Identification of a novel amino-terminal fragment of amyloid precursor protein in mouse neuroblastoma Neuro2a cellHOSHINO, Masataka; DOHMAE, Naoshi; TAKIO, Koji et al.Neuroscience letters. 2003, Vol 353, Num 2, pp 135-138, issn 0304-3940, 4 p.Article

High-performance vertical interconnection for high-density 3D chip stacking packageUMEMOTO, Mitsuo; TANIDA, Kazumasa; NEMOTO, Yoshihiko et al.Proceedings - Electronic Components Conference. 2004, issn 0569-5503, isbn 0-7803-8365-6, 2Vol, Vol 1, 616-623Conference Paper

Copper electrodeposition of high-aspect-ratio vias for three dimensional packagingKONDO, Kazuo; YONEZAWA, Toshihiro; TOMISAKA, Manabu et al.Proceedings - Electrochemical Society. 2003, pp 28-32, issn 0161-6374, isbn 1-56677-390-3, 5 p.Conference Paper

Polyglutamine tract-binding protein-1 dysfunction induces cell death of neurons through mitochondrial stressMARUBUCHI, Shigeki; WADA, Yo-Ichi; OKUDA, Tomohiro et al.Journal of neurochemistry. 2005, Vol 95, Num 3, pp 858-870, issn 0022-3042, 13 p.Article

Distinct aggregation and cell death patterns among different types of primary neurons induced by mutant huntingtin proteinTAGAWA, Kazuhiko; HOSHINO, Masataka; OKUDA, Tomohiro et al.Journal of neurochemistry. 2004, Vol 89, Num 4, pp 974-987, issn 0022-3042, 14 p.Article

High-aspect-ratio copper via filling used for three-dimensional chip stackingSUN, Jian-Jun; KONDO, Kazuo; OKAMURA, Takuji et al.Journal of the Electrochemical Society. 2003, Vol 150, Num 6, pp G355-G358, issn 0013-4651Article

Histone deacetylase activity is retained in primary neurons expressing mutant huntingtin proteinHOSHINO, Masataka; TAGAWA, Kazuhiko; OKUDA, Tomohiro et al.Journal of neurochemistry. 2003, Vol 87, Num 1, pp 257-267, issn 0022-3042, 11 p.Article

Electroplating Cu fillings for through-vias for three-dimensional chip stackingTOMISAKA, Manabu; YONEMURA, Hitoshi; HOSHINO, Masataka et al.Proceedings - Electronic Components Conference. 2002, pp 1432-1438, issn 0569-5503, isbn 0-7803-7430-4, 7 p.Conference Paper