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ABOVE-AMBIENT TEMPERATURE CONTROL USING A THERMOELECTRIC HEAT PUMPGOLDSMID HJ.1983; SOLID-STATE ELECTRONICS; ISSN 0038-1101; GBR; DA. 1983; VOL. 26; NO 4; PP. 365-366; BIBL. 2 REF.Article

DER EINSATZ VON ELEKTRONIK IN DER BETRIEBSLEITTECHNIK DER EISENBAHNEN = L'UTILISATION DE L'ELECTRONIQUE DANS LA TECHNIQUE DE COMMANDE DE L'EXPLOITATION FERROVIAIREBEYERSDORFF R.1982; ETR EISENBAHNTECH. RUNDSCH.; ISSN 0013-2845; DEU; DA. 1982; NO 4; PP. 237-242; ABS. ENG/FRE/SPA; BIBL. 5 REF.Article

THE ATTACHMENT OF LEADLESS ELECTRONIC COMPONENTS TO PRINTED BOARDSWASSINK RJK; VLEDDER HJ.1982; PHILIPS TECHNICAL REVIEW; ISSN 0031-7926; NLD; DA. 1982; VOL. 40; NO 11-12; PP. 342-348; BIBL. 6 REF.Article

CARACTERISTIQUES DES NOUVEAUX COMPOSANTS DE PROTECTION = CHARACTERISTICS OF NEW PROTECTION COMPONENTSBOHIN J; TRANVOUEZ JP.1982; ; FRA; DA. 1982; NT-LAB ICM/63; 15 P.; 30 CM; NOTE TECHNIQUEReport

DIE UEBERWACHUNG DER GUETEGESICHERTEN HERSTELLUNG VON BAUELEMENTEN DER ELEKTRONIK = LE CONTROLE DE LA FABRICATION AVEC ASSURANCE DE LA QUALITE DE COMPOSANTS ELECTRONIQUESTRAUGOTT P.1980; FERNMELDE PRAXIS; DEU; DA. 1980; VOL. 57; NO 12; PP. 457-464; (6 P.); BIBL. 4 REF.Article

COMPONENT INSERTION AND WIRE PROCESSING.1978; CIRCUITS MANUF.; U.S.A.; DA. 1978; VOL. 18; NO 1; PP. 54-58 (3P.)Article

SPANNUNGEN BEI GROSSEN DURCHBIEGUNGEN VON CHIP-ZWISCHENS CHICHT-TRAEGER-VERBINDUNGEN = LES CONTRAINTES DANS LE CAS DE FLEXION IMPORTANTE DES STRUCTURES CHIP/COUCHE INTERMEDIAIRE/SUPPORTMASLOV A.1978; FEINGERAETETECHNIK; DDR; DA. 1978; VOL. 27; NO 12; PP. 558-560; BIBL. 6 REF.Article

CUSTOM DESIGNED ULTRASONIC CLEANING EQUIPMENT MEETS STRINGENT CLEANLINESS REQUIREMENTS.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 117-120 (3P.)Article

FIABILITE PREDITE ET OBSERVEE POUR LES COMPOSANTS ELECTRONIQUES = PREDICTED AND OBSERVED RELIABILITY OF ELECTRONIC COMPONENTSGOARIN R.sd; FRA; DA. S.D.; NT-LAB/ICM-50; 12 P.; 30 CMReport

ELEKTRONISCHE BAUELEMENTE FUER DIE MESSTECHNIK: BETRACHTUNGEN IN ANSCHLUSS AN DIE ELECTRONICA 80 = COMPOSANTS ELECTRONIQUES POUR LES TECHNIQUES DE MESURE. REVUE DE ELECTRONICA 80POHL V.1981; TM, TECH. MESS.; ISSN 0171-8096; DEU; DA. 1981; VOL. 48; NO 2; PP. 59-65; ABS. ENGArticle

ELECTRONICS RELIABILITY: A STATE-OF-THE-ART SURVEYBLANKS HS.1980; MICROELECTRON. AND RELIABIL.; GBR; DA. 1980; VOL. 20; NO 3; PP. 219-245; BIBL. 100 REF.Article

THERMAL TRANSIENTS IN ELECTRONIC PACKAGESBULLER ML.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUGF. TECHNOL.; USA; DA. 1980; VOL. 3; NO 4; PP. 588-594; BIBL. 8 REF.Article

