Collective motion of atoms in grain boundary migration of a bcc metalZHOU, L; ZHOU, N; SONG, G et al.Philosophical magazine (2003. Print). 2006, Vol 86, Num 36, pp 5885-5895, issn 1478-6435, 11 p.Article

Lattice-plane curvature and small-angle grain boundaries in SiC bulk crystalsSEITZ, Christoph; HERRO, Ziad G; EPELBAUM, Boris M et al.Journal of applied crystallography. 2006, Vol 39, pp 17-23, issn 0021-8898, 7 p., 1Article

Characterization of grain growth, nature and role of grain boundaries in microcrystalline silicon : review of typical featuresKOCKA, J; MATES, T; STUCHLIKOVA, H et al.Thin solid films. 2006, Vol 501, Num 1-2, pp 107-112, issn 0040-6090, 6 p.Conference Paper

What does it mean to be special? The significance and application of the Brandon criterionKING, Alexander H; SHEKHAR, Shashank.Journal of materials science. 2006, Vol 41, Num 23, pp 7675-7682, issn 0022-2461, 8 p.Conference Paper

Energy analysis for (1 1 1) twist grain boundary in noble metalsZHANG, Jian-Min; WEI, Xiu-Mei; HONG XIN et al.Applied surface science. 2005, Vol 243, Num 1-4, pp 1-6, issn 0169-4332, 6 p.Article

Energies of [001] small angle grain boundaries in aluminumOTSUKI, A.Journal of materials science. 2005, Vol 40, Num 12, pp 3219-3223, issn 0022-2461, 5 p.Conference Paper

Ab initio ELNES/XANES spectral calculation of polar and non-polar grain boundaries in β-SiCRULIS, Paul; CHING, W. Y; KOHYAMA, Masanori et al.Acta materialia. 2004, Vol 52, Num 10, pp 3009-3018, issn 1359-6454, 10 p.Article

Kinetics of non-equilibrium grain-boundary segregationXU TINGDONG; CHENG BUYUAN.Progress in materials science. 2004, Vol 49, Num 2, pp 109-208, issn 0079-6425, 100 p.Article

The monitoring of grain-boundary grooves in aluminaMUNOZ, Nicole E; GILLISS, Shelley R; CARTER, C. Barry et al.Philosophical magazine letters. 2004, Vol 84, Num 1, pp 21-26, issn 0950-0839, 6 p.Article

In situ TEM observations of moving interfaces during discontinuous precipitation reaction in Al-22 at. % Zn alloyZIEBA, P.Zeitschrift für Metallkunde. 2004, Vol 95, Num 4, pp 230-232, issn 0044-3093, 3 p.Conference Paper

Phase field simulations of intermetallic compound growth during soldering reactionsHUH, J. Y; HONG, K. K; KIM, Y. B et al.Journal of electronic materials. 2004, Vol 33, Num 10, pp 1161-1170, issn 0361-5235, 10 p.Conference Paper

Stress-induced migration of tilt and twist grain boundariesWINNING, Myrjam.Zeitschrift für Metallkunde. 2004, Vol 95, Num 4, pp 233-238, issn 0044-3093, 6 p.Conference Paper

Lowest angle solution versus low-index axis solution for misorientationsCROSS, Ian; RANDLE, Valerie.Scripta materialia. 2003, Vol 48, Num 12, pp 1587-1591, issn 1359-6462, 5 p.Article

A numerical model of grain growthDU, Z.-Z; MCMEEKING, R. M; COCKS, A. C. F et al.Zeitschrift für Metallkunde. 2003, Vol 94, Num 4, pp 368-376, issn 0044-3093, 9 p.Article

Accommodation of coherency strain by interfacial disconnections at a 90° (110) grain boundary in goldMEDLIN, D. L; COHEN, D; POND, R. C et al.Philosophical magazine letters. 2003, Vol 83, Num 4, pp 223-232, issn 0950-0839, 10 p.Article

Geometric origin of hexagonal close packing at a grain boundary in goldLUCADAMO, G; MEDLIN, D. L.Science (Washington, D.C.). 2003, Vol 300, Num 5623, pp 1272-1275, issn 0036-8075, 4 p.Article

Grain boundary scars and spherical crystallographyBAUSCH, A. R; BOWICK, M. J; CACCIUTO, A et al.Science (Washington, D.C.). 2003, Vol 299, Num 5613, pp 1716-1718, issn 0036-8075, 3 p.Article

Grain boundary structure of nanocrystalline Cu processed by cryomillingHUANG, J. Y; LIAO, X. Z; ZHU, Y. T et al.Philosophical magazine (2003. Print). 2003, Vol 83, Num 12, pp 1407-1419, issn 1478-6435, 13 p.Article

Transformations of grain boundaries due to disclination motion and emission of dislocation pairsGUTKIN, M. Yu; OVID'KO, I. A; SKIBA, N. V et al.Materials science & engineering. A, Structural materials : properties, microstructure and processing. 2003, Vol 339, Num 1-2, pp 73-80, issn 0921-5093, 8 p.Article

Transformations of grain boundary dislocation pile-ups in nano- and polycrystalline materialsFEDOROV, A. A; GUTKIN, M. Yu; OVID'KO, I. A et al.Acta materialia. 2003, Vol 51, Num 4, pp 887-898, issn 1359-6454, 12 p.Article

Characterization of contacting boundaries between small particles with microdiffractionYIMING YAO; THÖLEN, Anders.Nanotechnology (Bristol. Print). 2002, Vol 13, Num 2, pp 169-174, issn 0957-4484Article

Kinetics of the recovery of diffusion properties of nonequilibrium grain boundariesPEREVEZENTSEV, V. N; PUPYNIN, A. S; SVIRINA, Yu. V et al.Physics of metals and metallography. 2002, Vol 94, Num 2, pp 141-146, issn 0031-918XArticle

The rigid-body displacement observed at the Σ = 5, (310)-[001] symmetric tilt grain boundary in central transition bcc metalsCAMPBELL, Geoffrey H; KUMAR, Mukul; KING, Wayne E et al.Philosophical magazine. A. Physics of condensed matter. Structure, defects and mechanical properties. 2002, Vol 82, Num 8, pp 1573-1594, issn 1364-2804Article

Thermally activated step motion observed by high-resolution electron microscopy at a (113) symmetric tilt grain-boundary in aluminiumMERKLE, K. L; THOMPSON, L. J; PHILLIPP, Fritz et al.Philosophical magazine letters. 2002, Vol 82, Num 11, pp 589-597, issn 0950-0839, 9 p.Article

A step associated with the Σ = 19 (2530) tilt boundary in GaNBERE, A; CHEN, J; RUTERANA, P et al.Journal of physics. Condensed matter (Print). 2002, Vol 14, Num 48, pp 12703-12708, issn 0953-8984, 6 p.Conference Paper