Friction and wear behavior of electroless Ni-based CNT composite coatingsWANG, L. Y; TU, J. P; CHEN, W. X et al.Wear. 2003, Vol 254, Num 12, pp 1289-1293, issn 0043-1648, 5 p.Article

High-rate discharge characteristics of metal hydride modified by electroless nickel plating based on experimental design approachLIN, Sheng-Fian; WU, Wu-Tsan; DO, Jing-Shan et al.International journal of hydrogen energy. 2012, Vol 37, Num 3, pp 2320-2327, issn 0360-3199, 8 p.Article

Electroless nickel: Q & A = Dépôt chimique de nickel: questions et réponsesMACKAY, H. A; ZAKI, N; BAUDRAND, D. W et al.Plating and surface finishing. 1986, Vol 73, Num 7, pp 32-37, issn 0360-3164Article

High-quality copper deposited from electroless baths = Cuivre de haute qualité déposé à partir de bains chimiquesBLURTON, K. F.Plating and surface finishing. 1986, Vol 73, Num 1, pp 52-55, issn 0360-3164Article

Effect of Ni nanoparticle distribution on hydrogen uptake in carbon nanotubesLIN, Kuan-Yu; TSAI, Wen-Ta; YANG, Tsong-Jen et al.Journal of power sources (Print). 2011, Vol 196, Num 7, pp 3389-3394, issn 0378-7753, 6 p.Conference Paper

Toward effective membranes for hydrogen separation : Multichannel composite palladium membranesXIAOJUAN HU; YAN HUANG; SHILI SHU et al.Journal of power sources. 2008, Vol 181, Num 1, pp 135-139, issn 0378-7753, 5 p.Article

Controlled DNA-templated metal deposition : Towards ultra-thin nanowiresBERTI, Lorenzo; ALESSANDRINI, Andrea; MENOZZI, Claudia et al.Journal of nanoscience and nanotechnology (Print). 2006, Vol 6, Num 8, pp 2382-2385, issn 1533-4880, 4 p.Article

INFLUENCE OF ALKALI METAL IONS ON THE KINETICS OF THE INITIAL STAGE OF ELECTROCRYSTALLISATION OF METALS ONTO ALUMINIUMVASIL'EV VV; OPOLOVNIKOV VR; LUKOMSKIJ YU YA et al.1983; ELEKTROHIMIJA; ISSN 0424-8570; SUN; DA. 1983; VOL. 19; NO 7; PP. 965; BIBL. 4 REF.Article

Advantages of photoplating for laser doped solar cellsHAMEIRI, Z; MAI, L; WENHAM, S. R et al.Progress in photovoltaics (Print). 2011, Vol 19, Num 5, pp 511-516, issn 1062-7995, 6 p.Article

Template-Synthesized Copper Nanotubes via Electroless PlatingGUANGWEN XIE; XIAOLI LI; HAIXIA JIAO et al.Journal of dispersion science and technology. 2008, Vol 29, Num 1, pp 120-123, issn 0193-2691, 4 p.Article

Electroless nickel/gold plating on copper based semiconductorsSTRANDJORD, Andrew J. G; POPELAR, Scott F; ERICKSON, Curt A et al.SPIE proceedings series. 2000, pp 196-201, isbn 0-930815-62-9Conference Paper

The formulation of electroless nickel-phosphorus plating baths = Formulation de bains de dépôt chimique de nickel-phosphorePARKER, K.Plating and surface finishing. 1987, Vol 74, Num 2, pp 60-65, issn 0360-3164Article

Le nickel chimique dans l'industrie: 150 participants = Electroless nickel in industry: 150 participantsGalvano-organo (Paris). 1984, Num 547, pp 483-493, issn 0302-6477Article

Maximum rate of the cathodic reaction in electroless copper deposition = Vitesse maximale de la réaction cathodique dans le dépôt chimique de cuivreVITKAVAGE, D; PAUNOVIC, M.Plating and surface finishing. 1983, Vol 70, Num 4, pp 48-50, issn 0360-3164Article

Etude du dépôt chimique d'argentKUBOTA, A; KOURA, N.Kinzoku Hyomen Gijutsu. 1986, Vol 37, Num 3, pp 131-136, issn 0026-0614Article

Anodic oxidation of reductants in electroless plating = Oxydation anodique de réducteurs au cours du dépôt chimiqueOHNO, I; WAKABAYASHI, O; HARUYAMA, S et al.Journal of the Electrochemical Society. 1985, Vol 132, Num 10, pp 2323-2330, issn 0013-4651Article

Le cuivrage chimique = Copper electroless coatingDEMANDRES, G.Surfaces (Paris). 1987, Vol 26, Num 187, pp 165-169, issn 0585-9840, 3 p.Article

Dépôt chimique de nickel à partir d'un bain de glycineYAJIMA, S; MATSUSHITA, S; TOGAWA, Y et al.Kinzoku Hyomen Gijutsu. 1986, Vol 37, Num 5, pp 255-260, issn 0026-0614Article

Trends in electroless nickel plating = Tendances dans le revêtement chimique de nickelCOLARUOTOLO, J. F.Plating and surface finishing. 1985, Vol 72, Num 12, pp 22-25, issn 0360-3164Article

La métallisation chimique de matériaux flex-rigides = F Chemical metalisation of flex-rigid materialsELRICH, H.-J.Galvano-organo (Paris). 1983, Vol 52, Num 537, pp 722-724, issn 0302-6477Article

Properties of electroless nickel = Propriétés du nickel revêtu chimiquementTULSI, S. S.Transactions of the Institute of Metal Finishing. 1986, Vol 64, Num 2, pp 73-76, issn 0020-2967Article

Revêtement chimique d'argentKOURA, N; KUBOTA, A.Kinzoku Hyomen Gijutsu. 1985, Vol 36, Num 5, pp 182-190, issn 0026-0614Article

Kinetic analysis of electroless deposition of copper = Analyse cinétique du dépôt chimique de cuivreSCHUMACHER, R; PESEK, J. J; MELROY, O. R et al.Journal of physical chemistry (1952). 1985, Vol 89, Num 20, pp 4338-4342, issn 0022-3654Article

Nickelage chimique dans les solutions renfermant du bore à différents pHPRUSOV, YU. V; SELYAKOV, B. A.Žurnal prikladnoj himii. 1985, Vol 58, Num 12, pp 2725-2727, issn 0044-4618Article

Réalisation de couches minces métalliques par dépôt autocatalytique en milieu liquide = Electroless coating in aqueous solutionMARTIN, J. R; LAMOUCHE, D; CLECHET, P et al.Le Vide, les couches minces. 1985, Vol 40, Num 227, pp 287-290, issn 0223-4335Conference Paper