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Accurate Formulas for the Capacitance of Tapered-Through Silicon Vias in 3-D ICsQIJUN LU; ZHANGMING ZHU; YINTANG YANG et al.IEEE microwave and wireless components letters. 2014, Vol 24, Num 5, pp 294-296, issn 1531-1309, 3 p.Article

Cluster based dynamic area-array I/O planning for flip chip technologyKISHORE KUMAR MUCHHERLA; JAI GANESH KUMAR; WANG ROVEDA, Janet M et al.Microelectronic engineering. 2014, Vol 114, pp 57-69, issn 0167-9317, 13 p.Article

Electronics Cooling System and Component Design According to the Second LawGIELEN, Ruben; BAELMANS, Martine.Journal of heat transfer. 2014, Vol 136, Num 5, issn 0022-1481, 051401.1-051401.11Article

Enumeration technique in very large-scale integration fixed-outline floorplanningHOO, Chyi-Shiang; KANESAN, Jeevan; RAMIAH, Harikrishnan et al.IET circuits, devices & systems (Print). 2014, Vol 8, Num 1, pp 47-57, issn 1751-858X, 11 p.Article

Flow shaping and thrust enhancement of sidewall bounded oscillating cantileversEASTMAN, Andrew; KIMBER, Mark L.International journal of heat and fluid flow. 2014, Vol 48, pp 35-42, issn 0142-727X, 8 p.Article

Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni―W substratesJIAXING LIANG; TINGBI LUO; ANMIN HU et al.Microelectronics and reliability. 2014, Vol 54, Num 1, pp 245-251, issn 0026-2714, 7 p.Article

Fuse-Based Field-Dispensable ESD Protection for Ultra-High-Speed ICsCHEN ZHANG; ZONGYU DONG; FEI LU et al.IEEE electron device letters. 2014, Vol 35, Num 3, pp 381-383, issn 0741-3106, 3 p.Article

Modeling and Experimental Characterization of Metal Microtextured Thermal Interface MaterialsKEMPERS, R; LYONS, A. M; ROBINSON, A. J et al.Journal of heat transfer. 2014, Vol 136, Num 1, issn 0022-1481, 011301.1-011301.11Article

Nonlocal Modeling and Swarm-Based Design of Heat SinksGEB, David; CATTON, Ivan.Journal of heat transfer. 2014, Vol 136, Num 1, issn 0022-1481, 011401.1-011401.11Article

Output-based modal control of three-dimensional pool-boiling systemsVAN GILS, R. W; SPEETJENS, M. F. M; ZWART, H. J et al.International journal of thermal sciences. 2014, Num 82, pp 34-46, issn 1290-0729, 13 p.Article

Performance Enhancement of High-Current-Injected Electrically Programmable Fuse With Compressive-Stress Nitride LayerWONG, Chang-Chien; CHANG, Sheng-Po; TU, Hwai-Fu et al.IEEE electron device letters. 2014, Vol 35, Num 3, pp 297-299, issn 0741-3106, 3 p.Article

The coupling effects of temperature, electric current and stress on the adhesion and electrical properties of COG assemblyHONG GAO; DONG ZHANG; LILAN GAO et al.Microelectronics and reliability. 2014, Vol 54, Num 8, pp 1603-1612, issn 0026-2714, 10 p.Article

Thermal analysis of dual piezoelectric fans for cooling multi-LED packagesSUFIAN, S. F; FAIRUZ, Z. M; ZUBAIR, M et al.Microelectronics and reliability. 2014, Vol 54, Num 8, pp 1534-1543, issn 0026-2714, 10 p.Article

Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperatureYONGXIN ZHU; XIAOYAN LI; RUITING GAO et al.Microelectronics and reliability. 2014, Vol 54, Num 12, pp 2922-2928, issn 0026-2714, 7 p.Article

Microstructure, electric flame-off (EFO) characteristics and tensile properties of silver-lanthanum alloy wireHSUEH, Hao-Wen; HUNG, Fei-Yi; LUI, Truan-Sheng et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2564-2569, issn 0026-2714, 6 p.Article

Study of a dipping method for flip-chip flux coatingZHANG WEI; LI JUNHUI; HAN LEI et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2479-2486, issn 0026-2714, 8 p.Article

Study of free air ball formation in Ag-8Au-3Pd alloy wire bondingRUI GUO; LIMING GAO; DALI MAO et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2550-2554, issn 0026-2714, 5 p.Article

Electromigration reliability of open TSV structuresZISSER, W. H; CERIC, H; WEINBUB, J et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 2133-2137, issn 0026-2714, 5 p.Conference Paper

Energy distribution of positive charges in high-k dielectricHATTA, S. W. M; JI, Z; ZHANG, J. F et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 2329-2333, issn 0026-2714, 5 p.Conference Paper

Microstructural Observation of Transformed Nb3Al Superconductors Using TEM and Atom Probe TomographyBANNO, Nobuya; TAKEUCHI, Takao; TSUCHIYA, Kiyosumi et al.IEEE transactions on applied superconductivity. 2014, Vol 24, Num 3, issn 1051-8223, 8000104.1-8000104.4Conference Paper

A 4.4-μW Wake-Up Receiver Using Ultrasound DataYADAV, Kshitij; KYMISSIS, Ioannis; KINGET, Peter R et al.IEEE journal of solid-state circuits. 2013, Vol 48, Num 3, pp 649-660, issn 0018-9200, 12 p.Article

A formal framework for interfacing mixed-timing systemsDAS, Shirshendu; DUGGIRALA, Parasara Sridhar; KAPOOR, Hemangee K et al.Integration (Amsterdam). 2013, Vol 46, Num 3, pp 255-264, issn 0167-9260, 10 p.Article

Adaptive error correction in Orthogonal Latin Square Codes for low-power, resilient on-chip interconnection networkSEUNG EUN LEE.Microelectronics and reliability. 2013, Vol 53, Num 3, pp 509-511, issn 0026-2714, 3 p.Article

Algorithm and Architecture Design of Bandwidth-Oriented Motion Estimation for Real-Time Mobile Video ApplicationsHSIEH, Jui-Hung; MEMBER, Student; CHANG, Tian-Sheuan et al.IEEE transactions on very large scale integration (VLSI) systems. 2013, Vol 21, Num 1, pp 33-42, issn 1063-8210, 10 p.Article

An Analytical Latency Model for Networks-on-ChipESLAMI KIASARI, Abbas; ZHONGHAI LU; JANTSCH, Axel et al.IEEE transactions on very large scale integration (VLSI) systems. 2013, Vol 21, Num 1, pp 113-123, issn 1063-8210, 11 p.Article

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