NOTWENDIGE UND ERREICHBARE PROZESSZUVERLAESSIGKEIT IN DER MIKROELEKTRONIK-MONTAGE = FIABILITE NECESSAIRE ET POUVANT ETRE OBTENUE DANS LES MONTAGES DE MICROELECTRONIQUEBARTSCH P.1980; FEINGERAETETECHNIK; ISSN 0014-9683; DDR; DA. 1980; VOL. 29; NO 1; PP. 3-7; ABS. RUS/ENG/FRE; BIBL. 11 REF.Article

EFFECT OF MODERN ELECTRONICS ON CORROSION TECHNOLOGY = EFFET DE L'ELECTRONIQUE MODERNE SUR LA TECHNOLOGIE DE LA CORROSIONBABOIAN R; MCBRIDE L; LANGLAIS R et al.1979; MATER. PERFORM.; ISSN 0094-1492; USA; DA. 1979; VOL. 18; NO 12; PP. 40-44; BIBL. 24 REF.Article

R.F.I. SUPPRESSION COMPONENTS: THE PRESENT POSITIONMORRISON D; TENNANT A.1979; NEW ELECTRON.; GBR; DA. 1979; VOL. 12; NO 6; PP. 28-35; (3 P.)Article

PARIS COMPOSANTS 77.1977; NEW ELECTRON.; G.B.; DA. 1977; VOL. 10; NO 8; PP. 30-40 (4P.)Article

ZUVERLAESSIGKEIT ELEKTRONISCHER BAUELEMENTE UND SCHALTUNGEN. = FIABILITE DES COMPOSANTS ELECTRONIQUES ET DES CIRCUITSNAUMANN S.1977; TECH. MESSEN A.T.M.; DTSCH.; DA. 1977; VOL. 44; NO 9; PP. 315-322; BIBL. 2 REF.Article

EVALUATION OF THE TEMPERATURES ATTAINED BY ELECTRONIC COMPONENTS DURING VARIOUS MANUAL SOLDERING OPERATIONS = EVALUATION DES TEMPERATURES ATTEINTES PAR LES COMPOSANTS ELECTRONIQUES DANS DIVERSES OPERATIONS DE SOUDAGE MANUELDUNN BD.1983; ; FRA/NLD; NOORDWIJK: ESA SCIENTIFIC END TECHNICAL PUBLICATIONS BRANCH; DA. 1983; ESA-STM/230; 42 P.; 30 CM; BIBL. 7 REF.Report

ETUDE ET CARACTERISATION DE L'ION PLATING POUR LA REALISATION INDUSTRIELLE DE COMPOSANTS ELECTRONIQUES = STUDY AND CHARACTERIZATION OF ION PLATING FOR THE INDUSTRIAL PRODUCTION OF ELECTRONIC COMPONENTSGRANDCLEMENT G; JOURDAIN P; VIEILLEDENT G et al.1982; ; FRA; DA. 1982; DGRST/80 7 0605; 71 P.; 31 CM; ACTION CONCERTEE: COMPOSANTS PASSIFSReport

EXPERIENCE PRATIQUE DE DEVERMINAGE DE COMPOSANTS ELECTRONIQUESBERGER MC.1982; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1982; VOL. 22; NO 4; PP. 671-680; ABS. ENGArticle

AFFIDABILITA DEI COMPONENTI ELETTRONICI E ANALISI GUASTI NELLE TELECOMUNICAZIONI = FIABILITE DES COMPOSANTS ELECTRONIQUES ET ANALYSE DE DEFAILLANCES DANS LES TELECOMMUNICATIONSPOLLINO E.1982; ELETTRONICA E TELECOMUNICAZIONI; ISSN 0013-6123; ITA; DA. 1982; VOL. 31; NO 5; PP. 183-197; ABS. ENG; BIBL. 41 REF.Article

MULTI-STATE HOMOGENEOUS MARKOV MODELS IN RELIABILITY ANALYSISBOBBIO A; PREMOLI A; SARACCO O et al.1980; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1980; VOL. 20; NO 6; PP. 875-880; BIBL. 17 REF.Article

PACKAGING & PRODUCTIONLYMAN J.1980; ELECTRONICS; ISSN 0013-5070; USA; DA. 1980; VOL. 53; NO 23; PP. 222-226Article

RADIATION EFFECTS, THE WHYS AND HOWSGREENBAUM JR.1979; I.E.E.E. CIRCUITS SYST. MAG.; USA; DA. 1979; VOL. 1; NO 4; PP. 11-16; BIBL. 5 REF.Article

HOW TO WAVE SOLDER DISCRETE CHIP COMPONENTSWOODGATE R.1983; ELECTRI.ONICS; ISSN 512907; USA; DA. 1983; VOL. 29; NO 6; PP. 21-22Article

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