au.\*:("GRIESE, Hans Jorgen")
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Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesivesCHUNYAN YIN; HUA LU; BAILEY, Chris et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 254-259, issn 1521-334X, 6 p.Conference Paper
Uncertainty estimation by Monte Carlo simulation applied to life cycle inventory of cordless phones and microscale metallization processesANDRAE, Anders S. G; MÖLLER, Patrik; ANDERSON, Johan et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 233-245, issn 1521-334X, 13 p.Conference Paper
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumpsCHU, Kun-Mo; LEE, Jung-Sub; HAN SEO CHO et al.IEEE transactions on electronics packaging manufacturing. 2004, Vol 27, Num 4, pp 246-253, issn 1521-334X, 8 p.Conference Paper