Multiscale multiphysics analysis of wirebonds for electronic packagingPRYPUTNIEWICZ, Ryszard J; WILKERSON, Patrick W; PRZEKWAS, Andrzej J et al.SPIE proceedings series. 2003, pp 304-309, isbn 0-8194-5189-4, 6 p.Conference Paper

Packaging challenges of high-power LEDs for solid state lightingHAQUE, Shatil; STEIGERWALD, Dan; MARTIN, Paul S et al.SPIE proceedings series. 2003, pp 881-886, isbn 0-8194-5189-4, 6 p.Conference Paper

Techniques of robust electrical package design using HFSSCORDON, Christopher; PILOTO, Andy; AGUIRRE, Jerry et al.SPIE proceedings series. 2003, pp 998-1002, isbn 0-8194-5189-4, 5 p.Conference Paper

2002 international conference on advanced packaging and systems (Reno NV, 10-13 March 2002)SPIE proceedings series. 2002, isbn 0-930815-65-3, 274 p., isbn 0-930815-65-3Conference Proceedings

[Revised and selected papers from the IMAPS 6th Annual International Conference on Device Packaging, Fountain Hills, Arizona, March 2010]HUFFMAN, Alan.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 3, issn 1551-4897, 65 p.Serial Issue

High speed packaging technologies for logigabit ethernet applicationsLIU, Yung-Sheng; CHU, Mu-Tao; YEN CHU et al.Lasers and Electro-optics Society. 2004, isbn 0-7803-8557-8, 2Vol, Vol2, 511-512Conference Paper

Monolith package : A novel FBGA using 3-D TLC process and the new assembly by printing methodSHIMADA, Osamu; SUZUKI, Kazuhisa; WAKASHIMA, Yoshiaki et al.SPIE proceedings series. 2000, pp 178-183, isbn 0-930815-62-9Conference Paper

Packaging and integration of high-speed optical componentsRAY, Curtis.IEEE instrumentation & measurement magazine. 2004, Vol 7, Num 2, pp 60-62, issn 1094-6969, 3 p.Article

The investigation of lead-free package reliabilityLEE, Jeffrey C. B; CHIANG, C. M; CRUZ, Alejandro R et al.SPIE proceedings series. 2003, pp 212-217, isbn 0-8194-5189-4, 6 p.Conference Paper

Automated opto-electronic packaging for 10 Gb/s transpondersVERDIELL, Jean-Marc; KOHLER, Robert; ZBINDEN, Eric et al.Proceedings - Electronic Components Conference. 2002, pp 808-810, issn 0569-5503, isbn 0-7803-7430-4, 3 p.Conference Paper

Photoelastic investigation of bimaterial interfacial stresses induced by thermal loadingWANG, W.-C; LIN, J.-C.Strain. 2003, Vol 39, Num 4, pp 143-148, issn 0039-2103, 6 p.Article

Reliability of High-Power LED Packaging and AssemblyLIU, Cheng-Yi; RICKY LEE, S. W; SHIN, Moo Whan et al.Microelectronics and reliability. 2012, Vol 52, Num 5, issn 0026-2714, 195 p.Serial Issue

Packaging des circuits intégrés = Integrated circuits packagingSAINT MARTIN, Xavier.Techniques de l'ingénieur. Electronique. 2005, Vol E5, Num E3400, issn 0399-4120, E3400.1-E3400.24Article

Very high speed 3D system in packageVAL, Christian; VASSAL, Marie-Cécile; LIGNIER, Olivier et al.SPIE proceedings series. 2002, pp 181-187, isbn 0-930815-66-1, 7 p.Conference Paper

Hollow packaging technology employing photosensitive adhesive resinsFUNAYA, Takuo; SENBA, Naoji; MATSUI, Koji et al.SPIE proceedings series. 2000, pp 190-195, isbn 0-930815-62-9Conference Paper

Variation mapsSEZAI DOGDU; SANTOS, Daryl L; CHAN, Raymond et al.SPIE proceedings series. 2000, pp 156-160, isbn 0-930815-62-9Conference Paper

On the applicability of MIL-Spec-based helium fine leak test to packages with sub-micro liter cavity volumesGOSWAMI, Arindam; HAN, Bongtae.Microelectronics and reliability. 2008, Vol 48, Num 11-12, pp 1815-1821, issn 0026-2714, 7 p.Article

9th international symposium on advanced packaging materials (processes, properties and interfaces); March 24-26, 2004, Atlanta, Georgia USAInternational symposium on advanced packaging materials. 2004, isbn 0-7803-8436-9, 1Vol, VI-281 p, isbn 0-7803-8436-9Conference Proceedings

Feed forward test methodology utilizing device identificationCABBIBO, A; CONDER, J; JACOBS, M et al.International Test Conference. 2004, pp 655-660, isbn 0-7803-8580-2, 1Vol, 6 p.Conference Paper

The socket response to current packaging and test trendsANDES, Jamie; BOGATIN, Eric.IEEE/CPMT/SEMI international electronics manufacturing technology. Symposium. 2004, pp 97-99, isbn 0-7803-8582-9, 1Vol, 3 p.Conference Paper

New approaches to 3-D interconnection systems in package applicationsVAL, Christian.SPIE proceedings series. 2003, pp 229-234, isbn 0-8194-5189-4, 6 p.Conference Paper

Low-cost packaging of inertial MEMS devicesFELTON, L. E; DUFFY, M; HABLUTZEL, N et al.SPIE proceedings series. 2003, pp 402-406, isbn 0-8194-5189-4, 5 p.Conference Paper

Effect of die-attach adhesives on the stress evolution in MEMS packagingWALWADKAR, Satyajit S; FARRELL, P. W; FELTON, Lawrence E et al.SPIE proceedings series. 2003, pp 847-852, isbn 0-8194-5189-4, 6 p.Conference Paper

Unique metal-to-glass bonding for hermetic packaging of MOEMS and other applicationsSTARK, David.SPIE proceedings series. 2003, pp 873-880, isbn 0-8194-5189-4, 8 p.Conference Paper

IMAPS : international symposium on microelectronics (Denver CO, 4-6 September 2002)SPIE proceedings series. 2002, isbn 0-930815-66-1, XX, 957 p, isbn 0-930815-66-1Conference Proceedings