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Wafer bonding: A flexible approach to materials integrationGÖSELE, U; ALEXE, M.The Electrochemical Society interface. 2000, Vol 9, Num 2, pp 20-25, issn 1064-8208Article

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Design considerations for patterned wafer bondingCHA, G; LEE, B. H; LEE, K. W et al.Japanese journal of applied physics. 1997, Vol 36, Num 3B, pp 1912-1916, issn 0021-4922, 1Conference Paper

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Present and future role of chemical mechanical polishing in wafer bondingGUI, C; ELWENSPOEK, M; GARDENIERS, J. G. E et al.Journal of the Electrochemical Society. 1998, Vol 145, Num 6, pp 2198-2204, issn 0013-4651Article

Compliant substrate technology for heterogeneous integrationLO, Y. H; ZHU, Z. H; ZHOU, R et al.Critical reviews of optical science and technology. 1998, pp 56-79, issn 1018-1997, isbn 0-8194-2732-2Conference Paper