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A NEW FREQUENCY INDEPENDENT ATTENUATOR IN DISTRIBUTED MULTILAYER THIN FILM MICROSYSTEMSINGH HR.1983; MICROELECTRONICS AND RELIABILITY; ISSN 0026-2714; GBR; DA. 1983; VOL. 23; NO 2; PP. 379-381; BIBL. 8 REF.Article

FAULT TREE ANALYSIS METHOD OF A SYSTEM HAVING COMPONENTS OF MULTIPLE FAILURE MODESHUANG XI ZHI.1983; MICROELECTRONICS AND RELIABILITY; ISSN 0026-2714; GBR; DA. 1983; VOL. 23; NO 2; PP. 325-328; BIBL. 2 REF.Article

APPLICATION OF NEW METHODS AND TECHNIQUES FOR FAILURE ANALYSIS.1977; SOLID STATE TECHNOL.; U.S.A.; DA. 1977; VOL. 20; NO 12; PP. 64Article

AVAILABILITY OF AN (M,N) SYSTEM WITH REPAIR = DISPONIBILITE D'UN SYSTEME (M,N) AVEC DES POSSIBILITES DE REPARATIONRAO KV; GOVIL AK.1978; MICROELECTRON. AND RELIABIL.; GBR; DA. 1978; VOL. 17; NO 6; PP. 571-573; BIBL. 6 REF.Article

RAIL VEHICLES AND STRUCTURES1982; SPECIAL PUBLICATION-NATIONAL BUREAU OF STANDARDS; ISSN 0083-1883; USA; DA. 1982; NO 621; PP. 1-91; BIBL. DISSEM.Conference Paper

THE DI/DT CAPABILITY OF FIELD-CONTROLLED THYRISTORSBALIGA BJ.1982; SOLID-STATE ELECTRONICS; ISSN 0038-1101; GBR; DA. 1982; VOL. 25; NO 7; PP. 583-588; BIBL. 8 REF.Article

CONTROL OF FAILURES AND PAUSES OF A PIPELINE EQUIPMENTSTRIZHKOV VP; SENYASHIN NP.1978; TRANSP. KHRAN. NEFTI NEFTEPROD.; SUN; DA. 1978; NO 11; PP. 11-14Article

INCREASING INTEGRATED CIRCUIT PRODUCT RELIABILITY THROUGH FAILURE ANALYSIS: THE ROLE OF THE INDEPENDENT LABORATORY.EDFORS HC.1977; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1977; VOL. 6; NO 1; PP. 7-8Article

AVAILABILITY OF A CERTAIN ITEM WITHIN A SYSTEM.WOLLNER E.1977; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1977; VOL. 16; NO 2; PP. 143-148; BIBL. 2 REF.Article

INTEGRATED CIRCUIT YIELD STATISTICSSTAPPER CH; ARMSTRONG FM; SAJI K et al.1983; PROCEEDINGS OF THE IEEE; ISSN 0018-9219; USA; DA. 1983; VOL. 71; NO 4; PP. 453-470; BIBL. 83 REF.Article

SCHWEISSTECHNISCHE SCHADENSFAELLE - ERGEBNISSE FUER DIE GUETESICHERUNG BEI SCHWEISSARBEITEN = FAILURE OF WELDED CONSTRUCTIONS. QUALITY ASSURANCE FOR WELDING WORKS = DEFAILLANCES DE CONSTRUCTIONS SOUDEES: RESULTATS DU POINT DE VUE DE L'ASSURANCE DE LA QUALITE DANS LES TRAVAUX DE SOUDAGEGALAN P.1980; SCHWEISSTECHNIK; AUT; DA. 1980; VOL. 34; NO 6; PP. 91-102; LOC. ISArticle

WIR STELLEN ZUR DISKUSSION: WANN IST EIN SCHWEISSTEIL SICHER. = SAFETY OF WELDED STRUCTURES = DISCUSSION: LA SECURITE DES ASSEMBLAGES SOUDESRUBO E.1980; PRAKTIKER; ISSN 0554-9965; DEU; DA. 1980; VOL. 32; NO 9; PP. 269-271; LOC. ISArticle

WHAT CAN HAPPEN TO AN IC IN YOUR SYSTEM.DICKEN HK.1978; EVAL. ENGNG; USA; DA. 1978; VOL. 17; NO 6; PP. 46-47Article

A REPORT ON NAVAIR PROBLEMS ASSOCIATED WITH MILITARY CONNECTORS.HOOD RD.1978; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1978; VOL. 18; NO 5 PART. 2; PP. C 36-C42Article

