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Polarity effect of electromigration on intermetallic compound formation in SnPb solder jointsLU, Yu-Dong; HE, Xiao-Qi; EN, Yun-Fei et al.Acta materialia. 2009, Vol 57, Num 8, pp 2560-2566, issn 1359-6454, 7 p.Article
