Mechanical characterization of Ti-5Al-2.5Sn ELI alloy at cryogenic and room temperaturesGHISI, Aldo; MARIANI, Stefano.International journal of fracture. 2007, Vol 146, Num 1-2, pp 61-77, issn 0376-9429, 17 p.Article

Multi-scale analysis of polysilicon MEMS sensors subject to accidental drops : Effect of packagingGHISI, Aldo; FACHIN, Fabio; MARIANI, Stefano et al.Microelectronics and reliability. 2009, Vol 49, Num 3, pp 340-349, issn 0026-2714, 10 p.Article

Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocksMARIANI, Stefano; MARTINI, Roberto; GHISI, Aldo et al.International journal of fracture. 2011, Vol 167, Num 1, pp 83-101, issn 0376-9429, 19 p.Article

Polysilicon MEMS accelerometers exposed to shocks : numerical-experimental investigationGHISI, Aldo; KALICINSKI, Stanislaw; MARIANI, Stefano et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 3, issn 0960-1317, 035023.1-035023.12Article

Reduced Order Modelling of MEMS DynamicsMARIANI, Stefano; EFTEKHAR AZAM, Saeed; GHISI, Aldo et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2011, pp 53-58, isbn 978-2-355-00013-3, 1Vol, 6 p.Conference Paper

A three-scale approach to the numerical simulation of metallic bonding for MEMS packagingGHISI, Aldo; MARIANI, Stefano; CORIGLIANO, Alberto et al.Microelectronics and reliability. 2014, Vol 54, Num 9-10, pp 2039-2043, issn 0026-2714, 5 p.Conference Paper