Dependence of creep characteristics on temperature and applied stress in Zn-1.0 wt.% Cu during transformationEL-DALY, A. A.Czechoslovak journal of physics. 1992, Vol 42, Num 10, pp 1039-1045, issn 0011-4626Article

Tensile properties of Pb-Sn bearing alloy containing small amount of SbEL-DALY, A. A.Physica status solidi. A. Applied research. 2004, Vol 201, Num 9, pp 2035-2041, issn 0031-8965, 7 p.Article

Effect of zinc-addition and temperature on the work-hardening characteristics of pb-sn eutectic alloyEL-DALY, A. A; ABDEL-DAIEM, A. M.Physica status solidi. A. Applied research. 2003, Vol 198, Num 1, pp 56-64, issn 0031-8965, 9 p.Article

Development of high strength Sn-0.7Cu solders with the addition of small amount of Ag and InEL-DALY, A. A; HAMMAD, A. E.Journal of alloys and compounds. 2011, Vol 509, Num 34, pp 8554-8560, issn 0925-8388, 7 p.Article

Effect of isothermal ageing on the electrical resistivity and microstructure of Pb-Sn-Zn ternary alloysEL-DALY, A. A; ABDEL-DAIEM, A. M; YOUSF, M et al.Materials chemistry and physics. 2003, Vol 78, Num 1, pp 73-80, issn 0254-0584, 8 p.Article

Creep deformation of Pb-Sn-Zn ternary alloysEL-DALY, A. A; ABDEL-DAIEM, A. M; YOUSF, M et al.Materials chemistry and physics. 2002, Vol 74, Num 1, pp 43-51, issn 0254-0584Article

Properties enhancement of low Ag-content Sn-Ag-Cu lead-free solders containing small amount of ZnEL-DALY, A. A; HAMMAD, A. E; AL-GANAINY, G. S et al.Journal of alloys and compounds. 2014, Vol 614, pp 20-28, issn 0925-8388, 9 p.Article

Synthesis of Al/SiC nanocomposite and evaluation of its mechanical properties using pulse echo overlap methodEL-DALY, A. A; ABDELHAMEED, M; HASHISH, M et al.Journal of alloys and compounds. 2012, Vol 542, pp 51-58, issn 0925-8388, 8 p.Article

Fabrication of silicon carbide reinforced aluminum matrix nanocomposites and characterization of its mechanical properties using non-destructive techniqueEL-DALY, A. A; ABDELHAMEED, M; HASHISH, M et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2013, Vol 559, pp 384-393, issn 0921-5093, 10 p.Article

Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and CuEL-DALY, A. A; MOHAMAD, A. Z; FAWZY, A et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2011, Vol 528, Num 3, pp 1055-1062, issn 0921-5093, 8 p.Article

Microstructural evolution and tensile properties of Sn-5Sb solder alloy containing small amount of Ag and CuEL-DALY, A. A; FAWZY, A; MOHAMAD, A. Z et al.Journal of alloys and compounds. 2011, Vol 509, Num 13, pp 4574-4582, issn 0925-8388, 9 p.Article

Temperature dependence of electrical resistivity and microsctructure of Pb-Cd alloysSAKR, M. S; MOHAMED, A. Z; EL-DALY, A. A et al.Journal of materials science. 1992, Vol 27, Num 4, pp 1008-1010, issn 0022-2461Article

Thermal analysis and mechanical properties of Sn―1.0Ag―0.5Cu solder alloy after modification with SiC nano-sized particlesEL-DALY, A. A; FAWZY, A; MANSOUR, S. F et al.Journal of materials science. Materials in electronics. 2013, Vol 24, Num 8, pp 2976-2988, issn 0957-4522, 13 p.Article

Structural and elastic properties of eutectic Sn-Cu lead-free solder alloy containing small amount of Ag and InEL-DALY, A. A; EL-TANTAWY, Farid; HAMMAD, A. E et al.Journal of alloys and compounds. 2011, Vol 509, Num 26, pp 7238-7246, issn 0925-8388, 9 p.Article