERTES VERFAHREN ZUM STRANGGIESSEN VON ALUMINIUM. = PROCEDE AMELIORE POUR LA COULEE CONTINUE DE L'ALUMINIUMACHENBACH D; SCHWARTZ DOMKE W; GIEPEN K et al.1978; ALUMINIUM; DTSCH.; DA. 1978; VOL. 54; NO 3; PP. 189-192; ABS. ANGL. FR.; BIBL. 15 REF.Article

Oxidative structures in polyolefins: FT-IR method of quantitative determinationDOMKE, W.-D; STEINKE, H.Journal of polymer science. Polymer chemistry edition. 1986, Vol 24, Num 10, pp 2701-2705, issn 0360-6376Article

Solid-state NMR studies of relaxations in modified duroplastic low-stress materialsDOMKE, W.-D; HALMHEU, F; SCHNEIDER, S et al.Journal of applied polymer science. 1994, Vol 54, Num 1, pp 83-90, issn 0021-8995Article

HPLC Determination of the isomeric ratios of diphenylmethane diisocyanate in modified isocyanatesSCHREYER, M; DOMKE, W.-D; STINI, S et al.Journal of chromatographic science. 1989, Vol 27, Num 5, pp 262-266, issn 0021-9665Article

Elektrisch leitfähige Polymerfilme. III: Stabilität von TCNQ-Komplexen in Lösung = Films polymères électroconducteurs. III. Stabilité des complexes de TCNQ en solution = Electrically conducting polymer films. III. Stability of TCNQ-complexes in solutionFEUCHT, H.-D; DOMKE, W.-D.Die Angewandte makromolekulare Chemie. 1984, Num 126, pp 1-9, issn 0003-3146Article

An unusual case of Anisakiasis in California, U.S.AAMIN, O. M; EIDELMAN, W. S; DOMKE, W et al.Journal of the Helminthological Society of Washington. 2000, Vol 67, Num 1, pp 71-75, issn 1049-233XArticle

193nm lithography : New challenges, new worriesMCCALLUM, M; DOMKE, W.-D; BYERS, J et al.SPIE proceedings series. 1999, pp 59-65, isbn 0-8194-3221-0Conference Paper

Resist process development for sub-100-nm ion projection lithographyHIRSCHER, S; KAESMAIER, R; DOMKE, W.-D et al.Microelectronic engineering. 2001, Vol 57-58, pp 517-524, issn 0167-9317Conference Paper

Ion projection lithography below 70 nm: tool performance and resist processHIRSCHER, S; KÜMMEL, M; EDER, S et al.Microelectronic engineering. 2002, Vol 61-62, pp 301-307, issn 0167-9317Conference Paper