ACHIEVING DESIGN OBJECTIVES WITH A SYSTEMS APPROACH TO TERMINATIONSLAWRENCE R.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 1; PP. 62-64Article

A VLSI BIPOLAR METALLIZATION DESIGN WITH THREE-LEVEL WIRING AND AREA ARRAY SOLDER CONNECTIONSFRIED LJ; HAVAS J; LECHATON JS et al.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 3; PP. 362-371; BIBL. 46 REF.Article

COST-EFFECTIVE USE OF BERYLLIUM COPPER ALLOYSLORENZ C; WELLMAN B.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 19-22Article

METHODS FOR ECONOMICAL PCB INTERCONNECTIONSBOOTH C.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 9; PP. 59Article

HIGH-DENSITY BOARD FABRICATION TECHNIQUESBUPP JR; CHELLIS LN; RUANE RE et al.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 3; PP. 306-317; BIBL. 7 REF.Article

SECURING WIRE-WRAPPABLE PINS TO PCB'SGRAHAM D; WILKES R; ZORNS J et al.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 5; PP. 23Article

BENEFITS OF PREFORMING COMPONENT LEADSRAHN A.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 3; PP. 45-47Article

DIRECT MOUNTING OF CHIP CARRIERS ON PRINTED WIRING BOARDITOH M; SAKAI Y; MIWA M et al.1982; NEC RES. DEV.; ISSN 0048-0436; JPN; DA. 1982; NO 65; PP. 33-38; BIBL. 3 REF.Article

INSULATION/CIRCUITS DESK MANUAL1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 7; 408 P.Article

AN UPDATE ON IDC FLAT CABLE CONNECTOR SYSTEMSVENALECK HJ.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 6; PP. 19-22Article

INFLUENCE ON LSI PACKAGE WIREABILITY OF VIA AVAILABILITY AND WIRING TRACK ACCESSIBILITYKOCH JH III; MIKHALL WF; HELLER WR et al.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 3; PP. 328-341; BIBL. 15 REF.Article

OPTIMIZATION OF INDIUM-LEAD ALLOYS FOR CONTROLLED COLLAPSE CHIP CONNECTION APPLICATIONHOWARD RT.1982; IBM J. RES. DEVELOP.; ISSN 0018-8646; USA; DA. 1982; VOL. 26; NO 3; PP. 372-378; BIBL. 25 REF.Article

ULTRASONIC ALUMINUM WIRE BONDING TO COPPER CONDUCTORSPITT VA; NEEDES CRS; JOHNSON RW et al.1981; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1981; VOL. 27; NO 12; PP. 51-55; BIBL. 3 REF.Article

EDDY CURRENTS IN STRUCTURE SURROUNDING LARGE CURRENT BUSHINGS OF A LARGE CAPACITY TRANSFORMERSAITO S; INAGAKI K; SATO T et al.1981; IEEE TRANS. POWER APPAR. SYST.; ISSN 0018-9510; USA; DA. 1981; VOL. 100; NO 11; PP. 4502-4509; BIBL. 8 REF.Article

ANWENDUNG EINES LINIENSUCHALGORITHMUS BEIM ENTWURF DER TRASSIERUNG ELEKTRONISCHER FUNKTIONSBLOECKE = EMPLOI D'UN ALGORITHME DE RECHERCHE DE LIGNES DANS LE TRACE DES CONNEXIONS DE BLOCS FONCTIONNELS ELECTRONIQUES LORS DE LEUR CONCEPTIONKIENAST W; BURKHARDT W.1982; NACHRICHTENTECH., ELEKTRON.; ISSN 0323-4657; DDR; DA. 1982; VOL. 32; NO 3; PP. 121-123; BIBL. 7 REF.Article

AUTOMATED UNIT TERMINATES VARIOUS IDC'S TO FLAT RIBBON CABLECASDEN R.1982; INSUL., CIRCUITS; ISSN 0020-4544; USA; DA. 1982; VOL. 28; NO 9; PP. 19Article

CARRIER-FREQUENCY PROPAGATION IN CROSSBONDED CABLE SYSTEMSINDULKAR CS.1981; IEEE TRANS. POWER APPAR. SYST.; ISSN 0018-9510; USA; DA. 1981; VOL. 100; NO 5; PP. 2197-2203; BIBL. 7 REF.Article

MANUFACTORING STEPS IN THE PRODUCTION OF PORCELAIN-ENAMEL PC BOARDSONYSHKEVYCH LS; TSIEN WH; HITCH TT et al.1981; RCA REV.; ISSN 0033-6831; USA; DA. 1981; VOL. 42; NO 2; PP. 145-158; BIBL. 9 REF.Article

CABLE TERMINATIONS FOR FORCE-COOLED HIGH-VOLTAGE PIPE-TYPE CABLE SYSTEMSSELSING J; NICHOLAS JH; GEAR RB et al.1982; IEEE TRANS. POWER APPAR. SYST.; ISSN 0018-9510; USA; DA. 1982; VOL. 101; NO 2; PP. 499-508; BIBL. 7 REF.Article

FABRICATION OF LARGE-AREA THICK-FILM HYBRID CIRCUITS ON RCA PORCELAIN-COATED STEEL SUBSTRATESPRABHU AN; CONLON EJ; MILLER AZ et al.1981; RCA REV.; ISSN 0033-6831; USA; DA. 1981; VOL. 42; NO 2; PP. 259-280; BIBL. 1 REF.Article