Electrically Conductive Adhesives. Part IIGOMATAM, Rajesh.Journal of adhesion science and technology. 2008, Vol 22, Num 14, issn 0169-4243, 203 p.Serial Issue

Electrically Conductive Adhesives, Part IGOMATAM, Rajesh R.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, issn 0169-4243, 221 p.Serial Issue

The interrelationships between electronically conductive adhesive formulations, substrate and filler surface properties, and joint performance. Part II: the effects of bonding pressureGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2004, Vol 18, Num 11, pp 1245-1261, issn 0169-4243, 17 p.Article

A study on the effects of surface roughness on the strength of single lap jointsSANCAKTAR, Erol; GOMATAM, Rajesh.Journal of adhesion science and technology. 2001, Vol 15, Num 1, pp 97-117, issn 0169-4243Article

Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive AdhesivesTEO, Mary.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 1003-1015, issn 0169-4243, 13 p.Article

A comprehensive fatigue life predictive model for electronically conductive adhesive joints under constant-cycle loadingGOMATAM, Rajesh R; SANCAKTAR, Erol.Journal of adhesion science and technology. 2006, Vol 20, Num 1, pp 87-104, issn 0169-4243, 18 p.Article

Electrical Properties of Copper-Filled Electrically Conductive Adhesives and Pressure-Dependent Conduction Behavior of Copper ParticlesLIN, Yung-Sen; CHIU, Sheng-Shiang.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1673-1697, issn 0169-4243, 25 p.Article

A novel mathematical procedure to evaluate the effects of surface topography on the interfacial state of stress. Part II. Verification of the method for scarf interfacesWEIJIAN MA; GOMATAM, Rajesh; SANCAKTAR, Erol et al.Journal of adhesion science and technology. 2003, Vol 17, Num 6, pp 831-846, issn 0169-4243, 16 p.Article

Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing DirectivesLEWIS, H. J; RYAN, A.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 893-913, issn 0169-4243, 21 p.Article

Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel SuspensionsJIANGUO ZHOU; SANCAKTAR, Erol.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 983-1002, issn 0169-4243, 20 p.Article

Modeling fatigue behavior of electronically conductive filled adhesive joints under cyclic loading: A novel modeling approach for integrated joint life predictionGOMATAM, Rajesh R; SANCAKTAR, Erol.SPIE proceedings series. 2003, pp 745-750, isbn 0-8194-5189-4, 6 p.Conference Paper

Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and CureJIANGUO ZHOU; SANCAKTAR, Erol.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 957-981, issn 0169-4243, 25 p.Article

Numerical simulation of underfill cure evolution in chip-scale-package (CSP) manufacturing processGOMATAM, Rajesh R; COULTER, John P.SPIE proceedings series. 2003, pp 916-921, isbn 0-8194-5189-4, 6 p.Conference Paper

Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel AdhesivesJIANGUO ZHOU; SANCAKTAR, Erol.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 947-956, issn 0169-4243, 10 p.Article

Reliability of Anisotropic Conductive Adhesive Joints in Electronic Packaging ApplicationsLIN, Y. C; CHEN, X.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1631-1657, issn 0169-4243, 27 p.Article

An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder ReplacementLEWIS, H. J; COUGHLAN, F. M.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 801-813, issn 0169-4243, 13 p.Article

Anisotropic Conductive Adhesives for Flip-Chip InterconnectsWEIQIANG WANG; CHAN, Y. C; PECHT, Michael et al.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 871-892, issn 0169-4243, 22 p.Article

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part II. Effect of Bump Coplanarity on Manufacturability and Durability of Non-Conducting Adhesive AssembliesFARLEY, D; DASGUPTA, A; CAERS, J. F. J et al.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1757-1780, issn 0169-4243, 24 p.Article

Temperature Characterization in Anisotropic Conductive Film Adhesive BondingZENNER, Robert L. D; MURRAY, Cameron T; FISHER, Carl et al.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1781-1795, issn 0169-4243, 15 p.Article

Aspect Ratio and Loading Effects of Multiwall Carbon Nanotubes in Epoxy for Electrically Conductive AdhesivesJING LI; LUMPP, Janet K; ANDREWS, Rodney et al.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1659-1671, issn 0169-4243, 13 p.Article

Electrically Conductive Adhesives for Electronic Packaging and Assembly ApplicationsMATIENZO, L. J; DAS, R. N; EGITTO, F. D et al.Journal of adhesion science and technology. 2008, Vol 22, Num 8-9, pp 853-869, issn 0169-4243, 17 p.Article

Mechanics of Adhesively Bonded Flip-Chip-on-Flex Assemblies. Part I. Durability of Anisotropically Conductive Adhesive InterconnectsHAASE, J; FARLEY, D; IYER, P et al.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1733-1756, issn 0169-4243, 24 p.Article

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic PackagingMYUNG JIN YIM; YI LI; MOON, Kyoung-Sik et al.Journal of adhesion science and technology. 2008, Vol 22, Num 14, pp 1593-1630, issn 0169-4243, 38 p.Article