Use of a focused ion beam for characterizing SIS circuitsBASS, Robert B; CLARK, William W; ZHANG, Jian Z et al.IEEE transactions on applied superconductivity. 2001, Vol 11, Num 1, pp 92-94, issn 1051-8223, 1Conference Paper

Nano-fabrication with focused ion beamsGIERAK, J; MAILLY, D; HYDMAN, R et al.Microelectronic engineering. 2001, Vol 57-58, pp 865-875, issn 0167-9317Conference Paper

Zielpräparation von Proben für 3D-TEM mittels Mikromanipulator = Target preparation of samples for 3D-TEM using micromanipulatorsRITZ, Yvonne; STEGMANN, Heiko; ENGELMANN, Hans-Jürgen et al.Praktische Metallographie. 2004, Vol 41, Num 4, pp 180-189, issn 0032-678X, 10 p.Article

Novel Josephson junction geometries in NbCu bilayers fabricated by focused ion beam microscopeHADFIELD, R. H; BURNELL, G; GRIMES, P. K et al.Physica. C. Superconductivity and its applications. 2002, Vol 367, Num 1-4, pp 267-271Article

Focused ion beam milled CoPt magnetic force microscopy tips for high resolution domain imagesGAO, L; YUE, L. P; YOKOTA, T et al.IEEE transactions on magnetics. 2004, Vol 40, Num 4, pp 2194-2196, issn 0018-9464, 3 p., 2Conference Paper

Spectral engineering of terahertz quantum cascade lasers using focused ion beam etched photonic latticesCHAKRABORTY, S; CHAKRABORTY, T; KHANNA, S. P et al.Electronics Letters. 2006, Vol 42, Num 7, pp 404-405, issn 0013-5194, 2 p.Article

TEM-Zielpräparation in einer Stunde: Utopie oder realistisches Ziel? = TEM target preparation within one hour: Utopia or a realistic goal ?ENGELMANN, H. J; VOLKMANN, B; BLUM, W et al.Praktische Metallographie. 2002, Vol 39, Num 3, pp 117-125, issn 0032-678XArticle

Droplet emission from liquid metal ion sources and their disintegrationTZVETKOV, T; DRANDAROV, N.Ultramicroscopy. 1999, Vol 79, Num 1-4, pp 217-224, issn 0304-3991Conference Paper

Methodologies for the preparation of soft materials using CryoFIB SEMSTOKES, Debbie J; HAYLES, Michael F.Proceedings of SPIE, the International Society for Optical Engineering. 2009, Vol 7378, issn 0277-786X, isbn 978-0-8194-7654-8 0-8194-7654-4, 1Vol, 73780G.1-73780G.12Conference Paper

Anwendung der FIB für Materialwissenschaft und Fehleranalyse = Using FIB for materials science and failure analysisSENNHAUSER, Urs; JACOB, Peter; GASSER, Philippe et al.Praktische Metallographie. 2004, Vol 41, Num 4, pp 199-209, issn 0032-678X, 11 p.Article

Total reflection mirrors fabricated on silica waveguides with focused ion beamWATANABE, K; SCHRAUWEN, J; LEINSE, A et al.Electronics letters. 2009, Vol 45, Num 17, pp 883-884, issn 0013-5194, 2 p.Article

Ion acoustic microscopy for imaging of buried structures based on a focused ion beam systemAKHMADALIEV, Ch; BISCHOFF, L; TEICHERT, J et al.Microelectronic engineering. 2001, Vol 57-58, pp 659-664, issn 0167-9317Conference Paper

Origin of Hydrophobicity in FIB-Nanostructured Si SurfacesROTA, Alberto; TRIPATHI, Manoj; GAZZADI, Giancarlo et al.Langmuir. 2013, Vol 29, Num 17, pp 5286-5293, issn 0743-7463, 8 p.Article

A review of Ga⁺ FIB/SIMSGIANNUZZI, Lucille A; UTLAUT, M.Surface and interface analysis. 2011, Vol 43, Num 1-2, pp 475-478, issn 0142-2421, 4 p.Conference Paper

Microlens array produced using hot embossing processONG, N. S; KOH, Y. H; FU, Y. Q et al.Microelectronic engineering. 2002, Vol 60, Num 3-4, pp 365-379, issn 0167-9317Article

Modeling of focused ion beam induced chemistry and comparison with experimental dataEDINGER, Klaus; KRAUS, Thomas.Microelectronic engineering. 2001, Vol 57-58, pp 263-268, issn 0167-9317Conference Paper

Deposition property investigation of a focused ion beam for a high-aspect-ratio metal tipDAE KEUN CHOI; SANG HOON LEE.Microsystem technologies. 2013, Vol 19, Num 3, pp 363-370, issn 0946-7076, 8 p.Conference Paper

Stacking fault-related luminescence features in semi-polar GaN : Polarization-Field Control in Nitride Light EmittersTISCHER, Ingo; FENEBERG, Martin; GERTHSEN, Dagmar et al.Physica status solidi. B. Basic research. 2011, Vol 248, Num 3, pp 611-615, issn 0370-1972, 5 p.Article

Investigation of elastic properties of single-crystal α-Ti using microcantilever beamsJICHENG GONG; WILKINSON, Angus.Philosophical magazine letters. 2010, Vol 90, Num 7, pp 503-512, issn 0950-0839, 10 p.Article

The effect of tin grain structure on whisker growthYU, Cheng-Fu; CHAN, Chi-Ming; HSIEH, Ker-Chang et al.Microelectronics and reliability. 2010, Vol 50, Num 8, pp 1146-1151, issn 0026-2714, 6 p.Article

A low temperature fabrication process utilizing FIB implantation for CMOS compatible photovoltaic cellsPATEL, Jasbir N; LANDROCK, Clinton; OMRANE, Badr et al.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7750, issn 0277-786X, isbn 978-0-8194-8241-9, 775034.1-775034.7Conference Paper

Apple Cuticle——The Perfect InterfaceCURRY, Eric; AREY, Bruce.Proceedings of SPIE, the International Society for Optical Engineering. 2010, Vol 7729, issn 0277-786X, isbn 0-8194-8217-X 978-0-8194-8217-4, 1Vol, 77291P.1-77291P.11Conference Paper

Focused ion beam microscopy and micromachining : Focused ion beam microscopy and micromachiningVOLKERT, C. A; MINOR, A. M.MRS bulletin. 2007, Vol 32, Num 5, pp 389-395, issn 0883-7694, 7 p.Article

Visualization of Buried Structures in Atomic Force Acoustic MicroscopySTRIEGLER, André; KÖHLER, Bemd; BENDJUS, Beatrice et al.Proceedings of SPIE, the International Society for Optical Engineering. 2007, pp 65281B.1-65281B.4, issn 0277-786X, isbn 978-0-8194-6649-5Conference Paper

Focused ion beam sculpted membranes for nanoscience toolingBIANCE, A.-L; GIERAK, J; AUVRAY, L et al.Microelectronic engineering. 2006, Vol 83, Num 4-9, pp 1474-1477, issn 0167-9317, 4 p.Conference Paper