Klimaanlage im Schrank steigert Prozesssicherheit = Enclosed Air conditioning in cabinet increases the process safetyMAAGE, Michael.VDI-Z. 2002, Vol 144, Num NOV, pp 36-37, issn 0042-1766, 2 p., NSArticle

Méthode de consolidation des gaines des pompes centrifugesVASSERMAN, L. K; BUKIN, V. M; VOLOVIK, V. S et al.Neftepererabotka i Neftehimija (Moskva). 1986, Num 7, pp 28-30, issn 0028-1190Article

A new cable sheath jointing method. Standard closureHIRATA, M; HINOHARA, T.Japan Telecommunications Review. 1986, Vol 28, Num 3, pp 187-192, issn 0021-4744Article

Schnellere Montage im 19-Raster : Leistungsprofil eines neuen Baugruppenträgers = 19 grid for fast mountingHAAG, V.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1996, Vol 104, Num 11-12, pp 831-832, issn 0944-1018Article

Mesure de la diffusion de vapeur d'eau et de gaz dans les gaines de câbles du type ALT. Essais de nouvelles méthodes de mesure et comparaisons des résultats = Water vapor and gas diffusion measure in ALT type cable sheath. New method test and results measuring comparisonFISCHER, R; STAUB, T; HORAK, V et al.Technische Mitteilungen PTT. 1986, Vol 64, Num 10, pp 473-480, issn 0040-1471Article

Leistungsfähige Gehäuse = A good boxPlastverarbeiter. 1997, Vol 48, Num 3, pp 92-95, issn 0032-1338, 3 p.Article

Minimal size packaging solutions : A comparisonGREATHOUSE, S.Microelectronics international. 1996, Vol 40, Num MAI, pp 27-32, issn 1356-5362Article

Kunststoff-Gehäuse kostengünstig und zeitsparend entwickeln = Σaving costs and time in the developpement of plastics housingsWILCZEK, W.Kunststoffe. 1994, Vol 84, Num 8, pp 1020-1021, issn 0023-5563Article

«L'utilisation des adhésifs dans la réalisation des boîtiers hermétiques : exemples typiques de collage» = Gluing in the electronics industry the use of adhesives in the realisation of hermetic casings : typical example of gluing'STRICOT, Y.Double liaison (1988). 1992, Vol 39, Num 440-42, pp 24-27, issn 1166-4398, 8 p.Conference Paper

Measurement of package inductance and capacitance matricesYOUNG, B; SPARKMAN, A. K.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1996, Vol 19, Num 1, pp 225-229, issn 1070-9894Article

A chips-first multichip module implementation of passive and active test coupons utilizing Texas instruments' high density interconnect technologySCHAEFER, T. M; KACINES, J. J; RANDALL, B. A et al.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1996, Vol 19, Num 2, pp 403-416, issn 1070-9894Article

An accurate RMS-DC voltage comparatorARSENEAU, R; ZELLE, J. J.IEEE transactions on instrumentation and measurement. 1990, Vol 39, Num 6, pp 902-904, issn 0018-9456Article

Micropack packaging technologyHACKE, H. J; STECKHAN, H.-H.Siemens Forschungs- und Entwicklungsberichte. 1988, Vol 17, Num 5, pp 227-229, issn 0370-9736Article

Lens minibar to facilitate refractionMANSOUR, A. M; SALTI, H. I.American journal of ophthalmology. 2000, Vol 129, Num 4, pp 540-541, issn 0002-9394Article

Guidelines for selection of manufacturing simulation softwareHLUPIC, V; PAUL, R. J.IIE transactions. 1999, Vol 31, Num 1, pp 21-29, issn 0740-817XArticle

Low-cost reliable transfer mold sensor packaging conceptBOSSCHE, A; COTOFANA, C. V. B; KALDENBERG, P et al.SPIE proceedings series. 1997, pp 153-160, isbn 0-8194-2656-3Conference Paper

Flexibel verdrahten auf kleinstem Raum : Die flexible Leiterplatte als Verbindungs- und Aufbauelement = Flexible wiring up on the most little placeKOBER, H.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1996, Vol 104, Num 5, pp 356-359, issn 0944-1018Article

Structured test methodologies and test economics for multichip modulesKORNEGAY, K. T; ROY, K.IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging. 1996, Vol 19, Num 1, pp 195-202, issn 1070-9894Article

Thermally induced IC package crackingSUHL, D.IEEE transactions on components, hybrids, and manufacturing technology. 1990, Vol 13, Num 4, pp 940-945, issn 0148-6411Conference Paper

How and why to mark electronic components, boards, and packagesNELSON, B. A.Electronic manufacturing. 1988, Vol 34, Num 6, pp 8-10Article

Physical design of circuit boards for testability and maintainabilityWILKINS, B. R.Journal of the Institution of Electronic and Radio Engineers. 1988, Vol 58, Num 5, pp 217-225, issn 0267-1689Article

Wiederaufarbeiten von Kunststoffabfall = Retraitement de déchets de matière plastique = Reprocessing of plastic wastesPFAFF, R; GNEUSS, D.Kunststoffe. 1987, Vol 77, Num 1, pp 38-39, issn 0023-5563Article

Shorted casings: causes and curesLIERLY, J.Pipe line industry. 1987, Vol 66, Num 6, pp 23-30, issn 0032-0145, 2 p.Article

Solutions auto-similaires du problème de la compression d'un plasma avec un champ magnétique par une gaine de plasmaVEKSHTEJN, G. E.ZETF. Pis′ma v redakciû. 1986, Vol 90, Num 3, pp 905-912, issn 0044-4510Article

Neue Technik im bewährten Design = New technique in well known designBESSERER, H.F & M. Feinwerktechnik, Mikrotechnik, Messtechnik. 1997, Vol 105, Num 7-8, pp 556-557, issn 0944-1018Article