Effect of calcination temperature on the electrochemical behavior of ZnO-coated LiCoO₂ cathodeTING FANG; DUH, Jenq-Gong.Surface & coatings technology. 2006, Vol 201, Num 3-4, pp 1886-1893, issn 0257-8972, 8 p.Article

Application of nanocrystalline FeHfN soft magnetic films to power inductorsKUO, Yu-Ming; DUH, Jenq-Gong.Journal of magnetism and magnetic materials. 2012, Vol 324, Num 6, pp 1084-1087, issn 0304-8853, 4 p.Article

Suppressing Sn-Patch Growth in Ti/Ni(V)/Cu Under Bump Metallization with Sn-Ag-Cu Solder After Reflow and AgingWANG, Kai-Jheng; DUH, Jenq-Gong.Journal of electronic materials. 2012, Vol 41, Num 4, pp 757-762, issn 0361-5235, 6 p.Article

Influence of the nitrogen contents on the permeability characteristics and soft magnetic properties of FeHfN filmsKUO, Yu-Ming; DUH, Jenq-Gong.Applied surface science. 2011, Vol 257, Num 15, pp 6387-6390, issn 0169-4332, 4 p.Article

Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strengthHO, Cheng-Ying; DUH, Jenq-Gong.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2014, Vol 611, pp 162-169, issn 0921-5093, 8 p.Article

Effect of surfactant on electrodeposited Ni-P layer as an under bump metallizationLIN, Yung-Chi; DUH, Jenq-Gong.Journal of alloys and compounds. 2007, Vol 439, Num 1-2, pp 74-80, issn 0925-8388, 7 p.Article

Influence of Ni concentration and Ni₃Sn₄ nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloyingLEE, Hsiang-Yi; DUH, Jenq-Gong.Journal of electronic materials. 2006, Vol 35, Num 3, pp 494-503, issn 0361-5235, 10 p.Article

Correlation between microstructure evolution and mechanical strength in the Sn―3.0Ag―0.5Cu/ENEPIG solder jointTSENG, Chien-Fu; DUH, Jenq-Gong.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 580, pp 169-174, issn 0921-5093, 6 p.Article

Synthesis of entanglement structure in nanosized Li₄Ti₅O₁₂/multi-walled carbon nanotubes composite anode material for Li-ion batteries by ball-milling-assisted solid-state reactionJHAN, Yi Ruei; DUH, Jenq Gong.Journal of power sources (Print). 2012, Vol 198, pp 294-297, issn 0378-7753, 4 p.Article

High-frequency ferromagnetic properties of as-deposited FeCoZr films with uniaxial magnetic anisotropySHANDONG LI; ZUANRU YUAN; DUH, Jenq-Gong et al.Journal of physics. D, Applied physics (Print). 2008, Vol 41, Num 5, issn 0022-3727, 055004.1-055004.6Article

Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solderLIN, Yung-Chi; DUH, Jenq-Gong.Journal of electronic materials. 2006, Vol 35, Num 8, pp 1665-1671, issn 0361-5235, 7 p.Article

Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction methodHSIAO, Li-Yin; DUH, Jenq-Gong.Journal of electronic materials. 2006, Vol 35, Num 9, pp 1755-1760, issn 0361-5235, 6 p.Article

Correlation of mechanical properties and composition in tetragonal CeO₂-Y₂O₃-ZrO₂ ceramic systemLIN, Jyung-Dong; DUH, Jenq-Gong.Materials chemistry and physics. 2003, Vol 78, Num 1, pp 246-252, issn 0254-0584, 7 p.Article

Porous Li₄Ti₅O₁₂ anode material synthesized by one-step solid state method for electrochemical properties enhancementLIN, Chih-Yuan; DUH, Jenq-Gong.Journal of alloys and compounds. 2011, Vol 509, Num 8, pp 3682-3685, issn 0925-8388, 4 p.Article

Development and optimisation of FeCoHfN soft magnetic thin films with high-frequency characteristicsKUO, Cheng-Lun; SHANDONG LI; DUH, Jenq-Gong et al.Applied surface science. 2008, Vol 254, Num 22, pp 7417-7420, issn 0169-4332, 4 p.Article

Phase transformation of the phosphorus-rich layer in SnAgCu/Ni-P solder jointsLIN, Yung-Chi; DUH, Jenq-Gong.Scripta materialia. 2006, Vol 54, Num 9, pp 1661-1665, issn 1359-6462, 5 p.Article

The effect of intermetallic compound morphology on Cu diffusion in Sn-Ag and Sn-Pb solder bump on the Ni/Cu under-bump metallizationJANG, Guh-Yaw; DUH, Jenq-Gong.Journal of electronic materials. 2005, Vol 34, Num 1, pp 68-79, issn 0361-5235, 12 p.Article

Interfacial reactions and compound formation of Sn-Ag-Cu solders by mechanical alloying on electroless Ni-P/Cu under bump metallizationKAO, Szu-Tsung; DUH, Jenq-Gong.Journal of electronic materials. 2005, Vol 34, Num 8, pp 1129-1134, issn 0361-5235, 6 p.Article

Microstructure evolution in Sn-Bi and Sn-Bi-Cu solder joints under thermal agingMIAO, Hui-Wei; DUH, Jenq-Gong.Materials chemistry and physics. 2001, Vol 71, Num 3, pp 255-271, issn 0254-0584Article

Improving the impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free solder joints under high speed shear testingYU, Chi-Yang; CHEN, Wei-Yu; DUH, Jenq-Gong et al.Journal of alloys and compounds. 2014, Vol 586, pp 633-638, issn 0925-8388, 6 p.Article

Roles of Cu in Pb-free solders jointed with electroless Ni(P) platingTSENG, Chien-Fu; JILL LEE, Christine; DUH, Jenq-Gong et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 574, pp 60-67, issn 0921-5093, 8 p.Article

Cu Substrates with Different Grain SizesWANG, Jo-Mei; WANG, Kai-Jheng; DUH, Jenq-Gong et al.Journal of electronic materials. 2011, Vol 40, Num 7, pp 1549-1555, issn 0361-5235, 7 p.Article

Structural and thermal properties of LiNi_0.6-xMg_xCo_0.25Mn_0.15O₂ cathode materialsLIAO, Pei-Yun; DUH, Jenq-Gong; SHEU, Hwo-Shuenn et al.Journal of power sources. 2008, Vol 183, Num 2, pp 766-770, issn 0378-7753, 5 p.Article

Characterization technique in phase distribution during sample preparation for applications to solder joints and wire-bonding chipsCHEN, Hung-Kai; LI, Shih-Hai; DUH, Jenq-Gong et al.Journal of electronic materials. 2006, Vol 35, Num 2, pp 333-342, issn 0361-5235, 10 p.Article

Valence change by in situ XAS in surface modified LiMn₂O₄ for Li-ion batteryCHAN, Hong-Wei; DUH, Jenq-Gong; LEE, Jyh-Fu et al.Electrochemistry communications. 2006, Vol 8, Num 11, pp 1731-1736, issn 1388-2481, 6 p.Article