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Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process: Butterfly deposition modeHO, C. E; HSIEH, W. Z; CHEN, C. C et al.Surface & coatings technology. 2014, Vol 259, pp 262-267, issn 0257-8972, 6 p., bConference Paper

Investigation on the dynamics of cross-tie walls in elliptical permalloy elementsCHANG, Y. C; CHANG, C. C; HSIEH, W. Z et al.IEEE transactions on magnetics. 2005, Vol 41, Num 2, pp 959-961, issn 0018-9464, 3 p.Conference Paper

Pronounced effects of Ni(P) thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive systemHO, C. E; FAN, C. W; HSIEH, W. Z et al.Surface & coatings technology. 2014, Vol 259, pp 244-251, issn 0257-8972, 8 p., bConference Paper

As-deposited magnetic states in arrays of rectangular permalloy elementsLAI, Mei-Feng; WEI, Zung-Hang; WU, J. C et al.IEEE transactions on magnetics. 2005, Vol 41, Num 2, pp 944-946, issn 0018-9464, 3 p.Conference Paper

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