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Harm's way : Engineering software and microtechnology prepare a defense against terrorismTHILMANY, Jean.Mechanical engineering (New York, N.Y. 1919). 2005, Vol 127, Num 8, pp 22-24, issn 0025-6501, 3 p.Article

High aspect ratio spiral and vertical meander micro coils for actuator applicationsSEIDEMANN, V; KOHLMEIER, T; FÖHSE, M et al.Microsystem technologies. 2004, Vol 10, Num 6-7, pp 564-570, issn 0946-7076, 7 p.Article

High aspect ratio glass structures produced by means of the drawing technologyHESSE, A; MROTZEK, S; HIILSENBERG, D et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1541-1544, issn 0946-7076, 4 p.Conference Paper

A method of gap control based on the principle of equal thickness interference for HARNS fabricationJIE ZHOU; GANG LIU; XIAOBO ZHANG et al.Microsystem technologies. 2011, Vol 17, Num 1, pp 101-107, issn 0946-7076, 7 p.Article

Manufacturing process for high aspect ratio metallic micro parts made by electroplating on partially conductive templatesPROKOP, J; FINNAH, G; LORENZ, J et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1669-1674, issn 0946-7076, 6 p.Conference Paper

Nanosprint : An infrastructure for nanotechnology foresightCIONTU, Florin.European micro and nano systems. Conference. 2004, pp 249-252, isbn 2-916187-02-2, 1Vol, 4 p.Conference Paper

3D high aspect ratio micro structures fabricated by one step UV lithographyHUANG, H; YANG, W; WANG, T et al.Journal of micromechanics and microengineering (Print). 2007, Vol 17, Num 2, pp 291-296, issn 0960-1317, 6 p.Article

Influence of the microstructure on the strain of micro componentsALBERS, A; METZ, D.Microsystem technologies. 2006, Vol 12, Num 7, pp 685-690, issn 0946-7076, 6 p.Conference Paper

Macroporous silicon-based deep anisotropic etchingTAO, Yi; ESASHI, Masayoshi.Journal of micromechanics and microengineering (Print). 2005, Vol 15, Num 4, pp 764-770, issn 0960-1317, 7 p.Article

Fabrication of high-aspect-ratio microstructures using SU8 photoresistLIU, G; TIAN, Y; KAN, Y et al.Microsystem technologies. 2005, Vol 11, Num 4-5, pp 343-346, issn 0946-7076, 4 p.Conference Paper

Fabrication of silicon-on-insulator MEM resonators with deep sub-micron transduction gapsDIANA, Nicoleta; CIRESSAN, Badila; HIBERT, Cyrille et al.Microsystem technologies. 2007, Vol 13, Num 11-12, pp 1489-1493, issn 0946-7076, 5 p.Conference Paper

MODULIGA: The LIGA process as a modular production method-current standardization status in GermanyHAHN, L; MEYER, P; BADE, K et al.Microsystem technologies. 2005, Vol 11, Num 4-5, pp 240-245, issn 0946-7076, 6 p.Conference Paper

Dimensional measurement of microform with high aspect ratio using an optically controlled particle with standing wave scale sensingTAKAYA, Yasuhiro; MICHIHATA, Masaki; HAYASHI, Terutake et al.CIRP annals. 2012, Vol 61, Num 1, pp 479-482, issn 0007-8506, 4 p.Conference Paper

Mechanical strength and interfacial failure analysis of cantilevered SU-8 micropostsHWA SENG KHOO; LIU, Kuo-Kang; TSENG, Fan-Gang et al.Journal of micromechanics and microengineering (Print). 2003, Vol 13, Num 6, pp 822-831, issn 0960-1317, 10 p.Article

Elimination of nanovoids induced during electroforming of metallic nanostamps with high-aspect-ratio nanostructures by the pulse reverse current electroforming processJUNGJIN HAN; JEONGWON HAN; BYUNG SOO LEE et al.Journal of micromechanics and microengineering (Print). 2012, Vol 22, Num 6, issn 0960-1317, 065004.1-065004.10Article

Replication technologies for HARM devices : status and perspectivesHOTTER, V; BAUER, W; HANEMANN, T et al.Microsystem technologies. 2008, Vol 14, Num 9-11, pp 1599-1605, issn 0946-7076, 7 p.Conference Paper

A new removable resist for high aspect ratio applicationsSCHIRMER, Matthias; PERSEKE, Doris; ZENA, Eva et al.Microsystem technologies. 2007, Vol 13, Num 3-4, pp 335-338, issn 0946-7076, 4 p.Conference Paper

Polymer microstructure generated by laser stereo-lithography and its transfer to silicon substrate using reactive ion etchingKANAMORI, Yoshiaki; SATO, Junya; SHIMANO, Takeshi et al.Microsystem technologies. 2007, Vol 13, Num 8-10, pp 1411-1416, issn 0946-7076, 6 p.Conference Paper

Hot embossing at viscous state to enhance filling process for complex polymer structuresXUELIN ZHU; SIMON, Terrence W; TIANHONG CUI et al.Microsystem technologies. 2012, Vol 18, Num 3, pp 257-265, issn 0946-7076, 9 p.Article

High aspect ratio hydrogenation-assisted lateral etching of (10 0) silicon substratesKAYYALHA, M; NAGHSH NILCHI, J; EBRAHIMI, A et al.Journal of micromechanics and microengineering (Print). 2011, Vol 21, Num 7, issn 0960-1317, 074003.1-074003.8Conference Paper

1-3 Piezocomposites realised from small feature size, high aspect ratio, hot embossed moulds. Part II: piezocomposite fabricationCLIPSHAM, T. J; BUTTON, T. W.Microsystem technologies. 2010, Vol 16, Num 11, pp 1983-1988, issn 0946-7076, 6 p.Article

Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layersFANGHUA MEI; KE CHEN; LU, B et al.Microsystem technologies. 2009, Vol 15, Num 7, pp 1111-1118, issn 0946-7076, 8 p.Article

Enhanced UV-assisted vertical etching of polyethylene terephthalate for fabrication of microsystemsJAHANSHAHI, A; PAJOUHI, H; TAMADDON, A. H et al.Journal of micromechanics and microengineering (Print). 2009, Vol 19, Num 7, issn 0960-1317, 074016.1-074016.6Conference Paper

Fabrication of a SFF-based three-dimensional scaffold using a precision deposition system in tissue engineeringJONG YOUNG KIM; EUI KYUN PARK; KIM, Shin-Yoon et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 5, issn 0960-1317, 055027.1-055027.7Article

Lithographic stress control for the self-assembly of polymer MEMS structuresLEE, S.-W; SAMEOTO, D; MAHANFAR, A et al.Journal of micromechanics and microengineering (Print). 2008, Vol 18, Num 8, issn 0960-1317, 085004.1-085004.8Article

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