Diffusion barrier performance of reactively sputtered Ta-W-N between Cu and SiYUZHANG LIU; SHUANGXI SONG; DALI MAO et al.Microelectronic engineering. 2004, Vol 75, Num 3, pp 309-315, issn 0167-9317, 7 p.Article

Wetting process of electrolyte in high density Cu/Sn micro-bumps electrodepositingJINGLIN BI; HUIQIN LING; ANMIN HU et al.Applied surface science. 2011, Vol 257, Num 8, pp 3723-3727, issn 0169-4332, 5 p.Article

Super-hydrophobic nickel films with micro-nano hierarchical structure prepared by electrodepositionTAO HANG; ANMIN HU; HUIQIN LING et al.Applied surface science. 2010, Vol 256, Num 8, pp 2400-2404, issn 0169-4332, 5 p.Article

Study on the Adhesion Between Epoxy Molding Compound and Nanocone-Arrayed Pd Preplated Leadframes : Functional NanomaterialsTAO HANG; HUIQIN LING; ZHENGJI XIU et al.Journal of electronic materials. 2007, Vol 36, Num 12, pp 1594-1598, issn 0361-5235, 5 p.Article

Diffusion barrier performances of thin Mo, Mo-N and Mo/Mo-N films between Cu and SiSHUANGXI SONG; YUZHANG LIU; DALI MAO et al.Thin solid films. 2005, Vol 476, Num 1, pp 142-147, issn 0040-6090, 6 p.Article

Preparation and characterization of metalorganic decomposition-derived SrBi₂Ta₂O₉ thin filmsDI WU; AIDONG LI; HUIQIN LING et al.Materials letters (General ed.). 2000, Vol 44, Num 3-4, pp 158-163, issn 0167-577XArticle

Structure and electrical properties of SrBi₂Ta₂O₉ thin films annealed in different atmosphereHUIQIN LING; AIDONG LI; DI WU et al.Materials letters (General ed.). 2001, Vol 49, Num 5, pp 303-307, issn 0167-577XArticle

Preparation of (Ba_0.5Sr_0.5)TiO₃ thin films by sol-gel method with rapid thermal annealingDI WU; AIDONG LI; HUIQIN LING et al.Applied surface science. 2000, Vol 165, Num 4, pp 309-314, issn 0169-4332Article

Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distributionHAIYONG CAO; TAO HANG; HUIQIN LING et al.Microelectronic engineering. 2014, Vol 116, pp 1-5, issn 0167-9317, 5 p.Article

Fabrication of composite coating particles with mullite stoichiometric ratio by a novel processingYUEFENG TANG; AIDONG LI; HUIQIN LING et al.Applied surface science. 2002, Vol 193, Num 1-4, pp 83-86, issn 0169-4332Article

Growth and ferroelectric properties of sol-gel derived Pb(Zr, Ti) O₃ using inorganic zirconium precursorQIYUE SHAO; AIDONG LI; HUIQIN LING et al.Materials letters (General ed.). 2001, Vol 50, Num 1, pp 32-35, issn 0167-577XArticle

Diffusion barrier performance of W/Ta-W-N double layers for Cu metallizationSHUANGXI SONG; YUZHANG LIU; MING LI et al.Microelectronic engineering. 2006, Vol 83, Num 3, pp 423-427, issn 0167-9317, 5 p.Article

Investigation of the structural and electrical properties of Sr_1-xBi_2.2Ta₂O₉ thin films with deficient Sr contentsAIDONG LI; HUIQIN LING; DI WU et al.Applied surface science. 2001, Vol 173, Num 3-4, pp 307-312, issn 0169-4332Article

Effect of excess bismuth on the microstructures and electrical properties of strontium bismuth tantalate (SBT) thin filmsAIDONG LI; DI WU; HUIQIN LING et al.Thin solid films. 2000, Vol 375, Num 1-2, pp 215-219, issn 0040-6090Conference Paper

Fabrication and electrical properties of sol-gel derived (BaSr)TiO₃ thin films with metallic LaNiO₃ electrodeDI WU; AIDONG LI; ZHIGUO LIU et al.Thin solid films. 1998, Vol 336, Num 1-2, pp 172-175, issn 0040-6090Conference Paper