kw.\*:("Electronic engineering")
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Fine and ultra-fine pitch wire bonding: challenges and solutionsZHONG, Z. W.Microelectronics international. 2009, Vol 26, Num 2, pp 10-18, issn 1356-5362, 9 p.Article
Wire bonding using insulated wire and new challenges in wire bondingZHONG, Z. W.Microelectronics international. 2008, Vol 25, Num 2, pp 9-14, issn 1356-5362, 6 p.Article
Geometrical, electrical and stability properties of thick-film and LTCC microcapacitorsMIS, Edward; DZIEDZIC, Andrzej; PIASECKI, Tomasz et al.Microelectronics international. 2008, Vol 25, Num 2, pp 37-41, issn 1356-5362, 5 p.Article
An overview of twenty-five years of electrical and electronics engineering in the proceedings of the IEEE, 1963-1987KLINE, Ronald.Proceedings of the IEEE. 2005, Vol 93, Num 12, pp 2170-2187, issn 0018-9219, 18 p.Article
Development of 2.4 and 3.5 GHz 0.15 μm GaAs PHEMT medium-power amplifier employing core-based design approachRASMI, Amiza; MARZUKI, Arjuna; MOHD NIZAM OSMAN et al.Microelectronics international. 2010, Vol 27, Num 1, pp 25-32, issn 1356-5362, 8 p.Article
Microscopie électronique à balayage: images, applications et développements = Scanning electron microscopy : images, applications and developmentsPAQUETON, Henri; RUSTE, Jacky.Techniques de l'ingénieur. Analyse et caractérisation. 2006, Vol TA1, Num P866, issn 1762-8717, P866.1-P866.17Article
Multi-level education curriculum of electronic manufacturing engineering in GUETYANG, D. G; SUN, N; MA, X. S et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1716-1719Conference Paper
Simple representations for Hermite polynomialsWITHERS, C; NADARAJAH, S.Electronics Letters. 2006, Vol 42, Num 23, pp 1368-1369, issn 0013-5194, 2 p.Article
Design-for-reliability implementation in microelectronics packaging developmentLIYU YANG; RUI NIU; JINSONG XIE et al.Microelectronics international. 2011, Vol 28, Num 1, pp 29-40, issn 1356-5362, 12 p.Article
Polymer-metal nano-composite films for thermal managementCARLBERG, Björn; TENG WANG; FOHAN LIU et al.Microelectronics international. 2009, Vol 26, Num 2, pp 28-36, issn 1356-5362, 9 p.Article
Process technology of electronics : A graduate textbookZERNA, Thomas; OPPERMANN, Martin; SAUER, Wilfried et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1720-1724Conference Paper
Improving design for reliability with in-service data analysisJAMES, Ian J; MARSHALL, Jane; WALLS, Lesley et al.Proceedings. Annual Reliability and Maintainability Symposium. 2002, pp 417-422, issn 0149-144X, isbn 0-7803-7348-0, 6 p.Conference Paper
Embedded opportunitiesGASPERONI, F.Lecture notes in computer science. 1998, pp 1-13, issn 0302-9743, isbn 3-540-64536-5Conference Paper
DC magnetron sputter-deposited tungsten silicide films for microelectronic applicationsHOON, Jian-Wei; CHAN, Kah-Yoong; TOU, Teck-Yong et al.Microelectronics international. 2011, Vol 28, Num 2, pp 30-33, issn 1356-5362, 4 p.Article
Perspectives on Nanotechnology for RF and Terahertz ElectronicsSEUNGNAM CHA; JUNG HAN CHOI; CHAN WOOK BAIK et al.IEEE transactions on microwave theory and techniques. 2011, Vol 59, Num 10, pp 2709-2718, issn 0018-9480, 10 p., 2Article
Chemical characterization of failures and process materials for microelectronics assemblyHUANG, Chien-Yi; LI, Ming-Shu; KU, Chen-Liang et al.Microelectronics international. 2009, Vol 26, Num 3, pp 41-48, issn 1356-5362, 8 p.Article
Creation and verification of dynamic compact thermal model of a BGA packageMOHAMMADI, F; MARAMI, M.Microelectronics international. 2008, Vol 25, Num 3, pp 3-13, issn 1356-5362, 11 p.Article
On the use of the generalised gamma distributionNADARAJAH, Saralees.International journal of electronics. 2008, Vol 95, Num 8-10, pp 1029-1032, issn 0020-7217, 4 p.Article
Forward and backward compatibility of solder alloys with component and board finishesKANNABIRAN, Anand; PANNERSELVAM, Elavarasan T; MANIAN RAMKUMAR, S et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 2, pp 138-146, issn 1521-334X, 9 p.Article
Distance learning : How to use this new didactic method in education of electronics engineering?ILLYEFALVI-VITEZ, Zsolt; GORDON, Peter.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 2, 1725-1730Conference Paper
Teaching and learning analogue electronics in undergraduate courses: preliminary findings from the ETL project = Apprendre et enseigner l'électronique analogique dans les cours de premier cycle du supérieur : premiers résultats issus du projet ETLENTWISTLE, N. J; HAMILTON, A; KELLY, R. G et al.International journal of electrical engineering education. 2005, Vol 42, Num 1, pp 8-20, issn 0020-7209, 13 p.Article
Polyamide für die Elektroindustrie : Halogenfreie Flammschutzmittel erfüllen Brandschutzanforderungen für PA-Anwendungen = Polyamides for the electrical industryGÖRRISSEN, H; RIHM, M.Kunststoffe. 1996, Vol 86, Num 11, pp 1735-1739, issn 0023-5563, 4 p.Article
Product moments of Kibble's bivariate gamma distributionNADARAJAH, Saralees; KOTZ, Samuel.Circuits, systems, and signal processing. 2006, Vol 25, Num 4, pp 567-570, issn 0278-081X, 4 p.Article
Enhancing teaching-learning environments in undergraduate courses in electronic engineering: an introduction to the ETL project = Améliorer les environnements d'apprentissage en ingénierie de l'électronique pour non-diplômés. Une introduction au projet ETLENTWISTLE, N. J.International journal of electrical engineering education. 2005, Vol 42, Num 1, pp 1-7, issn 0020-7209, 7 p.Article
Feuer im Berufsschullabor : Rauchübertragung durch Lüftungsleitungen = Fire in occupational school laboratory: smoke transport by ventilation pipesSanitär und Heizungstechnik. 1995, Vol 60, Num 8, pp 79-81, issn 0036-4401Article