Vers une méthode de caractérisation du pouvoir propagation d'incendie des diélectriques liquides = Towards a characterization method of fire propagation power of liquid dielectricsBASTIAN, J.Revue générale de l'électricité (Paris). 1989, Num 7, pp 63-64, issn 0035-3116, 2 p.Article

ICPADM : proceedings [of the] second international conference on properties and applications of dielectric materials, Beijing, September 12-16, 1988International conference on properties and applications of dielectric materials. 2. 1988, 2Vol, XIV-779 pConference Proceedings

Vidicons sensitive in the medium infrared spectral region with phototargets based on semiconductor-insulator structuresKOVTONJUK, N. F; MISNIK, V. P; SOKOLOV, A. V et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, pp 207-217, issn 0277-786X, isbn 0-8194-5828-7, 1Vol, 11 p.Conference Paper

L'effetto di compensazione nello studio dell'inve cchiamento termico dei materiali isolanti = Compensation effect in the study of thermal ageing of insulating materialsMONTANARI, G. C.Energia Elettrica. 1990, Vol 67, Num 11, pp 485-497, issn 0013-7308, 13 p.Article

Determination of thickness and dielectric constant of coatings from capacitance measurementsGUADARRAMA-SANTANA, A; GARCIA-VALENZUELA, A.IEEE instrumentation & measurement magazine. 2007, Vol 10, Num 5, pp 26-31, issn 1094-6969, 6 p.Article

Electric Relaxational Effects Induced by Ionic Conductivity in Dielectric MaterialsSWIERGIEL, Jolanta; JADZYN, Jan.Industrial & engineering chemistry research. 2011, Vol 50, Num 21, pp 11935-11941, issn 0888-5885, 7 p.Article

Percolative model of electric breakdown in liquid dielectricsJUN QIAN; JOSHI, Ravindra P; SCHOENBACH, Karl H et al.IEEE transactions on plasma science. 2002, Vol 30, Num 5, pp 1931-1938, issn 0093-3813, 8 p., 1Article

14TH Workshop on dielectrics in microelectronics (WoDiM 2006)LOMBARDO, Salvatore.Microelectronics and reliability. 2007, Vol 47, Num 4-5, issn 0026-2714, 362 p.Conference Proceedings

Dielectrics for nanosystems : materials science, processing, reliability, and manufacturing (Honolulu HI, 3-8 October 2004)Singh, R; Iwai, H; Tummala, R.R et al.Proceedings - Electrochemical Society. 2004, issn 0161-6374, isbn 1-56677-417-9, X, 490 p, isbn 1-56677-417-9Conference Proceedings

Les matériaux diélectriques pour résonateurs hyperfréquences = Dielectric materials for microwave resonatorsMAGE, J.-C; LABEYRIE, M.Onde électrique. 1990, Vol 70, Num 5, pp 6-13, issn 0030-2430, 8 p.Conference Paper

Problèmes posés par l'analyse de matériaux isolants en spectroscopie d'électrons Auger = Problems of isolating material analysis in Auger spectroscopyJARDIN, C; RENOUD, R.Le Vide (1995). 1996, Vol 52, Num 279, pp 106-110, issn 1266-0167Conference Paper

Recent progress on the dielectric properties of dielectric resonator materials with their applications from microwave to optical frequenciesHIGUCHI, Yukio; TAMURA, Hiroshi.Journal of the European Ceramic Society. 2003, Vol 23, Num 14, pp 2683-2688, issn 0955-2219, 6 p.Conference Paper

Microwave characteristics of TiO₂-Bi₂O₃ dielectric resonatorFUKUDA, K; KITOH, R; AWAI, I et al.Japanese journal of applied physics. 1993, Vol 32, Num 10, pp 4584-4588, issn 0021-4922, 1Article

Effect of edge region on crosspolar performance of mm-wave dielectric core hornCAHILL, R.Electronics Letters. 1989, Vol 25, Num 2, pp 131-133, issn 0013-5194, 3 p.Article

Analyse électrodynamique des filtres guides d'onde diélectriquesLYAPIN, V. P; MANUILOV, M. B; SINYAVSKIJ, G. P et al.Izvestiâ vysših učebnyh zavedenij. Radiofizika. 1986, Vol 29, Num 7, pp 809-815, issn 0021-3462Article

A thin multi-ring negative liquid crystal lens enabled by high-κ dielectric materialHSU, Chao-Jui; CHAO, Paul C.-P; KAO, Yung-Yuan et al.Microsystem technologies. 2011, Vol 17, Num 5-7, pp 923-929, issn 0946-7076, 7 p.Article

Digest of literature on dielectricsTHOMPSON, J. E.IEEE transactions on electrical insulation. 1986, Vol 21, Num 5, pp 681-804, issn 0018-9367Serial Issue

Fabrication of strained Si/Strained SiGe/Strained si heterostructures on insulator by a bond and etch-back techniqueABERG, I; OLUBUVIDE, O. O; LI, J et al.IEEE international SOI conference. 2004, pp 35-36, isbn 0-7803-8497-0, 1Vol, 2 p.Conference Paper

The breakdown strength of two-layer dielectricsLEBEDEV, S. M; GEFLE, O. S; POKHOLKOV, Yu. P et al.IEE conference publication. 1999, pp 4.304.P2-4.307.P2, issn 0537-9989, isbn 0-85296-719-5Conference Paper

Perturbational torsion about a finite extension of an elastic dielectricCROITORO, E. M.Zeitschrift für angewandte Mathematik und Physik. 1987, Vol 38, Num 3, pp 450-458, issn 0044-2275Article

Conference record of the 1986 IEEE international symposium on electrical insulation, Washington DC, June 9-11 1986International symposium on electrical insulation. 1986, 354 p. 28 cmConference Proceedings

Influence of Dielectric Type on Porosity Formation on Electrical Discharge Machined SurfacesYANZHEN ZHANG; YONGHONG LIU; RENJIE JI et al.Metallurgical and materials transactions. B, Process metallurgy and materials processing science. 2012, Vol 43, Num 4, pp 946-953, issn 1073-5615, 8 p.Article

Dielectrics for nanosystems II (materials science, processing, reliability, and manufacturing)Misra, D; Iwai, H.Proceedings - Electrochemical Society. 2006, issn 0161-6374, isbn 1-56677-438-1, 1Vol, VIII-340 p, isbn 1-56677-438-1Conference Proceedings

Microstructural defects in Ba(Mg_1/3Ta_2/3)O₃ microwave dielectric materialsCHOU, Chen-Chia; TSAI, Dah-Shyang; LIN, I-Nan et al.Materials chemistry and physics. 2003, Vol 79, Num 2-3, pp 218-221, issn 0254-0584, 4 p.Conference Paper

Les PCB dans l'industrie électrique = PCB dielectrics in electrical engineeringROYER, A; FOURNIE, R.Revue générale de l'électricité (Paris). 1987, Num 8, pp 1-168, issn 0035-3116, 153 p.Article