Coefficient of thermal expansion for solder alloys based on cluster expansion methodHONG MEI JIN; WU, Ping.Journal of material chemistry. 2002, Vol 12, Num 4, pp 1090-1093, issn 0959-9428Article

DFT calculations for a photoresist polymer/TaO substrate adhesion in wafer fabricationPING WU; HONG MEI JIN; HONG LIN LIU et al.Journal of adhesion science and technology. 2003, Vol 17, Num 8, pp 1075-1081, issn 0169-4243, 7 p.Article

Relationship among chemical element properties, bulk additive properties, and crystal structures of binary zinc compoundsPING WU; HONG MEI JIN; YI LI et al.Chemistry of materials. 1999, Vol 11, Num 11, pp 3166-3170, issn 0897-4756Article

A simplified wittig synthesis using polyacrylates with a terminal triphenylphosphonium group and polymerization of the macromonomersWEI-PING SHEN; HONG-MEI JIN.Macromolecular chemistry and physics (Print). 1992, Vol 193, Num 3, pp 743-748, issn 1022-1352Article

Correlation of chemical element properties and additive behaviors of ternary zinc compoundsPING WU; HONG MEI JIN; YI LI et al.Calphad. 2002, Vol 26, Num 1, pp 55-62, issn 0364-5916Article

Theoretical estimation of coefficient of thermal expansion for solder alloyBOON KWANG LEE; HONG MEI JIN; PING WU et al.Journal of materials science. 2003, Vol 38, Num 6, pp 1135-1137, issn 0022-2461, 3 p.Article

Investigation of additive effects on Zn diffusion in hot-dip galvanizing by DFT calculationsPING WU; HONG MEI JIN; HONG LIN LIU et al.Chemistry of materials. 2002, Vol 14, Num 2, pp 832-837, issn 0897-4756Article

Effects of Ag and Ni additives on Zn diffusion in steel hot-dip galvanizing: An ab initio molecular dynamics simulationWEIHUA ZHU; PING WU; HONG MEI JIN et al.Chemistry of materials. 2004, Vol 16, Num 26, pp 5567-5573, issn 0897-4756, 7 p.Article

Computer aided design of NiMH electrodesKOK LIANG HENG; HONG MEI JIN; YI LI et al.Journal of material chemistry. 1999, Vol 9, Num 3, pp 837-843, issn 0959-9428Article

Periodic density functional theory study of the crystal morphology of FeZn₁₃WEIHUA ZHU; HONG MEI JIN; PING WU et al.Physical review B. Condensed matter and materials physics. 2004, Vol 70, Num 16, pp 165419.1-165419.7, issn 1098-0121Article

Study on the behavior of additives in steel hot-dip galvanizing by DFT calculationsHONG MEI JIN; YI LI; HONG LIN LIU et al.Chemistry of materials. 2000, Vol 12, Num 7, pp 1879-1883, issn 0897-4756Article