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BOITIERS CERAMIQUE OU PLASTIQUE: QUELLE EST LEUR FIABILITE.BICKLEY J.1981; ELECTRON. IND.; FRA; DA. 1981; NO 9; PP. 37-39Article

RECIPROCATING SCREW ENCAPSULATION: THE NEW METHOD FOR PLASTIC ENCAPSULATIONFLEISCHMANN JJ.1973; INSULAT./CIRCUITS; U.S.A.; DA. 1973; VOL. 19; NO 3; PP. 35-38Serial Issue

MICROWAVE PERFORMANCE OF GLASS-CERAMIC/COPPER ENCAPSULATIONSCOLLIVER DJ.1972; ELECTRON. LETTERS; G.B.; DA. 1972; VOL. 8; NO 23; PP. 569-570; BIBL. 5 REF.Serial Issue

PACKAGING THE FAST, HOT ICS1973; E.E./SYST. ENGNG TODAY; U.S.A.; DA. 1973; VOL. 32; NO 3; PP. 48-50Serial Issue

A CASE HISTORY: PROCUREMENT OF QUALITY PLASTIC ENCAPSULATED SEMICONDUCTORS.HAKIM EB.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 9; PP. 71-73Article

INVESTIGATION OF THE MOLECULAR PROCESSES CONTROLLING CORROSION FAILURE MECHANISMS IN PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICESLUM RM; FEINSTEIN LG.1981; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1981; VOL. 21; NO 1; PP. 15-31; BIBL. 12 REF.Article

ENCAPSULATED FLAVOURS - THEIR APPLICATIONS AND DEVELOPMENT. = LES AROMES ENCAPSULES - LEURS MISE AU POINT ET UTILISATIONSBEDFORD JR; ASHWORTH DR.1983; FOOD (LONDON. 1979).; ISSN 0143-8441; GBR; DA. 1983; VOL. 5; NO 2; PP. 13-15; BIBL. 7 REF.; 2 PHOTO./1 TABL.Article

GEHAEUSE AUS KUNSTSTOFF ERFUELLEN INDUSTRIEANFORDERUNGEN. = LES BOITIERS DE PLASTIQUE SATISFONT AUX EXIGENCES INDUSTRIELLESFRANKOWSKI G.1978; ELEKTRONIK; DTSCH.; DA. 1978; VOL. 27; NO 4; PP. 112-114Article

THE SEALING OF METAL PACKAGES.DAWES CJ; CRAFER RC.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 64-71; BIBL. 6 REF.Conference Paper

PREMOLDED MICROCIRCUIT PACKAGES COME ON STRONG.SMITH PE.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 6; PP. 17-19Article

RELIABILITY OF PLASTIC. ENCAPSULATED DEVICES1972; IN: RELIAB. PHYS. 1972. I.E.E.E. ANNU. PROC. LAS VEGAS, 1972; NEW YORK; INST. ELECTR. ELECTRON. ENG.; DA. 1972; PP. 72-105; BIBL. DISSEM.Serial Issue

RELIABILITY ASPECTS OF SEMICONDUCTOR DEVICESBICKLEY J.1981; ELECTRON. ENG.; ISSN 0013-4902; GBR; DA. 1981; VOL. 5; NO 652; PP. 76-85; 6 P.; BIBL. 4 REF.Article

L 141.CROS A.1974; CNET-7245340; FR.; DA. 1974; PP. 1-7; H.T. 5; (RAPP. FINAL, CENT. FIABILITE)Report

THERMAL STRESS ANALYSIS OF COMPOSITE ENCAPSULANTS WITH A SPHERICAL ADHESIVE SURFACEJORDAN AS; BERKSTRESSER GW.1980; MICROELECTRON. RELIAB.; ISSN 0026-2714; GBR; DA. 1980; VOL. 20; NO 4; PP. 495-499; BIBL. 7 REF.Article

SELECTIVELY REMOVING PLASTICS FOR COMPONENT ANALYSISJACOBS GL; BROWN TH.1973; EVAL. ENGNG; U.S.A.; DA. 1973; VOL. 12; NO 2; PP. 6-7; BIBL. 3 REF.Serial Issue

AUTOMATION OF THE ASSEMBLY PROCESSPAGE DE; JACKSON DM.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 6; PP. 89-93Article

LOW AND MEDIUM STRENGTH PERMANENT MAGNETS BY COMPACTING OR INJECTION MOLDING PLASTIC-COATED BARIUM FERRITE.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 3; PP. 29-30Article

ETUDE DE LA FIABILITE DE CIRCUITS LSI MOS ENCAPSULES PAR ENROBAGE PLASTIQUE.BONNETON F; MORTINI P.1975; CNET-749B421; FR.; DA. 1975; PP. 1-37; H.T. 36; BIBL. 3 P. 1/2; (RAPP. FINAL, CENT. FIABILITE)Report

RELIABILITY OF PLASTIC ENCAPSULATED SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITSREICH B.1978; SOLID STATE TECHNOL.; USA; DA. 1978; VOL. 21; NO 9; PP. 82-88; BIBL. 10 REF.Article

EPOXY MOLDING COMPOUNDS FOR SEMICONDUCTOR ENCAPSULATION.REINHART J.1977; CIRCUITS MANUF.; U.S.A.; DA. 1977; VOL. 17; NO 8; PP. 29-31Article

JUST HOW RELIABLE ARE PLASTIC ENCAPSULATED SEMICONDUCTORS FOR MILITARY APPLICATIONS AND HOW CAN THE MAXIMUM RELIABILITY BE OBTAINED.TAYLOR CH.1976; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1976; VOL. 15; NO 2; PP. 131-134; BIBL. 12 REF.Article

ENCAPSULATING SMALL, HEAT-SENSITIVE COMPONENTS WITH QUICKCURE EPOXY COATING POWDERS.BOLGER JC.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 10; PP. 39-42Article

HOW TO SELECT AND EVALUATE ADHESIVE AND PATTING COMPOUND DISPENSING EQUIPMENT.HALLWORTH AM.1974; INSULAT. CIRCUITS; U.S.A.; DA. 1974; VOL. 20; NO 10; PP. 33-36Article

SELECTION DU BOITIER METALLIQUE CORRECT POUR UN CIRCUIT HYBRIDELAMBERT F.1975; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1975; NO 209; SUPPL; PP. 28-31 (8 P.); MEME DOC. ANGLArticle

TOUGHENING AGENTS IMPROVE EPOXY EUCAPSULANTS.ABSHIER CS; BERRY J; MAGET HJR et al.1977; INSULAT. CIRCUITS; U.S.A.; DA. 1977; VOL. 23; NO 11; PP. 27-29; BIBL. 4 REF.Article

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