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Results 1 to 25 of 1485

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On the problem of thermal heat sinks in cryogenicsVELICHKOV, I. V.Cryogenics (Guildford). 1990, Vol 30, Num 6, pp 527-529, issn 0011-2275Article

A micromachined pirani gauge with dual heat sinksCHAE, Junseok; STARK, Brian H; NAJAFI, Khalil et al.IEEE International Conference on Micro Electro Mechanical Systems. 2004, pp 532-535, isbn 0-7803-8265-X, 1Vol, 4 p.Conference Paper

Improved heat-sink design for coherent laser arraysTAVIS, M. T; GARMIRE, E. M.Electronics Letters. 1984, Vol 20, Num 17, pp 689-690, issn 0013-5194Article

Least-energy optimization of air cooled heat sinksLYENGAR, Madhusudan; BAR-COHEN, Avram.International heat transfer conference. 2002, pp 195-200, isbn 2-84299-308-X, 6 p.Conference Paper

Role of surface radiation on the functionality of thermoelectric cooler with heat sinkSARKAR, Anjan; MAHAPATRA, Swarup K.Applied thermal engineering. 2014, Vol 69, Num 1-2, pp 39-45, issn 1359-4311, 7 p.Article

Thermal management of IC's using heat sinks incorporating phase change materials (PCM), cont'dMARONGIU, Maurice J; BERHE, M. K; FALLON, G. S et al.SPIE proceedings series. 2000, pp 506-511, isbn 0-930815-62-9Conference Paper

Experimental and numerical investigation of a multi-pass branching microchannel heat sinkDEDE, Ercan M; YAN LIU.Applied thermal engineering. 2013, Vol 55, Num 1-2, pp 51-60, issn 1359-4311, 10 p.Article

Investigation on Micromachining Technologies for the Realization of LTCC Devices and SystemsHAAS, T; ZEILMANN, C; BITTNER, A et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 8066, issn 0277-786X, isbn 978-0-8194-8655-4, 80661W.1-80661W.6Conference Paper

Record CW-brightness from a single, 20% fill-factor, 1-cm laser-diode bar at 20°CCHIN, A. K; KNAPCZYK, M. T; JACOB, J. H et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7918, issn 0277-786X, isbn 978-0-8194-8455-0, 1Vol, 79180L.1-79180L.9Conference Paper

Flexible thermal management circuits bonded directly to aluminum heat sinksFRAIVILLIG, Jim.SPIE proceedings series. 2003, pp 797-800, isbn 0-8194-5189-4, 4 p.Conference Paper

Fundamental performance limits of heatsinksCOPELAND, David.THERMINIC 2000. International workshopBudapest University of Technology and Economics. 2000, isbn 2-913329-51-9, p. 157Conference Paper

Application of the FD-TD method to modelling the electromagnetic radiation from heatsinksRYAN, N. J; STONE, D. A; CHAMBERS, B et al.IEE conference publication. 1997, pp 119-124, issn 0537-9989, isbn 0-85296-695-4Conference Paper

X-ray mask fabrication using new membrane process techniquesUCHIYAMA, S; ODA, M; MATSUDA, T et al.Japanese journal of applied physics. 1997, Vol 36, Num 12B, pp 7580-7585, issn 0021-4922, 1Conference Paper

Parametric study on the performance of double-layered microchannels heat sinkWU, J. M; ZHAO, J. Y; TSENG, K. J et al.Energy conversion and management. 2014, Vol 80, pp 550-560, issn 0196-8904, 11 p.Article

A study of 3-D numerical simulation and comparison with experimental results on turbulent flow of venting flue gas using thermoelectric generator modules and plate fin heat sinkJANG, Jiin-Yuh; TSAI, Ying-Chi; WU, Chan-Wei et al.Energy (Oxford). 2013, Vol 53, pp 270-281, issn 0360-5442, 12 p.Article

The effects of heat sinks and environmental pressure on the transient thermal response of a resistance temperature detector (RTD)POST, Julian W; IMRAN, M; BHATTACHARYYA, A et al.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 62050S.1-62050S.11, issn 0277-786X, isbn 0-8194-6261-6, 1VolConference Paper

Experimental results for endwall and pin fin heat transfer coefficientsRIZZI, Massimiliano; CATION, Ivan.International heat transfer conference. 2002, pp 201-206, isbn 2-84299-308-X, 6 p.Conference Paper

Modelling of the thermal parameters of high-power linear laser-diode arrays. Two-dimensional transient modelBEZOTOSNYI, V. V; KUMYKOV, Kh. Kh.Quantum electronics (Woodbury). 1998, Vol 28, Num 3, pp 217-220, issn 1063-7818Article

Optimierung von Kühlkörpern = Optimization of heat sinksBRAUN, S; HÄUSER, H.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1997, Vol 105, Num 3, pp 125-126, issn 0944-1018Article

Heat sink numerical simulation with icepak using compact heat sink modeling techniquesMARONGUI, M. J; KUSHA, B; WATWE, A et al.SPIE proceedings series. 1997, pp 449-454, isbn 0-930815-50-5Conference Paper

Theoretical and experimental evaluation of the effect of adding a heat-bypass structure to a laser diode arrayMURATA, S; NAKADA, H; ABE, T et al.Japanese journal of applied physics. 1993, Vol 32, Num 3A, pp 1112-1119, issn 0021-4922, 1Article

Experimental and numerical investigation of a hybrid PCM―air heat sinkKOZAK, Yoram; ABRAMZON, Boris; ZISKIND, Gennady et al.Applied thermal engineering. 2013, Vol 59, Num 1-2, pp 142-152, issn 1359-4311, 11 p.Article

Investigation on meniscus shape and flow characteristics in open rectangular microgrooves heat sinks with micro-PIVDONG YU; XUEGONG HU; CHAOHONG GUO et al.Applied thermal engineering. 2013, Vol 61, Num 2, pp 716-727, issn 1359-4311, 12 p.Article

Reliability of High Performance 9xx-nm Single Emitter Diode LasersLING BAO; JUN WANG; DARNING LI et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7583, issn 0277-786X, isbn 978-0-8194-7979-2 0-8194-7979-9, 1Vol, 758302.1-758302.10Conference Paper

Reliability of High-Power QCW ArraysFEELER, Ryan; JUNGHANS, Jeremy; REMLEY, Jennifer et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7583, issn 0277-786X, isbn 978-0-8194-7979-2 0-8194-7979-9, 1Vol, 758304.1-758304.7Conference Paper

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