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Results 1 to 25 of 786

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Special section on recent development of electromechanical devices (Selected papers from ICEC2006)MINOWA, Isao.IEICE transactions on electronics. 2007, Vol 90, Num 7, issn 0916-8524, 197 p.Conference Proceedings

A new high-speed electromechanical shutterLYONS, P. R. A; KILPIN, D; GAI, S. L et al.Journal of physics. E. Scientific instruments. 1984, Vol 17, Num 2, pp 108-110, issn 0022-3735Article

Recent Development of Electromechanical Devices (IS-EMD2007)UMEMURA, Shigeru.IEICE transactions on electronics. 2008, Vol 91, Num 8, pp 1177-1312, issn 0916-8524, 135 p.Conference Paper

MOEM scan engine for bar code reading and factory automationMOTAMEDI, M. E; PARK, S; DENATALE, J et al.SPIE proceedings series. 1998, pp 66-80, isbn 0-8194-2715-2Conference Paper

Micro fabricated biosensors and microsystemsHESKETH, P. J; ZIVANOVIC, S; WILSON, G. S et al.International conference on microelectronic. 1997, pp 63-69, isbn 0-7803-3664-X, 2VolConference Paper

Coupling models for analyzing dynamic behaviors of electromagnetic actuatorsSRAIRI, K; BENDJIMA, B; FELIACHI, M et al.IMACS. International conference. 1996, pp 467-472, 3VolConference Paper

An all-organic composite actuator material with a high dielectric constantZHANG, Q. M; HENGFENG LI; POH, Martin et al.Nature (London). 2002, Vol 419, Num 6904, pp 284-287, issn 0028-0836Article

Miniaturized systems with micro-optics and micromechanics (San Jose CA, 10-12 February 1997)Motamedi, M. Edward; Hornbeck, Larry J; Pister, Kristofer S.J et al.SPIE proceedings series. 1997, isbn 0-8194-2419-6, VIII, 382 p, isbn 0-8194-2419-6Conference Proceedings

From simple devices to promising microsystem applicationsLERCH, P; DUBOCHET, O; RENAUD, P et al.International conference on microelectronic. 1997, pp 59-62, isbn 0-7803-3664-X, 2VolConference Paper

Aspekte der Zuverlässigkeit tribologisch beanspruchter Komponenten im elektromechanischen Gerätebau. VI = Aspects de la fiabilité des composants électromécaniques soumis à des contraintes tribologiques. VI = Reliability aspects of tribologicaly loaded electromechanical components. VIFRANEK, F.Tribologie und Schmierungstechnik. 1985, Vol 32, Num 5, pp 286-288, issn 0724-3472Article

Bandwidth analysis of a microgyroscope vibrating in two orthogonal axes on the substrate planeHONG, Y.-S; LEE, J.-H; LEE, C.-S et al.SPIE proceedings series. 1999, pp 939-947, isbn 0-8194-3154-0, 2VolConference Paper

Market oriented development and production of microdevicesEHRFELD, W; HESSEL, V; KÄMPER, K.-P et al.International conference on microelectronic. 1997, pp 71-79, isbn 0-7803-3664-X, 2VolConference Paper

Tribologisch beanspruchte Komponenten im elektromechanischen Gerätebau. I: Aspekte der Zuverlässigkeit tribologisch beanspruchter Komponenten im elektromechanischen Gerätebau = Composants soumis à des contraintes tribologiques dans la construction d'appareils électromécaniques. I. Aspects de la fiabilité de composants. I. Aspects de la fiabilité de composants soumis à des contraintes tribologiques dans la construction d'appareils électromécaniques = Components with tribological stresses in electromechanical systems. I. Reliability of components with tribological stresses in electromechanical systemsFRANEK, F.Tribologie und Schmierungstechnik. 1984, Vol 31, Num 6, pp 340-341, issn 0724-3472Article

Emerging Technology in MEMS/NEMSIEEJ transactions on electrical and electronic engineering. 2008, Vol 3, Num 3, issn 1931-4973, 109 p.Serial Issue

MOEM systems in EuropeSALOMON, P; PARRIAUX, O.SPIE proceedings series. 1997, pp 2-10, isbn 0-8194-2419-6Conference Paper

MIKROELEKTRONIK DER ZUKUNFT-EINE HERAUSFORDERUNG AN PASSIVE UND ELEKTROMECHANISCHE BAUELEMENTE = MICROELECTRONIQUE DU FUTUR. UN DEFI EN CE QUI CONCERNE LES COMPOSANTS PASSIFS ET LES COMPOSANTS ELECTROMECANIQUESWEINERTH H.1979; MESSEN U. PRUEFEN; DEU; DA. 1979; NO 11; PP. 867-870Article

LA MEMOIRE AMPEX MEGASTORE: ACCES PLUSIEURS MILLIERS DE FOIS PLUS RAPIDE QUE LES DISQUES ET TAMBOURS.1977; INTER ELECTRON.; FR.; DA. 1977; NO 245; PP. 44Article

DISPOSITIF ELECTROMECANIQUE D'ARRET POUR LA CAMERA D'UN MICROSCOPE ELECTRONIQUECHIKH VI.1977; OPT.-MEKH. PROMYSHL.; S.S.S.R.; DA. 1977; VOL. 44; NO 1; PP. 69; BIBL. 2 REF.Article

Quantifizierung der Demontagezeiten von Elektro(nik)-Altgeräten = Electronic waste: Quantification of the disassembly timeNIEWÖHNER, J; RENZ, R.Konstruktion (1981). 2003, Num 10, pp 51-54, issn 0720-5953, 4 p.Article

The amounts per cycle of polypyrrole electromechanical actuatorsSPINKS, Geoffrey M; DEZHI ZHOU; LU LIU et al.Smart materials and structures. 2003, Vol 12, Num 3, pp 468-472, issn 0964-1726, 5 p.Article

Microactuators and micromachinesFUJITA, H.Proceedings of the IEEE. 1998, Vol 86, Num 8, pp 1721-1732, issn 0018-9219Article

Testing philosophy behind the micro analysis systemKERKHOFF, H. G.SPIE proceedings series. 1999, pp 78-83, isbn 0-8194-3154-0, 2VolConference Paper

Optical microactuation in piezoceramicsTHAKOOR, S; POOSANAAS, P; MOROOKIAN, J. M et al.SPIE proceedings series. 1998, pp 376-391, isbn 0-8194-2772-1Conference Paper

Development of a low-cost X-ray mask for high-aspect ratio MEM smart structuresAJMERA, P. K; STADLER, S; ABDOLLAHI, N et al.SPIE proceedings series. 1998, pp 14-22, isbn 0-8194-2772-1Conference Paper

An optical probe for micromachine performance analysisDICKEY, F. M; HOLSWADE, S. C; SMITH, N. F et al.SPIE proceedings series. 1997, pp 52-61, isbn 0-8194-2419-6Conference Paper

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