kw.\*:("HYBRID INTEGRATED CIRCUIT")
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INNOVATIONS IN HYBRID PACKAGINGMARKSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 9; PP. 40-44; (4 P.); BIBL. 1 REF.Article
COMPONENT VERIFICATION SYSTEMSCHROEDER DD; HINES RE.1980; I.E.E.E. TRANS. COMPON. HYBR. MANUFG TECHNOL.; USA; DA. 1980; VOL. 3; NO 3; PP. 367-369Article
RESISTOR GRIDS IN HYBRID CIRCUITSBAPESWARA RAO VV; MURTHY MJR.1980; MICROELECTRON J.; GBR; DA. 1980; VOL. 11; NO 4; PP. 24-26; BIBL. 4 REF.Article
A TECHNIQUE FOR THE MEASUREMENT OF HOT SPOTS AND ISOTHERM PROFILES AT THE SURFACES OF THE ELEMENTS OF HYBRID MICROCIRCUITSSINNADURAI FN.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 6; NO 3-4; PP. 177-183; BIBL. 6 REF.Article
ETUDE DE FIABILITE DES SEMICONDUCTEURS POUR CIRCUITS HYBRIDES DANS DIFFERENTS TYPES D'ENCAPSULATION COLLECTIVEVAL C; FORGEOT D'ARC B.1979; ; FRA; DA. 1979; CNET-78 9B 115; NON PAG.: DIAGR.; 30 CMReport
DEVELOPING A NANUFACTURING TECHNOLOGY FOR POWER HYBRIDSHAMILL AT; MARTHINUSS JE; RAZZETTI LA et al.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 9; PP. 72-76; 4 P.Article
THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article
THICK FILM AND HYBRID CIRCUITSBARNWELL PG.1980; NEW ELECTRON.; GBR; DA. 1980; VOL. 13; NO 11; PP. 90-93; (2 P.)Article
QUALITY AND RELIABILITY IN HYBRID CIRCUITSREAD RF.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 555-560Conference Paper
UNIVERSELLER FREQUENZTEILER IN HYBRIDTECHNIK = DIVISEUR DE FREQUENCE UNIVERSEL EN TECHNIQUE HYBRIDEWETZKO M; STREUBEL P; ALTHUS J et al.1979; RADIO FERNSEHEN ELEKTRON.; DDR; DA. 1979; VOL. 28; NO 1; PP. 19-21; BIBL. 8 REF.Article
HYBRID TECHNOLOGY-BEST SUPPORTING ACTOR.BOUCHARD JG.1977; I.E.E.E. TRANS. MANUFG TECHNOL.; U.S.A.; DA. 1977; VOL. 6; NO 4; PP. 65-68; BIBL. 9 REF.Article
RELIABILITY TESTING OF B.A.C. HYBRID CIRCUITS.TAYLOUR CH.1977; MICROELECTRON. AND RELIAB.; G.B.; DA. 1977; VOL. 16; NO 4; PP. 295-302; (SEMICOND. TECHNOL. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1977)Conference Paper
ANWENDUNG DES VCO-HYBRIDSCHALTKREISES 81-13 = LES APPLICATIONS DES CIRCUITS HYBRIDES VCO 81-13KRUEGER S.1982; RADIO FERNS. ELEKTRON.; ISSN 0033-7900; DDR; DA. 1982; VOL. 31; NO 8; PP. 515-516; BIBL. 5 REF.Article
QUALITY AND RELIABILITY IN HYBRID CIRCUITSREAD RF.1980; ELECTROCOMPON. SCI. TECHNOL.; ISSN 0305-3091; GBR; DA. 1980; VOL. 7; NO 1-3; PP. 155-157Article
THICK-FILM SOLID-STATE BRIDGE LIFTERGASSNER GF; FABAC SM JR.1980; WEST. ELECTR. ENG.; ISSN 0043-3659; USA; DA. 1980; VOL. 24; NO 3; PP. 43-50; 7 P.Article
EVALUATION DE LA MICROELECTRONIQUE HYBRIDE FRANCAISEBILLOT M.1980; NOTE TECH.-CENT. NATL. ETUD. SPAT.; ISSN 0532-3584; FRA; DA. 1980; NO 97; 13 P.; ABS. ENGSerial Issue
THE ROLE OF CUSTOMER Q.A. IN REDUCING HYBRID RELIABILITY PROBLEMS.LYNCH JT; HATFIELD JA; BRYDON GM et al.1977; MICROELECTRON. AND RELIAB.; G.B.; DA. 1977; VOL. 16; NO 4; PP. 523-526; (SEMICOND. TECHNOL. ANNU. SEMINEX TECH. SEMIN. EXHIB.; LONDON; 1977)Conference Paper
MORE RELIABLE CONNECTIONS TO CONDENSATION-SOLDERED TERMINALSGUTBIER EA; CHAVERS RA; OUELLETTE PJ et al.1982; SOLID STATE TECHNOLOGY; ISSN 0038-111X; USA; DA. 1982; VOL. 25; NO 10; PP. 99-104; BIBL. 4 REF.Article
A FLEXIBLE APPROACH TO AUTOMATED WIRE BONDINGSTUBIN RJ; DIEFFENBACHER GW.1981; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1981; VOL. 21; NO 1; PP. 113-128; 8 P.Article
FOIL CIRCUITSHOUSKA KH.1979; EUROPEAN HYBRID MICROELECTRONICS CONFERENCE. 2/1978/GHENT; NLD; PIJNACKER: DUTCH EFFICIENCY BUREAU; DA. 1979; PP. 399-409Conference Paper
SERIE D'AMPLIFICATEURS OPERATIONNELS DE LA MICROELECTRONIQUE POUR LES SYSTEMES DE CALCUL HYBRIDES.POLONNIKOV DE; BABAYAN RR; KARPOV AG et al.1978; MIKROELEKTRONIKA; SUN; DA. 1978; VOL. 7; NO 4; PP. 337-344; BIBL. 5 REF.Article
WHEN AND WHY TO USE PASSIVE CHIPS IN HYBRID CIRCUITS.AWATAR SINGH.1977; MICROELECTRON. AND RELIABIL.; G.B.; DA. 1977; VOL. 16; NO 6; PP. 705-706; BIBL. 11 REF.Article
FOREWORD. SPECIAL ISSUE ON HYBRID MICROELECTRONICS.DEGAN JJ; COLCLASER RA; SERGENT JE et al.1976; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1976; VOL. 12; NO 4; PP. 273-275Article
PRECISION PATTERN GENERATION FOR HYBRID INTEGRATED CIRCUITS (HIC'S) BY SELECTIVE PLATING.PFAHNL A.1976; VIDE; FR.; DA. 1976; NO 183 SUPPL.; PP. 150-152; (MATER. TECHNOL. MICROELECTR. TENDANCES ACTUELLES. COLLOQ. C.R.; MONTPELLIER; 1976)Conference Paper
PATTERN GENERATOR FOR HYBRID-ICSMIYAZAKI K; NAKAMURA K; AKASA R et al.1982; NEC RES. DEV.; ISSN 0048-0436; JPN; DA. 1982; NO 66; PP. 1-6; BIBL. 1 REF.Article