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A NEW FAMILY OF MICROELECTRONIC PACKAGES FOR AVIONICS.SETTLE RE JR.1978; SOLID. STATE TECHNOL.; USA; DA. 1978; VOL. 21; NO 6; PP. 54-58; BIBL. 6 REF.Article

ENVIRONMENTAL & HERMETIC PIGGY-BACK CONNECTORS.LAWRENCE RG.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. TECH. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 113-118Conference Paper

ADVANCED INDIVIDUAL CONTACT SEALING FOR CONNECTORS.MCNALLY H.1976; IN: INT. ELECTRON. PACKAG. PROD. CONF. PROC. PROGRAMME; BRIGHTON, ENGL.; 1976; SURBITON; KIVER COMMUNICATIONS; DA. 1976; PP. 84-95Conference Paper

LOW COST HYBRID PACKAGINGSIMS JR; CRETER PG; SOUCY JW et al.1980; CIRCUITS MANUF.; USA; DA. 1980; VOL. 20; NO 3; PP. 84-93; (6 P.); BIBL. 7 REF.Article

HELIUM LEAK MEASUREMENTS AS A PREDICTOR OF HERMETIC PACKAGE LIFE IN SURGICALLY-IMPLANTED MICROELECTRONIC DEVICESDONALDSON PEK.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 479-484Conference Paper

METHOD FOR THE CALIBRATION AND ANALYSIS OF MOISTURE IN HERMETICALLY SEALED SEMICONDUCTOR PACKAGES BY GAS MASS SPECTROMETRYGRILLETTO C; VOWINKEL F.1980; SOLID STATE TECHNOL.; USA; DA. 1980; VOL. 23; NO 6; PP. 71-73Article

PLANAR DOUBLE-HETEROSTRUCTURE GAALAS LED'S PACKAGED FOR FIBER OPTICSSPEER RS; HAWKINS BM.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 4; PP. 480-484; BIBL. 10 REF.Article

THE INTEGRATED SUBSTRATE PACKAGE: AN ECONOMIC APPROACH TO HERMETIC HYBRID PACKAGESSERGENT JE; PETERSEN ME.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 485-497Conference Paper

PROBLEME DER HERMETISIERUNG VON SCHALTKREISEN DER MIKROELEKTRONIK = LES PROBLEMES D'HERMETISATION DU CIRCUIT EN MICROELECTRONIQUEDUBOWITZKAJA IM.1979; NACHR.-TECH. ELEKTRON.; DDR; DA. 1979; VOL. 29; NO 4; PP. 154-156Article

IMPROVED VACUUM SEALS FOR MAGNESIUM FLUORIDE WINDOWSFREEMAN GHC; MOORE PJ.1978; J. PHYS. E; GBR; DA. 1978; VOL. 11; NO 10; PP. 980-981; BIBL. 1 REF.Article

USING CHIP CARRIERS FOR HIGH DENSITY PACKAGING.BAUER JA.1977; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1977; VOL. 17; NO 10; PP. 85-91 (4P.)Article

DICHTIGKEITSPRUEFUNG VON BAUELEMENTEN-DARGESTELLT AM BEISPIEL HERMETISCH ABGESCHLOSSENER RELAIS. = ESSAIS D'ETANCHEITE DES COMPOSANTS REPRESENTES PAR UN EXEMPLE DE RELAIS SCELLE HERMETIQUEMENTKRAMNY W.1976; MESSEN U. PRUEFEN; DTSCH.; DA. 1976; NO 11; PP. 652-656 (3P.); BIBL. 5 REF.Article

THE SEALING OF SMALL-SIZE PACKAGES OF INTEGRATED CIRCUITS BY LASER WELDING = HERMETISATION PAR SOUDAGE AU LASER DES BOITIERS DES CIRCUITS INTEGRESZARIKOV RG; VIGDOROVICH VN; ZVEV IV et al.1977; WELDG PRODUCT.; GBR; DA. 1977; VOL. 24; NO 11; PP. 12-13; BIBL. 4 REF.; DE RUS: SVAROCH. PROIZVOD., SUN, 1977, NO 11, 25-26; LOC. ISArticle

VACUUM SEALING OF LITHIUM FLUORIDE WINDOWS WITH LEAD FLUORIDE.MULDER BJ.1977; J. PHYS. E; G.B.; DA. 1977; VOL. 10; NO 6; PP. 591-593; BIBL. 5 REF.Article

ALPHA EMISSION MEASUREMENTS OF LIDS AND SOLDER PREFORMS ON SEMICONDUCTOR PACKAGESLEVINE SW.1979; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1979; VOL. 2; NO 4; PP. 391-395; BIBL. 7 REF.Article

SOME EXPERIENCES AND CONCLUSIONS USING SOLDERED AND WELDED PACKAGES FOR HERMETIC THICK FILM HYBRIDS.DOYLE KB.1977; MICROELECTRON. AND RELIAB.; G.B.; DA. 1977; VOL. 16; NO 4; PP. 303-307; (SEMICOND. TECHNOL. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1977)Conference Paper

GRAPHICAL SOLUTION FOR THE BACK PRESSURIZATION METHOD OF HERMETIC TESTRUTHBERG S.1981; IEEE TRANS. COMPON. HYBRIDS MANUF. TECHNOL.; ISSN 0148-6411; USA; DA. 1981; VOL. 4; NO 2; PP. 217-224; BIBL. 13 REF.Article

HYBRID TECHNOLOGY COMES OF AGEPOLDEN JR.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 14; PP. 33-42; (5 P.)Article

CONSIDERATIONS FOR SELECTING AND EVALUATING GLASS-TO-METAL SEALSBUCKLEY RG.1978; INSULAT. CIRCUITS; USA; DA. 1978; VOL. 24; NO 12; PP. 19-20Article

MASS CHANGES OF ADHESIVES DURING CURING, EXPOSURE TO WATER VAPOR, EVACUATION, AND OUTGASSING, PART I: ABLEFILMS 529, 535 AND 550VASOFSKY RW; CSANDERNA AW; CSANDERNA KK et al.1978; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1978; VOL. 1; NO 4; PP. 405-411; BIBL. 20 REF.Article

NONHERMETICITY OF POLYMERIC LID SEALANTS.TRAEGER RK.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 2; PP. 147-152; BIBL. 15 REF.Article

HIGH RPM ELECTRIC SPINDLES INCREASE SPEED AND ACCURACY IN CARBON MOLD PRODUCTION.1976; INSULAT. CIRCUITS; U.S.A.; DA. 1976; VOL. 22; NO 11; PP. 27Article

AUTOMATIC COLD PRESSURE WELDING EQUIPMENT APPLIED TO SEALING ELECTRONIC DEVICESONODERA Y; FUJITA T; KOIKE M et al.1979; NEC RES. DEVELOP.; JPN; DA. 1979; NO 53; PP. 80-85; BIBL. 3 REF.Article

AIRBORNE PACKAGING USING COMPOUND HYBRIDS WITH LSIGORDON RB.1978; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1978; VOL. 18; NO 11; PP. 39-50; (7 P.)Article

GAS INFUSION INTO DOUBLED HERMETIC ENCLOSURES.RUTHBERG S.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 2; PP. 110-116; BIBL. 17 REF.Article

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