Spatial correlation of high-energy grain boundaries in two-dimensional simulated polycrystalsVAN SICLEN, Clinton Dew.Acta materialia. 2007, Vol 55, Num 3, pp 983-989, issn 1359-6454, 7 p.Article

Grain boundary width, energy and self-diffusion in nickel: Effect of material purityPROKOSHKINA, D; ESIN, V. A; WILDE, G et al.Acta materialia. 2013, Vol 61, Num 14, pp 5188-5197, issn 1359-6454, 10 p.Article

'Special' boundaries and grain boundary plane engineeringRANDLE, Valerie.Scripta materialia. 2006, Vol 54, Num 6, pp 1011-1015, issn 1359-6462, 5 p.Article

Reversed anisotropy of grain boundary properties and its effect on grain boundary engineeringLEJCEK, Pavel; JÄGER, Aleš; GÄRTNEROVA, Viera et al.Acta materialia. 2010, Vol 58, Num 6, pp 1930-1937, issn 1359-6454, 8 p.Article

Motion of a grain boundary facet in aluminumBRANDENBURG, J.-E; BARRALES-MORA, L. A; MOLODOV, D. A et al.Acta materialia. 2013, Vol 61, Num 14, pp 5518-5524, issn 1359-6454, 7 p.Article

An experimentally quantifiable solute drag factorDILLON, Shen J; BEHERA, Shantanu K; HARMER, Martin P et al.Acta materialia. 2008, Vol 56, Num 6, pp 1374-1379, issn 1359-6454, 6 p.Article

Transient solute drag in migrating grain boundariesSVOBODA, J; FISCHER, F. D; LEINDL, M et al.Acta materialia. 2011, Vol 59, Num 17, pp 6556-6562, issn 1359-6454, 7 p.Article

Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressingKE, J. H; CHUANG, H. Y; SHIH, W. L et al.Acta materialia. 2012, Vol 60, Num 5, pp 2082-2090, issn 1359-6454, 9 p.Article

Grain boundary diffusion and segregation of Ni in CuDIVINSKI, Sergiy; RIBBE, Jens; SCHMITZ, Guido et al.Acta materialia. 2007, Vol 55, Num 10, pp 3337-3346, issn 1359-6454, 10 p.Article

Five-parameter grain boundary distribution of commercially grain boundary engineered nickel and copperRANDLE, V; ROHRER, G. S; MILLER, H. M et al.Acta materialia. 2008, Vol 56, Num 10, pp 2363-2373, issn 1359-6454, 11 p.Article

Diffusion induced grain boundary migration in the Cu-Zn systemSIUAIAH, Bathula; GUPTA, S. P.Materials characterization. 2008, Vol 59, Num 9, pp 1141-1151, issn 1044-5803, 11 p.Article

Diffusion on grain boundary networks : Percolation theory and effective medium approximationsYING CHEN; SCHUH, Christopher A.Acta materialia. 2006, Vol 54, Num 18, pp 4709-4720, issn 1359-6454, 12 p.Article

Grain boundary diffusion and segregation of Bi in Cu: radiotracer measurements in B and C diffusion regimesDIVINSKI, Sergiy; LOHMANN, Maik; HERZIG, Christian et al.Acta materialia. 2004, Vol 52, Num 13, pp 3973-3982, issn 1359-6454, 10 p.Article

On migration and faceting of low-angle grain boundaries: Experimental and computational studyBRANDENBURG, J.-E; BARRALES-MORA, L. A; MOLODOV, D. A et al.Acta materialia. 2014, Vol 77, pp 294-309, issn 1359-6454, 16 p.Article

Low-angle grain boundary migration in the presence of extrinsic dislocationsLIM, A. T; SROLOVITZ, D. J; HAATAJA, M et al.Acta materialia. 2009, Vol 57, Num 17, pp 5013-5022, issn 1359-6454, 10 p.Article

Grain boundary radiotracer diffusion of ₇₁Ge and ₇₂Ga in Al and Al-Ga alloysLOHMANN, Maik; DIVINSKI, Sergiy V; HERZIG, Christian et al.Zeitschrift für Metallkunde. 2005, Vol 96, Num 4, pp 352-357, issn 0044-3093, 6 p.Article

Grain boundary junction engineeringGOTTSTEIN, G; SHVINDLERMAN, L. S.Scripta materialia. 2006, Vol 54, Num 6, pp 1065-1070, issn 1359-6462, 6 p.Article

Dihedral angles in Cu-1 wt.% Pb : Grain boundary energy and grain boundary triple line effectsEMPL, D; FELBERBAUM, L; LAPORTE, V et al.Acta materialia. 2009, Vol 57, Num 8, pp 2527-2537, issn 1359-6454, 11 p.Article

Migration of faceted high-angle grain boundaries in ZnGOTTSTEIN, G; SHVINDLERMAN, L. S; SURSAEVA, V. G et al.International journal of materials research. 2008, Vol 99, Num 5, pp 491-495, issn 1862-5282, 5 p.Article

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migrationSAROBOL, P; BLENDELL, J. E; HANDWERKER, C. A et al.Acta materialia. 2013, Vol 61, Num 6, pp 1991-2003, issn 1359-6454, 13 p.Article

Mechanism for the development of anisotropic grain boundary character distributions during normal grain growthDILLON, Shen J; ROHRER, Gregory S.Acta materialia. 2009, Vol 57, Num 1, pp 1-7, issn 1359-6454, 7 p.Article

The disconnection mechanism of coupled migration and shear at grain boundariesKHATER, H. A; SERRA, A; POND, R. C et al.Acta materialia. 2012, Vol 60, Num 5, pp 2007-2020, issn 1359-6454, 14 p.Article

Molecular dynamics simulations of grain boundary sliding : The effect of stress and boundary misorientationYUE QI; KRAJEWSKI, Paul E.Acta materialia. 2007, Vol 55, Num 5, pp 1555-1563, issn 1359-6454, 9 p.Article

Relation between grain growth and grain-boundary diffusion in a pure material by molecular dynamics simulationsYAMAKOV, V; MOLDOVAN, D; RASTOGI, K et al.Acta materialia. 2006, Vol 54, Num 15, pp 4053-4061, issn 1359-6454, 9 p.Article

Comparative study of grain-boundary migration and grain-boundary self-diffusion of [0 0 1] twist-grain boundaries in copper by atomistic simulationsSCHÖNFELDER, B; GOTTSTEIN, G; SHVINDLERMAN, L. S et al.Acta materialia. 2005, Vol 53, Num 6, pp 1597-1609, issn 1359-6454, 13 p.Article