ON THE ALLOYING OF ALUMINIUM TO SILICON IN THE FABRICATION OF INTEGRATED CIRCUITS.BERTHOUD LA.1977; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1977; VOL. 16; NO 2; PP. 165-171; BIBL. 25 REF.Article

SCHADENSFAELLE ALS LEHRMEISTER FUER DEN KONSTRUKTEUR = LESSONS TO BE DROWN BY THE DESIGNER FROM THE STUDY OF FAILURE CASES = LES ENSEIGNEMENTS A TIRER PAR LE CONCEPTEUR DE L'ETUDE DE CAS DE RUINEVEIT HJ.1983; SICHERUNG DER GUETE VON SCHWEISSVERBINDUNGEN IM HOCH- UND BRUECKENBAU. SONDERTAGUNG/1983/HANNOVER; DEU; DUESSELDORF: DVS; DA. 1983; PP. 35-37; ISBN 3-87155-384-0; LOC. ISConference Paper

ANALYSE DE DEFAILLANCE DE VLSI PAR MICROSCOPIE ELECTRONIQUE = FAILURE ANALYSIS OF VLSI USING SEMBAILLE G; COURTOIS B; LAURENT J et al.1982; ; FRA; GRENOBLE: I.M.A.G.; DA. 1982; IMAG/RR-304; 17 P.; 30 CM; ABS. ENG; BIBL. 8 REF.;[RAPP. RECH.-LAB. INFORM. MATH. APPL. GRENOBLE; VOL. RR-304]Report

STUDY OF FEASIBILITY TO COMPENSATE A LACK OF OIL FEEL CAUSED BY A DEFECT IN THE LINEAR SECTOR OF A MAIN PIPELINEMASLOV LS; RASHCHEPKIN KE; ROSLYAKOV AV et al.1979; TRANSP. KHRAN. NEFTI NEFTEPROD.; SUN; DA. 1979; NO 2; PP. 21-24; BIBL. 3 REF.Article

THE ROLE OF CERAMIC VOIDS AND FRACTURE PROPAGATION IN SHELF LIFE FAILURE OF TUBES.HAAS GA; GRAY HF; THOMAS RE et al.1977; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1977; VOL. 24; NO 1; PP. 62-66; BIBL. 1 REF.Article

FAILURE MECHANISM OF SOLID TANTALUM CAPACITORS.GOUDSWAARD B; DRIESENS FJJ.1976; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1976; VOL. 3; NO 3; PP. 171-179; BIBL. 10 REF.Article

PROXIMITY SWITCHES BROUGHT UP-TO-DATE.UEDA K.1976; J. ELECTRON. ENGNG; JAP.; DA. 1976; NO 120; PP. 16-19Article

SIMPLE TECHNIQUES OF HYBRID FAILURE ANALYSIS.GUIDICI DC.1976; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1976; VOL. 16; NO 5; PP. 101-106 (4P.)Article

STEREO RADIOGRAPHY OF COMPLEX MULTILAYERED MICROCIRCUITS.GUIDICI DC.1976; SOLID STATE TECHNOL.; U.S.A.; DA. 1976; VOL. 19; NO 10; PP. 45-49 (3P.); BIBL. 7 REF.Article

SOME PROBLEMS AND POSSIBLE SOLUTIONS FOR HYBRID MICRO-CIRCUIT RELIABILITYSINNADURA FN; WILSON KJ; BRACE DWJ et al.1980; MICROELECTRON. J.; GBR; DA. 1980; VOL. 11; NO 1; PP. 26-36; BIBL. 12 REF.Article

DIE MITTLERE AUSFALLFREIE ARBEITSZEIT EINES GERAETS. PROBLEME ZWISCHEN NACHWEIS UND GARANTIEWERT = LE TEMPS MOYEN ENTRE PANNES D'UN APPAREIL. PROBLEMES CONCERNANT LES RAPPORTS ENTRE LES VALEURS ESTIMEES ET GARANTIESBEMMANN HB.1980; NACHR.-TECH., ELEKTRON.; DDR; DA. 1980; VOL. 30; NO 2; PP. 79-82; BIBL. 7 REF.Article

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