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Universell einsetzbare mikrorechnergesteuerte Druckregelung für Vakuumanlagen in Feinvakuumbereich = Système de réglage de pression commandé par micro-ordinateur et utilisable universellement, pour des installations à vide = Pressure adjustment system controlled by microcomputer and used in vacuum installationsHÜGL, M.Wissenschaftliche Zeitschrift der Technischen Universität Dresden. 1988, Vol 37, Num 3, pp 221-223, issn 0043-6925Article

Encres conductrices thermodurcissables et leurs applicationsBERTEAUD, A. J.Revue de physique appliquée. 1986, Vol 21, Num 11, pp 665-668, issn 0035-1687Conference Paper

Supramolecular approaches to organic electronics and nanotechnology. Proceedings of symposium F, E-MRS Spring Meeting 2004, May 24-28, 2004, Strasbourg, FranceSAMORI, Paolo; CACIALLI, Franco; ANDERSON, Harry L et al.Synthetic metals. 2004, Vol 147, Num 1-3, issn 0379-6779, 317 p.Conference Proceedings

Electri-Onics desk manualElectri.onics. 1984, Vol 30, Num 7, pp 5-361, issn 0745-4309Serial Issue

Macromolecular electronic deviceKOEZUKA, H; FUCHIGAMI, H; HAMANO, K et al.Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals. 1994, Vol 255, pp 221-230, issn 1058-725XConference Paper

Foreword to special issue on reliabilitySCHNABLE, G. L.RCA review. 1984, Vol 45, Num 2, issn 0033-6831, 177Article

PRACTICAL RESULTS FROM THE PERFORMANCE EVALUATION OF AN 11 GHZ 140 MBIT/S DIGITAL RADIO RELAY SYSTEMHART G; SMITH PC; MCCONNELL RD et al.1983; RADIO AND ELECTRONIC ENGINEER; ISSN 0033-7722; GBR; DA. 1983; VOL. 53; NO 5; PP. 181-189; BIBL. 19 REF.Article

ABOVE-AMBIENT TEMPERATURE CONTROL USING A THERMOELECTRIC HEAT PUMPGOLDSMID HJ.1983; SOLID-STATE ELECTRONICS; ISSN 0038-1101; GBR; DA. 1983; VOL. 26; NO 4; PP. 365-366; BIBL. 2 REF.Article

SPECIAL ISSUE ON THE 2010 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCEKAZUTAMI ARIMOTO; TAKEUCHI, Ken; KARNIK, Tanay et al.IEEE journal of solid-state circuits. 2011, Vol 46, Num 1, issn 0018-9200, 364 p.Conference Proceedings

Selected Papers from ISDRS 2009ILIADIS, Agis A; AKTURK, Akin.Solid-state electronics. 2010, Vol 54, Num 10, issn 0038-1101, 191 p.Conference Proceedings

Special Issue on the 2008 IEEE International Solid-State Circuits conference (ISSCC)HAM, Donhee; HIDAKA, Hideto; HO, Ron et al.IEEE journal of solid-state circuits. 2009, Vol 44, Num 1, issn 0018-9200, 313 p.Conference Proceedings

2007 Reliability of Compound Semiconductors (ROCS). WorkshopERSLAND, Peter; MENOZZI, Roberto.Microelectronics and reliability. 2008, Vol 48, Num 7, pp 958-993, issn 0026-2714, 35 p.Conference Paper

Reliability physics of advanced electron devicesSTOJADINOVIC, Ninoslav.Microelectronics and reliability. 1996, Vol 36, Num 7-8, issn 0026-2714, 296 p.Serial Issue

Konstruktiv-technologische Gestaltung elektronischer Baugruppen für Erzeugnisse des maschinenbaues = Structural-production-technological shaping electronic units for products of machine buildingTIEROK, M; REUSSE, D.Maschinenbautechnik. 1990, Vol 39, Num 5, pp 200-201, issn 0025-4495, 2 p.Article

An axial component PCB assembly system for inventory/throughput optimizationKASENCHAK, R. T; MARIKOS, M. R.Electronic manufacturing. 1989, Vol 35, Num 1, pp 18-21, 4 p.Article

Thermographie IR: pour les cartes électroniques, si.. = IR thermography: for electronic cardPAJANI, D.Mesures (1983). 1985, Vol 50, Num 3, pp 51-54, issn 0755-219XArticle

Bauclemente für die SMD-Technik und deren Verpackung für die Automatenbestückung = Composants pour la technique de montage de composants par leur surface et leur conditionnement pour leur montage automatique = Components for the surface mounting technology and packaging for their automatic mountingBENSIECK, H. J.VDI-Berichte. 1984, Num 519, pp 11-17, issn 0083-5560Article

SMD-Technologie und ihre technischen und wirtschaftlichen Auswirkungen = La technologie des composants montés par leur surface et ses répercussions techniques et économiques = Surface mounted components technology and its technical and economic impactsHORAK, D.VDI-Berichte. 1984, Num 519, pp 5-10, issn 0083-5560Article

Stellglieder für elektronisch beaufschlagte Motorkomponenten = Modules de réglage pour organes de moteurs assistés électroniquement = Regulation components for electronic control engine componentsBAUMGARTNER, H.VDI-Berichte. 1984, Num 515, pp 19-24, issn 0083-5560Article

SPECIAL ISSUE ON THE 2010 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC)GYU-HYEONG CHO; MURMANN, Boris; HALONEN, Kari et al.IEEE journal of solid-state circuits. 2010, Vol 45, Num 12, issn 0018-9200, 424 p.Conference Proceedings

Workshop of Recent Advances on Low Dimensional Structures and Devices (WRA-LDSD)SAIDANE, Abdelkader.Microelectronics journal. 2009, Vol 40, Num 3, issn 0959-8324, 273 p.Conference Proceedings

Flexible electronics technology, Part I: Systems & applicationsNATHAN, Arokia; CHALAMALA, Babu R.Proceedings of the IEEE. 2005, Vol 93, Num 7, issn 0018-9219, 145 p.Serial Issue

Production de composants optoélectroniques = Production of optoelectronic componentsAMOUROUX, C; PESTIE, J.-P; ISERT, I. R et al.Revue des Télécommunications. 1988, Vol 62, Num 3-4, pp 251-258, issn 0373-8582Article

Recherche sur les composants optoélectroniques = Research on optoelectronic componentsHILDEBRAND, O; BENOIT, J; DUDA, E et al.Revue des Télécommunications. 1988, Vol 62, Num 3-4, pp 242-250, issn 0373-8582Article

The impact of surface mount technology on electronics manufacturingDERMAN, G.Microelectronics. 1986, Vol 17, Num 2, pp 5-11, issn 0026-2692Article

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