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Electroless nickel/gold plating on copper based semiconductorsSTRANDJORD, Andrew J. G; POPELAR, Scott F; ERICKSON, Curt A et al.SPIE proceedings series. 2000, pp 196-201, isbn 0-930815-62-9Conference Paper

Photography as a metal plating processWRIGHT, M.Journal of imaging technology. 1986, Vol 12, Num 6, pp 323-324, issn 0747-3583Article

Optical and electron beam lithography for electroless copper multilevel metallizationSHACHAM-DIAMAND, Y; ANGYAL, M; DEDHIA, A et al.Journal of vacuum science & technology. B. Microelectronics and nanometer structures. Processing, measurement and phenomena. 1992, Vol 10, Num 6, pp 2958-2961, issn 1071-1023Conference Paper

Determination of electroless kinetic : a QCM studyZOUHOU, A; VERGNES, H; DUVERNEUIL, P et al.Microelectronic engineering. 2001, Vol 56, Num 1-2, pp 177-180, issn 0167-9317Conference Paper

The effect of pre-etch solvent treatment on electroless plating of polycarbonatePRASIT SRICHAORENCHAIKIT.Plating and surface finishing. 1991, Vol 78, Num 11, pp 66-71, issn 0360-3164Article

An in-situ FTIR study on palladium displacement reaction for autocatalytic electroless copper depositionOH, Youn-Jin; CHUNG, Chan-Hwa.Proceedings - Electrochemical Society. 2003, pp 79-87, issn 0161-6374, isbn 1-56677-390-3, 9 p.Conference Paper

Metal-polymer superglue for dirty polymer surfacesNOOLANDI, J; SHI, A.-C.Macromolecular rapid communications. 1996, Vol 17, Num 7, pp 471-473, issn 1022-1336Article

The deposition and adhesion of copper films on smooth polymer surfacesEISCH, J. J; LASKOWSKI, J; BIELINSKI, J et al.Journal of materials science letters. 1995, Vol 14, Num 2, pp 146-147, issn 0261-8028Article

Laser-assisted activation and metallization of polyimidesSHAFEEV, G. A.Applied physics. A, Solids and surfaces. 1992, Vol 55, Num 4, pp 387-390, issn 0721-7250Article

Electroless deposition of gold using benzyl alcohol as reducing agentGANU, G. M.Plating and surface finishing. 1991, Vol 78, Num 8, pp 70-74, issn 0360-3164, 3 p.Article

Aqueous pretreatments of polyetherimide to facilitate the bonding of electrolessly deposited copperKARAS, B. R; FOUST, D. F; DUMAS, W. V et al.Journal of adhesion science and technology. 1992, Vol 6, Num 7, pp 815-828, issn 0169-4243Article

Uniformity of electroless copper depositionHONMA, H; FUJINAMI, T.Hyomen gijutsu. 1991, Vol 42, Num 7, pp 736-739, issn 0915-1869Article

Electroless copper : an alternative to formaldehydeDARKEN, J.Transactions of the Institute of Metal Finishing. 1991, Vol 69, pp 66-69, issn 0020-2967, 2Conference Paper

Dépôt métallique sur céramique par procédé électroless : applications aux membranes minéralesLegault, Fabienne; Cot, Louis.1988, 204 p.Thesis

Electrochemical behavior of electroless gold plating with ascorbic acid as a reducing agentKATO, M; NIIKURA, K; HOSHINO, S et al.Hyomen gijutsu. 1991, Vol 42, Num 7, pp 729-735, issn 0915-1869Article

Galvanic and bipolar cells as probes of electroless deposition: The Cu-dimethylamine borane systemPLANA, Daniela; DRYFE, Robert A. W.Electrochemistry communications. 2013, Vol 37, pp 8-10, issn 1388-2481, 3 p.Article

Effect of Ni nanoparticle distribution on hydrogen uptake in carbon nanotubesLIN, Kuan-Yu; TSAI, Wen-Ta; YANG, Tsong-Jen et al.Journal of power sources (Print). 2011, Vol 196, Num 7, pp 3389-3394, issn 0378-7753, 6 p.Conference Paper

Anode properties of Ru-coated Si thick film electrodes prepared by gas-depositionUSUI, Hiroyuki; KASHIWA, Yuta; IIDA, Takahisa et al.Journal of power sources (Print). 2010, Vol 195, Num 11, pp 3649-3654, issn 0378-7753, 6 p.Article

Facile Fabrication of Silver Nanofin Array via Electroless PlatingMIYOSHI, Kentaro; AOKI, Yoshitaka; KUNITAKE, Toyoki et al.Langmuir. 2008, Vol 24, Num 8, pp 4205-4208, issn 0743-7463, 4 p.Article

Toward effective membranes for hydrogen separation : Multichannel composite palladium membranesXIAOJUAN HU; YAN HUANG; SHILI SHU et al.Journal of power sources. 2008, Vol 181, Num 1, pp 135-139, issn 0378-7753, 5 p.Article

Three-dimensional metallized features on polymeric substrates by microcontact printingTJONG, Vinalia; LEI WU; MORAN, Peter M et al.Langmuir. 2006, Vol 22, Num 6, pp 2430-2432, issn 0743-7463, 3 p.Article

The influence of 2,2'-dipyridyl on non-formaldehyde electroless copper platingJUN LI; HAYDEN, Harley; KOHL, Paul A et al.Proceedings - Electrochemical Society. 2003, pp 99-111, issn 0161-6374, isbn 1-56677-390-3, 13 p.Conference Paper

Adhesion of electroless nickel plating on polished siliconKARMALKAR, S; MARJORIE, Roji; SUMITHRA, V. G et al.Journal of adhesion science and technology. 2002, Vol 16, Num 11, pp 1501-1507, issn 0169-4243Article

Evaluation of a printable catalyst for use in Flex-Circuit & PCB ApplicationsKURUGANTI, A; CHEN, K. S; KALU, E. E et al.Plating and surface finishing. 2001, Vol 88, Num 7, pp 60-66, issn 0360-3164Article

A new digital cellular phone using advanced high-density CIB package technologyFUJISAKI, H; TANAKA, Y; YOSHIMURA, T et al.SPIE proceedings series. 1997, pp 238-243, isbn 0-930815-50-5Conference Paper

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