Pascal and Francis Bibliographic Databases

Help

Search results

Your search

kw.\*:("Dispositif semiconducteur")

Document Type [dt]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Publication Year[py]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Discipline (document) [di]

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Language

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Author Country

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Origin

A-Z Z-A Frequency ↓ Frequency ↑
Export in CSV

Results 1 to 25 of 4594

  • Page / 184
Export

Selection :

  • and

Submicron trenching of semiconductor nanostructuresLEE, K. Y; SMITH, T. P; FORD, C. J. B et al.Applied physics letters. 1989, Vol 55, Num 7, pp 625-627, issn 0003-6951, 3 p.Article

Selected Papers from ISDRS 2011AKTURK, Akin; ILIADIS, Agis A.Solid-state electronics. 2012, Vol 78, issn 0038-1101, 169 p.Conference Proceedings

30 Years of accomplishments in compound semiconductor materials and devices attributable to Prof. Lester F. EastmanYODER, Max N.IEEE Lester Eastman conference on high performance devices. 2002, pp 34-39, isbn 0-7803-7478-9, 6 p.Conference Paper

Review of analytical models for the study of highly doped regions of silicon devicesCUEVAS, A; BALBUENA, M. A.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 3, pp 553-560, issn 0018-9383, 8 p.Article

Nonpolar and Semipolar Group III Nitride-Based MaterialsSPECK, J. S; CHICHIBU, S. F.MRS bulletin. 2009, Vol 34, Num 5, issn 0883-7694, [49 p.]Serial Issue

Noise in devices and circuits II (Maspalomas, 26-28 May 2004)Danneville, François; Bonani, Fabrizio; Deen, M. Jamal et al.SPIE proceedings series. 2004, isbn 0-8194-5396-X, XXXI, 588 p, isbn 0-8194-5396-XConference Proceedings

High-rare deposition of hydrogenated amorphous silicon films and devicesLUFT, W.Applied physics communications. 1988, Vol 8, Num 4, pp 239-298, issn 0277-9374Article

Three decades of our graduate research and education in compound semiconductor materials and devicesEASTMAN, Lester F.IEEE Lester Eastman conference on high performance devices. 2002, pp 4-9, isbn 0-7803-7478-9, 6 p.Conference Paper

A design model for surface-termination optimization of off-state semiconductor devicesWADDELL, J. B; MIDDLETON, J; BOARD, K et al.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 5, pp 943-953, issn 0018-9383, 11 p.Article

Analytical two-dimensional model for minority-carrier diffusion from small-geometry pn junctionSTROLLO, A. G. M; SPIRITO, P.Electronics Letters. 1989, Vol 25, Num 2, pp 130-131, issn 0013-5194, 2 p.Article

High-voltage and high-current automatic crowbarCLIFFE, R. J; BROWN, J; SMITH, I. R et al.Journal of physics. D, Applied physics (Print). 2001, Vol 34, Num 11, pp 1740-1742, issn 0022-3727Article

Design of a semiconductor thermoelectric generator for remote subsea wellheadsAUCKLAND, D. W; SHUTTLEWORTH, R; LUFF, A. C et al.IEE proceedings. Electric power applications. 1995, Vol 142, Num 2, pp 65-70, issn 1350-2352Article

L'électronique de puissance dans l'imagerie médicale = Power electronics in medical imageryLAEUFFER, J; SALESSES, J.Revue générale de l'électricité (Paris). 1992, Num 6, pp 61-67, issn 0035-3116Article

Sampling analysis in the DPM rangeWURNIK, F.Microelectronics and reliability. 1990, Vol 30, Num 1, pp 35-38, issn 0026-2714Article

Fabrication of lateral planar InP/GaInAsP heterojunction bipolar transistor by selective area epitaxial growthYOO, H.-J; HAYES, J. R; CANEAU, C et al.Electronics Letters. 1989, Vol 25, Num 3, pp 191-192, issn 0013-5194, 2 p.Article

MOS flat-band capacitance method at low temperaturesHUANG, C. -L; GILDENBLAT, G. S.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 8, pp 1434-1439, issn 0018-9383, 6 p.Article

High temperature metallisation for GaAs device processingMORGAN, D. V; THOMAS, H; ANDERSON, W. T et al.Physica status solidi. A. Applied research. 1988, Vol 110, Num 2, pp 531-536, issn 0031-8965Article

Two-dimensional device simulation progra: 2DPGAUR, S. P; HABITZ, P. A; PARK, Y.-J et al.IBM journal of research and development. 1985, Vol 29, Num 3, pp 242-251, issn 0018-8646Article

Aluminum wire for thermosonic ball bonding in semiconductor devicesGEHMAN, B. L; RITALA, K. E; ERICKSON, L. C et al.Solid state technology. 1983, Vol 26, Num 10, pp 151-158, issn 0038-111XArticle

Motorola Workshop on Computational Mterials and ElectronicsPhysica status solidi. B. Basic research. 2001, Vol 226, Num 1, pp 1-255, issn 0370-1972, 241 p.Conference Proceedings

Electron-beam-controlled high-power semiconductor switchesSHOENBACH, K. H; LAKDAWALA, V. K; STOUDT, D. C et al.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 9, pp 1793-1802, issn 0018-9383, 10 p., 1Article

MOS device modeling at 77 KSELBERHERR, S.I.E.E.E. transactions on electron devices. 1989, Vol 36, Num 8, pp 1464-1474, issn 0018-9383, 11 p.Article

Study on Bi-CMOS devices utilising SIMOX technologyMATSUMOTO, S; OHNO, T; IZUMI, K et al.Electronics Letters. 1989, Vol 25, Num 14, pp 904-905, issn 0013-5194, 2 p.Article

Commutateur de puissance dans la gamme des microsecondes ― le dynistor à enclenchement réversibleGREKHOV, I. V; GORBATYUK, A. V; KOSTINA, L. S et al.Žurnal tehničeskoj fiziki. 1983, Vol 53, Num 9, pp 1822-1826, issn 0044-4642Article

Industry-compatible applications for visible laser energy in semiconductor productionRICHARDSON, T. R; BOOGAARD, J.Solid state technology. 1982, Vol 25, Num 3, pp 102-104, issn 0038-111XArticle

  • Page / 184