RECIPROCATING SCREW ENCAPSULATION: THE NEW METHOD FOR PLASTIC ENCAPSULATIONFLEISCHMANN JJ.1973; INSULAT./CIRCUITS; U.S.A.; DA. 1973; VOL. 19; NO 3; PP. 35-38Serial Issue

PACKAGING THE FAST, HOT ICS1973; E.E./SYST. ENGNG TODAY; U.S.A.; DA. 1973; VOL. 32; NO 3; PP. 48-50Serial Issue

A CASE HISTORY: PROCUREMENT OF QUALITY PLASTIC ENCAPSULATED SEMICONDUCTORS.HAKIM EB.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 71-73Article

INVESTIGATION OF THE MOLECULAR PROCESSES CONTROLLING CORROSION FAILURE MECHANISMS IN PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICESLUM RM; FEINSTEIN LG.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 1; PP. 15-31; BIBL. 12 REF.Article

ENCAPSULATED FLAVOURS - THEIR APPLICATIONS AND DEVELOPMENT. = LES AROMES ENCAPSULES - LEURS MISE AU POINT ET UTILISATIONSBEDFORD JR; ASHWORTH DR.1983; FOOD (LONDON. 1979).; ISSN 0143-8441; GBR; DA. 1983; VOL. 5; NO 2; PP. 13-15; BIBL. 7 REF.; 2 PHOTO./1 TABL.Article

GEHAEUSE AUS KUNSTSTOFF ERFUELLEN INDUSTRIEANFORDERUNGEN. = LES BOITIERS DE PLASTIQUE SATISFONT AUX EXIGENCES INDUSTRIELLESFRANKOWSKI G.1978; ELEKTRONIK; DTSCH.; DA. 1978; VOL. 27; NO 4; PP. 112-114Article

THE SEALING OF METAL PACKAGES.DAWES CJ; CRAFER RC.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 64-71; BIBL. 6 REF.Conference Paper

PREMOLDED MICROCIRCUIT PACKAGES COME ON STRONG.SMITH PE.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 6; PP. 17-19Article

RELIABILITY OF PLASTIC. ENCAPSULATED DEVICES1972; IN: RELIAB. PHYS. 1972. I.E.E.E. ANNU. PROC. LAS VEGAS, 1972; NEW YORK; INST. ELECTR. ELECTRON. ENG.; DA. 1972; PP. 72-105; BIBL. DISSEM.Serial Issue

L 141.CROS A.1974; CNET-7245340; FR.; DA. 1974; PP. 1-7; H.T. 5; (RAPP. FINAL, CENT. FIABILITE)Report

THERMAL STRESS ANALYSIS OF COMPOSITE ENCAPSULANTS WITH A SPHERICAL ADHESIVE SURFACEJORDAN AS; BERKSTRESSER GW.1980; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1980; VOL. 20; NO 4; PP. 495-499; BIBL. 7 REF.Article

SELECTIVELY REMOVING PLASTICS FOR COMPONENT ANALYSISJACOBS GL; BROWN TH.1973; EVAL. ENGNG; U.S.A.; DA. 1973; VOL. 12; NO 2; PP. 6-7; BIBL. 3 REF.Serial Issue

SELECTION DU BOITIER METALLIQUE CORRECT POUR UN CIRCUIT HYBRIDELAMBERT F.1975; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1975; NO 209; SUPPL; PP. 28-31 (8 P.); MEME DOC. ANGLArticle

TOUGHENING AGENTS IMPROVE EPOXY EUCAPSULANTS.ABSHIER CS; BERRY J; MAGET HJR et al.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 11; PP. 27-29; BIBL. 4 REF.Article

DICHTIGKEITSPRUEFUNG GLASUMHUELLTER BAUELEMENTE. = LE CONTROLE D'ETANCHEITE DES CONSTITUANTS A ENVELOPPE DE VERRESCHEEL W; KURKOWSKI F; SCHRODER G et al.1976; RADIO FERNSEHEN ELEKTRON.; DTSCH.; DA. 1976; VOL. 25; NO 5; PP. 153-154; BIBL. 2 REF.Article

METALLIZED HERMETIC PLASTIC PACKAGESMARTINO RR.1973; ELECTRON. COMPON.; G.B.; DA. 1973; VOL. 14; NO 11; PP. 516Serial Issue

ENCAPSULATION SYSTEMS AND THEIR APPLICATIONS IN THE FLAVOUR INDUSTRY = LES SYSTEMES D'ENCAPSULATION ET LEURS APPLICATIONS DANS L'INDUSTRIE DES AROMESTAYLOR AH.1983; FOOD (LONDON. 1979); ISSN 0143-8441; GBR; DA. 1983; VOL. 5; NO 9; PP. 48-52; 4 P.; BIBL. 13 REF.Conference Paper

DEVELOPMENT AND EVALUATION OF EPOXY RESIN MOLDING COMPOUNDS FOR ENCAPSULATION USE.NAGAI Y; SUZUKI T; WAKABAYASHI Y et al.1975; FUJITSU SCI. TECH. J.; JAP.; DA. 1975; VOL. 11; NO 2; PP. 115-133; BIBL. 4 REF.Article

TRANSFER CIRCUITRY MODULE TECHNOLOGY.NUFER RW; PUGLIESE FG.1974; SOLID STATE TECHNOL.; U.S.A.; DA. 1974; VOL. 17; NO 10; PP. 49-72 (6P.)Article

DEVELOPMENTS LIKELY TO IMPROVE THE RELIABILITY OF PLASTIC ENCAPSULATED DEVICES.JONES RO.1978; MICROELECTRON. AND RELIABIL.; GBR; DA. 1978; VOL. 17; NO 2; PP. 273-278; BIBL. 2 REF.Article

TRANSFER MOLDING METHODS EXPAND PACKAGING TECHNIQUES.KAKEI M; IKEDA Y.1977; J. ELECTRON. ENGNG; JAP.; DA. 1977; NO 126; PP. 59-62Article

THE USE OF RELIABLE PLASTIC SEMICONDUCTORS IN MILITARY EQUIPMENT.REICH B; HAKIM EB.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 1; PP. 29-33; BIBL. 6 REF.Article

ENCAPSULATION PLASTIQUE DES TRANSISTORSOLTEANU D; PAVELESCU I.1976; ELECTROTEH. ELECTRON. AUTOMAT., AUTOMAT. ELECTRON.; ROMAN.; DA. 1976; VOL. 20; NO 1; PP. 51-53Article

SPECIFYING SPECIAL I.C. PACKAGES.RIEL M; CHALMON R.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 5; PP. 65-68 (3P.)Article

CAPACITORS USE ZENER TECHNOLOGY.1974; ELECTRONICS; U.S.A.; DA. 1974; VOL. 47; NO 14; PP. 129-135 (4P.)Article