Electroless copper deposition on aluminum-seeded ABS plasticsDAPENG LI; GOODWIN, Kate; YANG, Chen-Lu et al.Journal of materials science. 2008, Vol 43, Num 22, pp 7121-7131, issn 0022-2461, 11 p.Article

UHV chemical vapour deposition of silicon nanowiresSCHMIDT, Volker; SENZ, Stephan; GÖSELE, Ulrich et al.Zeitschrift für Metallkunde. 2005, Vol 96, Num 5, pp 427-428, issn 0044-3093, 2 p.Conference Paper

Nb₂O₅ coating of glass fibres applied by chemical vapour depositionDA SILVEIRA, C. B; DE OLIVEIRA, A. F; DE CAMPOS, S. D et al.Surface engineering. 2012, Vol 28, Num 1, pp 68-72, issn 0267-0844, 5 p.Article

Growth and Characterization of GaN Nanowires by NiCl₂ Assisted Chemical Vapor DepositionXIAOFENG WEI; FENG SHI.Metallurgical and materials transactions. A, Physical metallurgy and materials science. 2011, Vol 42, Num 12, pp 3838-3843, issn 1073-5623, 6 p.Article

Pulsed biased growth of hanocrystalline diamond by hot filament chemical vapour depositionJONES, A. N; AHMED, W; HASSAN, I. U et al.Surface engineering. 2004, Vol 20, Num 3, pp 181-185, issn 0267-0844, 5 p.Conference Paper

Particle Dynamics in a Chemical Vapor Deposition Reactor: A Multiscale ApproachSHARIFI, Yousef; ACHENIE, Luke.Industrial & engineering chemistry research. 2009, Vol 48, Num 13, pp 5969-5974, issn 0888-5885, 6 p.Article

The formulation of electroless nickel-phosphorus plating baths = Formulation de bains de dépôt chimique de nickel-phosphorePARKER, K.Plating and surface finishing. 1987, Vol 74, Num 2, pp 60-65, issn 0360-3164Article

Growth and characterization of electroless deposited Cu films on carbon nanofibersCORDOBA, J. M; ODEN, M.Surface & coatings technology. 2009, Vol 203, Num 22, pp 3459-3464, issn 0257-8972, 6 p.Article

Le cuivrage chimique = Copper electroless coatingDEMANDRES, G.Surfaces (Paris). 1987, Vol 26, Num 187, pp 165-169, issn 0585-9840, 3 p.Article

Reflection characteristics of electroless deposited Sn-3.5Ag for LED lead framesSE HO KEE; WON JOONG KIM; JAE PIL JUNG et al.Surface & coatings technology. 2013, Vol 235, pp 778-783, issn 0257-8972, 6 p.Article

Effect of Reaction Temperature and Catalyst Type on the Formation of Boron Nitride Nanotubes by Chemical Vapor Deposition and Measurement of Their Hydrogen Storage CapacityBURCU SANER OKAN; ZÜLEYHA ÖZLEM KOCABAS; ASLI NALBANT ERGÜN et al.Industrial & engineering chemistry research. 2012, Vol 51, Num 35, pp 11341-11347, issn 0888-5885, 7 p.Article

A study of field drain ochre deposits. I: Abiotic chemical precipitationAP DEWI, I; KELSO, W. I; JOHNSON, D. B et al.Journal of Agricultural Science. 1987, Vol 108, Num 2, pp 341-345, issn 0021-8596Article

Molecular hydrogen in electroless copper deposits = L'hydrogène moléculaire dans les dépôts chimiques de cuivreGRAEBNER, J. E; OKINAKA, Y.Journal of applied physics. 1986, Vol 60, Num 1, pp 36-39, issn 0021-8979Article

Optimization of a Chemical Vapor Deposition Process Using Sequential Experimental DesignWISSMANN, Paul J; GROVER, Martha A.Industrial & engineering chemistry research. 2010, Vol 49, Num 12, pp 5694-5701, issn 0888-5885, 8 p.Article

Controlled pore opening of Ni/Al₂O₃ using chemical vapor deposition in a fluidized bed reactorBOATENG, Kenneth A; LINJIE HU; HILL, Josephine M et al.Industrial & engineering chemistry research. 2007, Vol 46, Num 3, pp 684-690, issn 0888-5885, 7 p.Article

Effective synthesis of single-walled carbon nanotubes using Ni-MCM-41 catalytic template through chemical vapor deposition methodSOMANATHAN, Thirunavukkarasu; PANDURANGAN, Arumugam.Industrial & engineering chemistry research. 2006, Vol 45, Num 26, pp 8926-8931, issn 0888-5885, 6 p.Article

Computational analysis and optimization of a chemical vapor deposition reactor with large-scale computingSALINGER, Andrew G; PAWLOWSKI, Roger P; SHADID, John N et al.Industrial & engineering chemistry research. 2004, Vol 43, Num 16, pp 4612-4623, issn 0888-5885, 12 p.Article

Metal microdistribution in electroless copper plating = Microdistribution du métal dans le dépôt chimique de cuivreGOLOVTSHANSKAYA, R. G; KRUGLIKOV, S. S; MOROZOVA, N. A et al.Surface & coatings technology. 1986, Vol 29, Num 1, pp 73-76, issn 0257-8972Article

Hydrogenated amorphous silicon films by chemical vapor depositionCHU, T. L; CHU, S. S; ANG, S. T et al.IEEE photovoltaic specialists conference. 18. 1985, pp 1267-1270Conference Paper

Surface characterization of copper electroless deposition on atomic layer deposited palladium on iridium and tungstenKIM, Young-Soon; SHIN, Jiho; CHO, Joong-Hee et al.Surface & coatings technology. 2006, Vol 200, Num 20-21, pp 5760-5766, issn 0257-8972, 7 p.Article

CO₂ laser-induced thermal chemical vapour deposition of polymersPOLA, J.Journal of analytical and applied pyrolysis. 1994, Vol 30, Num 1, pp 73-90, issn 0165-2370Article

Inorganic fibers and microstructures directly from the vapor phaseWALLENBERGER, F. T; NORDINE, P. C; BOMAN, M et al.Composites science and technology. 1994, Vol 51, Num 2, pp 193-212, issn 0266-3538Conference Paper

Lacquer initiated electroless deposits for RFI/EMI shielding = Dépôts chimiques initiés par une laque pour la protection contre les interférences de radiofréquences et les interférences électromagnétiquesGOULD, A. J; WAKE, S. J.Transactions of the Institute of Metal Finishing. 1987, Vol 65, Num 2, pp 58-59, issn 0020-2967Article

Effects of guanidine hydrochloride on electroless copper deposition = Influence du chlorhydrate de guanidine sur le dépôt chimique du cuivreAINA HUNG.Journal of the Electrochemical Society. 1986, Vol 133, Num 7, pp 1350-1353, issn 0013-4651Article

L'évolution des dépôts chimiques = The evolution of chemical coatingsLA COURCELLE, L.Galvano organo traitements de surface. 1986, Vol 54, Num 561, pp 785-787, issn 0982-7870Article