Electroplating important in manufacturing cofired multilayer ceramic modules and packagesSISOLAK, R.Electri.onics. 1983, Vol 29, Num 10, pp 25-26, issn 0745-4309Article

Optimum computer aided design for hybrid ICsKOHARA, H; USHIGOME, M; KAWASHIMA, S et al.NEC research & development. 1988, Num 91, pp 104-110, issn 0547-051XArticle

Nitrogen-filled storage cabinets avoid oxidation of hybrid componentsVOGEL, J.Electri.onics. 1983, Vol 29, Num 9, pp 29-30, issn 0745-4309Article

A new type hybrid IC in a transfer-molded standard packageNITTA, H; SASAMOTO, T; YAMANAKA, M et al.NEC research & development. 1988, Num 91, pp 65-72, issn 0547-051XArticle

Choosing an automatic component distribution system for hybrid circuit manufacturingPELLATON, J. P; GABUS, J.-C.Electri.onics. 1983, Vol 29, Num 7, pp 43-47, issn 0745-4309Article

Conception de circuits intégrés hybrides de générateurs de la gamme microondePETROV, G. V.Mikroèlektronika (Moskva). 1984, Vol 13, Num 2, pp 138-147, issn 0544-1269Article

Trends in medical electronics using surface mounted components and hybridsHICKS, R. E; CHARLES, H. K. JR; WAGNER, G. D et al.Solid state technology. 1983, Vol 26, Num 12, pp 145-150, issn 0038-111XArticle

Matériaux utilisés en technologie des couches épaisses et fiabilité des circuits hybridesGRAVES, P. W.Revue des Télécommunications. 1982, Vol 57, Num 2, pp 127-131, issn 0373-8582Article

INNOVATIONS IN HYBRID PACKAGINGMARKSTEIN HW.1979; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1979; VOL. 19; NO 9; PP. 40-44; (4 P.); BIBL. 1 REF.Article

Hybrid integrated surge protector for digital switching systemKUROSAWA, H; TOMIMURO, H.IEEE transactions on components, hybrids, and manufacturing technology. 1985, Vol 8, Num 2, pp 259-263, issn 0148-6411Article

A zero-insertion-force hybrid circuit connector for severe environmentsSINCLAIR, P.IEEE transactions on components, hybrids, and manufacturing technology. 1984, Vol 7, Num 4, pp 378-383, issn 0148-6411Conference Paper

Hot gas desoldering cuts hybrid and PCB repair costsWERTH, J; BASSMAN, C.Electri.onics. 1983, Vol 29, Num 13, pp 35-37, issn 0745-4309Article

Electrostatic discharge (ESD) sensitivity of thin-film hybrid passive componentsTHIET THE LAI.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 4, pp 627-638, issn 0148-6411Conference Paper

Molded hybrid IC packagesRANJIT BISWAS; CURTIS, H. III; DEANE, P. A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1989, Vol 12, Num 4, pp 514-520, issn 0148-6411Conference Paper

The Gain-Bandwidth of hybrid optical transistorsIBRAHIM, M. M.IEEE journal of quantum electronics. 1988, Vol 24, Num 11, pp 2227-2230, issn 0018-9197Article

A planar subharmonically-pumped 71 GHz receiver with integral feed antennaWILLIAMS, D. F; SCHWARTZ, S. E.International journal of infrared and millimeter waves. 1986, Vol 7, Num 2, pp 183-194, issn 0195-9271Article

Hybrid module manufacturing techniques yield improved packaging alternativesWOULBROUN, J.Electri.onics. 1985, Vol 31, Num 3, pp 28-31, issn 0745-4309Article

Organics in optoelectronics : advances and roadmapELDADA, Louay.Proceedings of SPIE, the International Society for Optical Engineering. 2006, pp 61240X.1-61240X.15, issn 0277-786X, isbn 0-8194-6166-0, 1VolConference Paper

Ein Verdrahtungssystem zum rechnergestützten Layoutentwurf von Multichipträgern = Routing algorithms for computer-aided-design of hybrid circuitsLEINIG, J.Wissenschaftliche Zeitschrift der Technischen Universität Dresden. 1991, Vol 40, Num 5-6, pp 157-161, issn 0043-6925Article

Transient current capacities of bond wires in hybrid microcircuitsCOXON, M; KERSHNER, C; MCELIGOT, D. M et al.IEEE transactions on components, hybrids, and manufacturing technology. 1986, Vol 9, Num 3, pp 279-285, issn 0148-6411Article

A review of thick film microwave integrated circuit technologyNEWPORT, C.Microelectronics. 1984, Vol 15, Num 2, pp 44-52, issn 0026-2692Article

Hybrid overviewBARNARD, D.Electri.onics. 1984, Vol 30, Num 6, pp 37-39, issn 0745-4309Article

Herstellung von Widerstands- und Kondensatornetzwerken für integrierte Hybridschaltungen durch Tantaltechnologie = Fabrication de réseaux de résistances et de capacités pour circuits intégrés hybrides par technologie du tantale = Fabrication of resistor and capacitance networks for hybrid integrated circuits by tantalum technologyHERMANSKY, V; PATOCKA, Z.Nachrichtentechnik. Elektronik. 1984, Vol 34, Num 12, pp 472-473, issn 0323-4657Article

DEVELOPING A NANUFACTURING TECHNOLOGY FOR POWER HYBRIDSHAMILL AT; MARTHINUSS JE; RAZZETTI LA et al.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 9; PP. 72-76; 4 P.Article

THE LAYOUT OF LARGE HYBRIDS TO MAXIMIZE YIELDMYRVAAGNES B.1980; ELECTRON. PACKAG. PROD.; ISSN 0013-4945; USA; DA. 1980; VOL. 20; NO 10; PP. 77-80; 3 P.Article