Investigation of Adhesion Phenomena in Thermoplastic Polyurethane Injection Molding ProcessCHEN, Jian-Yu; HWANG, Sheng-Jye.Polymer engineering and science. 2012, Vol 52, Num 7, pp 1571-1580, issn 0032-3888, 10 p.Article

Static analysis of the die picking processLIN, Yeong-Jyh; HWANG, Sheng-Jye.IEEE transactions on electronics packaging manufacturing. 2005, Vol 28, Num 2, pp 142-149, issn 1521-334X, 8 p.Article

Geometry influence of reflectors for infrared rapid heating on micro-injection moldingCHANG, Pei-Chi; HWANG, Sheng-Jye.Materials science forum. 2005, pp 1261-1266, issn 0255-5476, isbn 0-87849-990-3, 2Vol, 6 p.Conference Paper

Predicting the process induced warpage of electronic packages using the P-V-T-C equation and the Taguchi methodTENG, Shiang-Yu; HWANG, Sheng-Jye.Microelectronics and reliability. 2007, Vol 47, Num 12, pp 2231-2241, issn 0026-2714, 11 p.Article

Isobaric cure shrinkage behaviors of epoxy molding compound in isothermal stateHWANG, Sheng-Jye; CHANG, Yi-San.Journal of polymer science. Part B. Polymer physics. 2005, Vol 43, Num 17, pp 2392-2398, issn 0887-6266, 7 p.Article

Design and fabrication of an adhesion force tester for the injection moulding processCHEN, Jian-Yu; HWANG, Sheng-Jye.Polymer testing. 2013, Vol 32, Num 1, pp 22-31, issn 0142-9418, 10 p.Article

On a porous medium combustor for hydrogen flame stabilization and operationSU, Siou-Sheng; HWANG, Sheng-Jye; LAI, Wei-Hsiang et al.International journal of hydrogen energy. 2014, Vol 39, Num 36, pp 21307-21316, issn 0360-3199, 10 p.Article

Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After CuringLIN, Yeong-Jyh; HWANG, Sheng-Jye; LEE, Huei-Huang et al.IEEE transactions on components, packaging, and manufacturing technology (2011. Print). 2011, Vol 1, Num 11-12, pp 1755-1760, issn 2156-3950, 6 p.Article

Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packagingHONG, Li-Ching; HWANG, Sheng-Jye; LEE, Huei-Huang et al.IEEE international conference on polymers and adhesives in microelectronics and photonics. 2004, pp 78-84, isbn 0-7803-8744-9, 1Vol, 7 p.Conference Paper