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Results 1 to 25 of 7005

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Multiscale multiphysics analysis of wirebonds for electronic packagingPRYPUTNIEWICZ, Ryszard J; WILKERSON, Patrick W; PRZEKWAS, Andrzej J et al.SPIE proceedings series. 2003, pp 304-309, isbn 0-8194-5189-4, 6 p.Conference Paper

Packaging challenges of high-power LEDs for solid state lightingHAQUE, Shatil; STEIGERWALD, Dan; MARTIN, Paul S et al.SPIE proceedings series. 2003, pp 881-886, isbn 0-8194-5189-4, 6 p.Conference Paper

Techniques of robust electrical package design using HFSSCORDON, Christopher; PILOTO, Andy; AGUIRRE, Jerry et al.SPIE proceedings series. 2003, pp 998-1002, isbn 0-8194-5189-4, 5 p.Conference Paper

2002 international conference on advanced packaging and systems (Reno NV, 10-13 March 2002)SPIE proceedings series. 2002, isbn 0-930815-65-3, 274 p., isbn 0-930815-65-3Conference Proceedings

[Revised and selected papers from the IMAPS 6th Annual International Conference on Device Packaging, Fountain Hills, Arizona, March 2010]HUFFMAN, Alan.Journal of microelectronics and electronic packaging. 2010, Vol 7, Num 3, issn 1551-4897, 65 p.Serial Issue

Ball grid array : Doubie side and reduced pitch advanced assembly processMILKOVICH, C.SPIE proceedings series. 1997, isbn 0-930815-50-5, p. 108Conference Paper

High speed packaging technologies for logigabit ethernet applicationsLIU, Yung-Sheng; CHU, Mu-Tao; YEN CHU et al.Lasers and Electro-optics Society. 2004, isbn 0-7803-8557-8, 2Vol, Vol2, 511-512Conference Paper

Monolith package : A novel FBGA using 3-D TLC process and the new assembly by printing methodSHIMADA, Osamu; SUZUKI, Kazuhisa; WAKASHIMA, Yoshiaki et al.SPIE proceedings series. 2000, pp 178-183, isbn 0-930815-62-9Conference Paper

Packaging and integration of high-speed optical componentsRAY, Curtis.IEEE instrumentation & measurement magazine. 2004, Vol 7, Num 2, pp 60-62, issn 1094-6969, 3 p.Article

Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loadingYANG, Q. J; SHI, X. Q; WANG, Z. P et al.Finite elements in analysis and design. 2003, Vol 39, Num 9, pp 819-833, issn 0168-874X, 15 p.Article

Effect of hydrogen on GaAs MMICs in hermetic packagesGOSWAMI, D. N.SPIE proceedings series. 2003, pp 459-464, isbn 0-8194-5189-4, 6 p.Conference Paper

The investigation of lead-free package reliabilityLEE, Jeffrey C. B; CHIANG, C. M; CRUZ, Alejandro R et al.SPIE proceedings series. 2003, pp 212-217, isbn 0-8194-5189-4, 6 p.Conference Paper

Automated opto-electronic packaging for 10 Gb/s transpondersVERDIELL, Jean-Marc; KOHLER, Robert; ZBINDEN, Eric et al.Proceedings - Electronic Components Conference. 2002, pp 808-810, issn 0569-5503, isbn 0-7803-7430-4, 3 p.Conference Paper

Photoelastic investigation of bimaterial interfacial stresses induced by thermal loadingWANG, W.-C; LIN, J.-C.Strain. 2003, Vol 39, Num 4, pp 143-148, issn 0039-2103, 6 p.Article

Reliability of High-Power LED Packaging and AssemblyLIU, Cheng-Yi; RICKY LEE, S. W; SHIN, Moo Whan et al.Microelectronics and reliability. 2012, Vol 52, Num 5, issn 0026-2714, 195 p.Serial Issue

Packaging des circuits intégrés = Integrated circuits packagingSAINT MARTIN, Xavier.Techniques de l'ingénieur. Electronique. 2005, Vol E5, Num E3400, issn 0399-4120, E3400.1-E3400.24Article

Very high speed 3D system in packageVAL, Christian; VASSAL, Marie-Cécile; LIGNIER, Olivier et al.SPIE proceedings series. 2002, pp 181-187, isbn 0-930815-66-1, 7 p.Conference Paper

Hollow packaging technology employing photosensitive adhesive resinsFUNAYA, Takuo; SENBA, Naoji; MATSUI, Koji et al.SPIE proceedings series. 2000, pp 190-195, isbn 0-930815-62-9Conference Paper

Variation mapsSEZAI DOGDU; SANTOS, Daryl L; CHAN, Raymond et al.SPIE proceedings series. 2000, pp 156-160, isbn 0-930815-62-9Conference Paper

Optimizing angle-to-area-converting, light-piping systems using surface featuresDAVENPORT, Thomas L. R; CASSARLY, William J; HOUGH, Thomas A et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, pp 594204.1-594204.10, issn 0277-786X, isbn 0-8194-5947-X, 1VolConference Paper

RF test fixture basicsWARTENBERG, Scott.Microwave journal (Euro-global edition). 2003, Vol 46, Num 6, pp 22-40, issn 0192-6217, 11 p.Article

Lead free, zero shrink, substrate bonded LTCC systemWAHLERS, R. L; FEINGOLD, A. H; HEINZ, M et al.SPIE proceedings series. 2003, pp 206-211, isbn 0-8194-5189-4, 6 p.Conference Paper

X-IGA: Consumer price packaging for 40Gbit/s transceiver modules?MEYER-BERG, Georg; KOREN, Ivo; HEDLER, Harry et al.SPIE proceedings series. 2003, pp 887-893, isbn 0-8194-5189-4, 7 p.Conference Paper

Overview and future of foldable flex technologySCHAPER, Leonard.SPIE proceedings series. 2002, isbn 0-930815-65-3, p. 200Conference Paper

Experimental methods and tools in electronic packaging applicationsYIFAN GUO; TUO LI.SPIE proceedings series. 2002, pp 14-19, isbn 0-8194-4261-5Conference Paper

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