Emerging challenges of underfill for flip chip applicationTIM CHEN; JINLIN WANG; DAOQIANG LU et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 175-179Conference Paper

Experimental observations on nonlinear phenomena in transducer assembly for thermosonic Flip-Chip bondingLEI HAN; JUE ZHONG.Microelectronic engineering. 2008, Vol 85, Num 7, pp 1568-1576, issn 0167-9317, 9 p.Article

Extremely High Saturation Current-B andwidth Product Performance of a Near-B allistic Uni-Traveling-Carrier Photodiode With a Flip-Chip Bonding StructureSHI, Jin-Wei; KUO, F.-M; WU, C.-J et al.IEEE journal of quantum electronics. 2010, Vol 46, Num 1-2, pp 80-86, issn 0018-9197, 7 p.Article

Effect of underfill on electromigration lifetime in flip chip jointsYAMANAKA, Kimihiro; OOYOSHI, Takafumi; NEJIME, Takayuki et al.Journal of alloys and compounds. 2009, Vol 481, Num 1-2, pp 659-663, issn 0925-8388, 5 p.Article

A zero X-Y shrinkage low temperature cofired ceramic substrate using Ag and AgPd conductors for flip-chip bondingITAGAKI, M; BESSHO, Y; EDA, K et al.Microelectronics international. 1997, Vol 44, Num SEP, pp 15-18, issn 1356-5362Conference Paper

Nitride-Based Flip-Chip ITO LEDsCHANG, S. J; CHANG, C. S; SU, Y. K et al.IEEE transactions on advanced packaging. 2005, Vol 28, Num 2, pp 273-277, issn 1521-3323, 5 p.Article

Features of new laser micro-via organic substrate for semiconductor packageTSUKADA, Yutaka; YAMANAKA, Kimihior; KODAMA, Yasushi et al.Electrochimica acta. 2003, Vol 48, Num 20-22, pp 2997-3003, issn 0013-4686, 7 p.Conference Paper

Study of a dipping method for flip-chip flux coatingZHANG WEI; LI JUNHUI; HAN LEI et al.Microelectronics and reliability. 2014, Vol 54, Num 11, pp 2479-2486, issn 0026-2714, 8 p.Article

Initial development work on a high throughput low cost flip chip on board assembly processMCGOVERN, L. P; BALDWIN, D. F; PH.D et al.SPIE proceedings series. 1997, pp 284-289, isbn 0-930815-50-5Conference Paper

Design and Fabrication of a Tunable Superconductive Resonator Utilizing Micromachined Tunable CapacitorCHEN, Yi-Jie; SHIH, Wen-Pin; KAO, Cheng-Kai et al.Journal of microelectromechanical systems. 2010, Vol 19, Num 1, pp 129-136, issn 1057-7157, 8 p.Article

Electro-migration behavior of Pb-free flip chip bumps : IMAPS-Burges-2005, Belgium SymposiumLABIE, Riet; WEBERS, Tomas; SWINNEN, Bart et al.Journal of microelectronics and electronic packaging. 2006, Vol 3, Num 1, pp 32-36, issn 1551-4897, 5 p.Conference Paper

Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy : Durability of Adhesive JointsJO, Jung-Lae; LEE, Jong-Bum; KIM, Jong-Min et al.The Journal of adhesion (Print). 2010, Vol 86, Num 4-6, pp 470-479, issn 0021-8464, 10 p.Conference Paper

Double bump flip-chip assemblyYAN, Kathy Wei; JOHNSON, R. Wayne; STAPLETON, Russell et al.IEEE transactions on electronics packaging manufacturing. 2006, Vol 29, Num 2, pp 119-133, issn 1521-334X, 15 p.Article

Hybrid-Integrated Silicon Photonic Bridge Chips for Ultralow Energy Inter-Chip CommunicationsTHACKER, Hiren D; SHUBIN, Ivan; RON HO et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7944, issn 0277-786X, isbn 978-0-8194-8481-9, 79440B.1-79440B.11Conference Paper

Predicting the strength of underfill/polyimide interfacesPEARSON, Raymond A; OLDAK, Robert.International symposium on advanced packaging materials. 2004, pp 264-266, isbn 0-7803-8436-9, 1Vol, 3 p.Conference Paper

Filled no-flow underfilling: Process and materialsWUSHENG YIN; HWANG, Hong-Sik; LEE, Ning-Cheng et al.SPIE proceedings series. 2003, pp 262-274, isbn 0-8194-5189-4, 13 p.Conference Paper

Advanced copper column based solder bump for flip-chip interconnectionYAMADA, H; TOGASAKI, T; TATEYAMA, K et al.SPIE proceedings series. 1997, pp 417-422, isbn 0-930815-50-5Conference Paper

Reduced oxide soldering activation (ROSA) : Enabling technology for soldering of Flip chip assembliesHILLMAN, D.SPIE proceedings series. 1997, pp 586-591, isbn 0-930815-50-5Conference Paper

Silicon TSV Interposers for Photonics and VLSI PackagingVODRAHALLI, N; LI, C. Y; KOSENKO, V et al.Proceedings of SPIE, the International Society for Optical Engineering. 2011, Vol 7928, issn 0277-786X, isbn 978-0-8194-8465-9 0-8194-8465-2, 792806.1-792806.7Conference Paper

Design & parameter optimization of flip-chip bonderSHIM, Hyoungsub; KANG, Heuiseok; JEONG, Hoon et al.Proceedings of SPIE, the International Society for Optical Engineering. 2005, pp 60480G.1-60480G.8, issn 0277-786X, isbn 0-8194-6084-2, 1VolConference Paper

Thermal interaction of an array of flip chip componentsJOINER, Bennett; DE OCA, Tony Montes.Annual IEEE semiconductor thermal measurement and management symposium. 2004, pp 286-291, isbn 0-7803-8363-X, 1Vol, 6 p.Conference Paper

Stencil printing technology for 100μm flip chip bumpingMANESSIS, Dionysios; PATZELT, Rainer; OSTMANN, Andreas et al.SPIE proceedings series. 2003, pp 241-246, isbn 0-8194-5189-4, 6 p.Conference Paper

Thermal performance of a high end flip-chip organic packageCALMIDI, V. V; SATHE, S. B.SPIE proceedings series. 2003, pp 511-516, isbn 0-8194-5189-4, 6 p.Conference Paper

Highly reliable operation of InGaAlAs mesa-waveguide photodiodes in a humid ambientSHISHIKURA, M; TANAKA, S; NAKAMURA, H et al.IEE conference publication. 1997, pp 97-100, issn 0537-9989, isbn 0-85296-697-0, 5VolConference Paper

Effects of chip scale package and flip-chip on the design and manufacturing of electronic productsSAVOLAINEN, P.Microelectronics international. 1998, Vol 45, Num JAN, pp 35-38, issn 1356-5362Conference Paper