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Electri-Onics desk manualElectri.onics. 1984, Vol 30, Num 7, pp 5-361, issn 0745-4309Serial Issue

Macromolecular electronic deviceKOEZUKA, H; FUCHIGAMI, H; HAMANO, K et al.Molecular crystals and liquid crystals science and technology. Section A, Molecular crystals and liquid crystals. 1994, Vol 255, pp 221-230, issn 1058-725XConference Paper

Foreword to special issue on reliabilitySCHNABLE, G. L.RCA review. 1984, Vol 45, Num 2, issn 0033-6831, 177Article

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An axial component PCB assembly system for inventory/throughput optimizationKASENCHAK, R. T; MARIKOS, M. R.Electronic manufacturing. 1989, Vol 35, Num 1, pp 18-21, 4 p.Article

Thermographie IR: pour les cartes électroniques, si.. = IR thermography: for electronic cardPAJANI, D.Mesures (1983). 1985, Vol 50, Num 3, pp 51-54, issn 0755-219XArticle

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Thermal management of electronic components with thermal adaptation composite materialYIN HUIBIN; GAO XUENONG; DING JING et al.Applied energy. 2010, Vol 87, Num 12, pp 3784-3791, issn 0306-2619, 8 p.Article

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Thermoplastics offer cost and design benefits in electronic encapsulationBP & R. British plastics and rubber. 1995, Num NOV, issn 0307-6164, p. 18Article

There's Plenty of Room at the BottomFEYNMAN, R. P.Journal of microelectromechanical systems. 1992, Vol 1, Num 1, pp 60-66, issn 1057-7157Article

An overview of burn-in testingSCHEPPE, W; MILLER, R. F.Electri.onics. 1987, Vol 33, Num 7, issn 0745-4309, 59Article

Reliability compliance testing of electronic components for consumer electronicsPRZYBYL, E; PECIAKOWSKI, E.Electrocomponent science and technology. 1985, Vol 11, Num 4, pp 261-270, issn 0305-3091Article

Vorträge VDI/VDE Fachtagung Maskentechnik für Mikroelektronik-Bausteine am 15. November 1984 in München = Communications de la session VDI/VDE de la technique des masques pour composants microélectroniques du 15 novembre 1984 à Munich = Communications of the VDI/VDE session about mask technique for microelectronic components on november the 15th 1984 in MünchenVDI-Berichte. 1985, Num 555, issn 0083-5560, 141 p.Serial Issue

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