Modernisation d'une usine de papiers peints gaufrés = Modernization of an embossed wall-paper plantEnergie fluide. L'air industriel. 1990, Num 6, pp 43-44, issn 0291-8331, 2 p.Article

A compact system for large-area thermal nanoimprint lithography using smart stampsPEDERSEN, R. H; HANSEN, O; KRISTENSEN, A et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 5, issn 0960-1317, 055018.1-055018.9Article

Characterization and application of a UV-based imprint techniqueOTTO, M; BENDER, M; HADAM, B et al.Microelectronic engineering. 2001, Vol 57-58, pp 361-366, issn 0167-9317Conference Paper

Fabrication of 50 nm patterned nickel stamp with hot embossing and electroforming processHONG, Sung-Hoon; LEE, Jong-Hwa; LEE, Heon et al.Microelectronic engineering. 2007, Vol 84, Num 5-8, pp 977-979, issn 0167-9317, 3 p.Conference Paper

Fabrication of hierarchical structures by unconventional two-step imprintingGANG SHI; NAN LU; HONGBOXU et al.Journal of colloid and interface science. 2012, Vol 368, pp 655-659, issn 0021-9797, 5 p.Article

Replication of micro and sub-micro structures by means of hot embossed polymer insertsKOLEW, Alexander; SIKORA, Karsten; MÜNCH, Daniel et al.Symposium on design, test, integration and packaging of MEMS/MOEMS. 2010, pp 339-343, isbn 978-2-35500-011-9, 1Vol, 5 p.Conference Paper

Microlens fabrication using an etched glass masterZHANG, P; LONDE, G; SUNG, J et al.Microsystem technologies. 2007, Vol 13, Num 3-4, pp 339-342, issn 0946-7076, 4 p.Conference Paper

Development of a micro hot embossing process for fabricating micro optical devicesSHAN, X. C; MAEDA, R; MURAKOSHI, Y et al.SPIE proceedings series. 2002, pp 67-75, isbn 0-8194-4731-5, 9 p.Conference Paper

Grossflächige Bauteile im Urformwerkzeug kaschieren = Laminating large parts in the mouldBÜRKLE, E; REHM, G; ZWEIG, K et al.Kunststoffe. 1992, Vol 82, Num 10, pp 896-901, issn 0023-5563Article

Microlens array produced using hot embossing processONG, N. S; KOH, Y. H; FU, Y. Q et al.Microelectronic engineering. 2002, Vol 60, Num 3-4, pp 365-379, issn 0167-9317Article

Fabrication of photonic crystals for infrared applicationsLAI, Yeong-Lin; CHIU, Chi-Cheng.Colloids and surfaces. A, Physicochemical and engineering aspects. 2008, Vol 313-314, pp 497-499, issn 0927-7757, 3 p.Conference Paper

Hinterprägen und LSR-Verarbeitung im Spritzgiessverfahren = Embrossing of decorative materials and LSR processing in the injection moulding processPlastverarbeiter. 1993, Vol 44, Num 9, pp 96-98, issn 0032-1338, 2 p.Article

Embossing of chalcogenide glasses : monomode rib optical waveguides in evaporated thin filmsZHENG GANG LIAN; WEIJIAN PAN; FURNISS, David et al.Optics letters. 2009, Vol 34, Num 8, pp 1234-1236, issn 0146-9592, 3 p.Article

Design and fabrication of the concentric circle light guiding plate for LED-backlight module by MEMS techniqueCHIEN, Chao-Heng; CHEN, Zhi-Peng.Microsystem technologies. 2007, Vol 13, Num 11-12, pp 1529-1535, issn 0946-7076, 7 p.Conference Paper

A study of hot embossed microchannels using confocal microscopySIMDIKOVA, I; KUEPER, A; SBARSKI, I et al.SPIE proceedings series. 2002, pp 82-92, isbn 0-8194-4731-5, 11 p.Conference Paper

Shield can mounting clip design for robust and enhanced shielding effectiveness in mobile devicesEAKHWAN SONG; PARK, Hyun H.Electronics letters. 2014, Vol 50, Num 4, pp 318-320, issn 0013-5194, 3 p.Article

Prototyping of microfluidic systems using a commercial thermoplastic elastomerROY, Emmanuel; GEISSLER, Matthias; GALAS, Jean-Christophe et al.Microfluidics and nanofluidics (Print). 2011, Vol 11, Num 3, pp 235-244, issn 1613-4982, 10 p.Article

Micro-hot-embossing of 316L stainless steel micro-structuresFU, G; TOR, S. B; LOH, N. H et al.Applied physics. A, Materials science & processing (Print). 2009, Vol 97, Num 4, pp 925-931, issn 0947-8396, 7 p.Article

CO₂-assisted embossing for the fabrication of PMMA components under low temperature and with low pressureYANG, Sen-Yeu; HUANG, Tzu-Chien; CIOU, Jyun-Kai et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 2, issn 0960-1317, 025024.1-025024.7Article

Simple and cost-effective fabrication of two-dimensional plastic nanochannels from silica nanowire templatesLEI ZHANG; FUXING GU; LIMIN TONG et al.Microfluidics and nanofluidics (Print). 2008, Vol 5, Num 6, pp 727-732, issn 1613-4982, 6 p.Article

Measurement of demolding forces in full wafer thermal nanoimprintTRABADELO, Vera; SCHIFT, Helmut; MERINO, Santos et al.Microelectronic engineering. 2008, Vol 85, Num 5-6, pp 907-909, issn 0167-9317, 3 p.Conference Paper

Micro Embossing of Ceramic Green Substrates for Micro DevicesXUECHUAN SHAN; LING, S. H; MAW, H. P et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 355-359, isbn 978-2-35500-006-5, 1Vol, 5 p.Conference Paper

Hot embossing of microfluidic platformCHIEN, Rean-Der.International communications in heat and mass transfer. 2006, Vol 33, Num 5, pp 645-653, issn 0735-1933, 9 p.Article

Interaction of anti-adhesive silicone films with UV embossing resinYAN, Y. H; CHAN-PARK, M. B; CHING, W. C et al.Applied surface science. 2005, Vol 249, Num 1-4, pp 332-339, issn 0169-4332, 8 p.Article

Nanoelectrochemical transducers for (bio-) chemical sensor applications fabricated by nanoimprint lithographyBECK, M; PERSSON, F; CARLBERG, P et al.Microelectronic engineering. 2004, Vol 73-74, pp 837-842, issn 0167-9317, 6 p.Conference Paper