A Multidimensional Krylov Reduction Technique With Constraint Variables to Model Nonlinear Distributed NetworksRASEKH, Ehsan; DOUNAVIS, Anestis.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 738-746, issn 1521-3323, 9 p.Article

Alignment and Performance Considerations for Capacitive, Inductive, and Optical Proximity CommunicationMAJUMDAR, Arka; CUNNINGHAM, John E; KRISHNAMOORTHY, Ashok V et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 690-701, issn 1521-3323, 12 p.Article

Characterization of Next Generation Thin Low-K and Low-Loss Organic Dielectrics From 1 to 110 GHzHWANG, Seunghyun; SUNGHWAN MIN; YUAN LI et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 180-188, issn 1521-3323, 9 p.Article

Electrical Modeling and Design of a Wafer-Level Package for MEM ResonatorsPERRUISSEAU-CARRIER, Julien; MAZZA, Marco; JOURDAIN, Anne et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 534-542, issn 1521-3323, 9 p.Article

Electro-Thermo-Mechanical Characterizations of Various Wire Bonding Interconnects Illuminated by an Electromagnetic PulseKONG, Fan-Zhi; YIN, Wen-Yan; MAO, Jun-Fa et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 729-737, issn 1521-3323, 9 p.Article

IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity ApplicationsDE PAULIS, Francesco; RAIMONDO, Leo; ORLANDI, Antonio et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 617-622, issn 1521-3323, 6 p.Article

Optical Chip-to-Chip Link System by Using Optical Wiring Method for Reducing EMICHO, In-Kui; YUN, Jae-Hoon; JEONG, Myung-Yung et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 722-728, issn 1521-3323, 7 p.Article

Parallel Simulation of Massively Coupled Interconnect NetworksPAUL, Douglas; NAKHLA, Natalie M; ACHAR, Ramachandra et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 115-127, issn 1521-3323, 13 p.Article

Power-Bus Sensitivity AnalysisDE CAMILLIS, Luca; ANTONINI, Giulio; JANDHYALA, Vikram et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 2, pp 447-456, issn 1521-3323, 10 p.Article

Rapid Assessment of BGA Fatigue Life Under Vibration LoadingWU, Mei-Ling; BARKER, Donald.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 88-96, issn 1521-3323, 9 p.Article

Recrystallization, Electric Flame-Off Characteristics, and Electron Backscatter Diffraction of Copper Bonding WiresHUNG, Fei-Yi; LUI, Truan-Sheng; CHEN, Li-Hui et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 1, pp 58-63, issn 1521-3323, 6 p.Article

Reliability and Flexibility of Ultra-Thin Chip-on-Flex (UTCOF) Interconnects With Anisotropic Conductive Adhesive (ACA) JointsLU, Su-Tsai; CHEN, Wen-Hwa.IEEE transactions on advanced packaging. 2010, Vol 33, Num 3, pp 702-712, issn 1521-3323, 11 p.Article

Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis FunctionsKI JIN HAN; SWAMINATHAN, Madhavan; BANDYOPADHYAY, Tapobrata et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 804-817, issn 1521-3323, 14 p.Article

Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric SuperstrateCHENG, Yung-Shou; GUO, Wei-Da; HUNG, Chih-Pin et al.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 961-968, issn 1521-3323, 8 p.Article

Passivity Check of S-Parameter Descriptor Systems via S-Parameter Generalized Hamiltonian MethodsZHENG ZHANG; WONG, Ngai.IEEE transactions on advanced packaging. 2010, Vol 33, Num 4, pp 1034-1042, issn 1521-3323, 9 p.Article

A Novel Time-Domain Approach for Extracting Broadband Models of Power Delivery NetworksWith Resonance EffectWANG, Chen-Chao; KUO, Chih-Wen; WU, Sung-Mao et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 3, pp 636-643, issn 1521-3323, 8 p.Article

Characterization of Parylene-N as Flexible Substrate and Passivation Layer for Microwave and Millimeter-Wave Integrated CircuitsSHARIFI, Hasan; LAHIJI, Rosa R; LIN, Han-Chung et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 84-92, issn 1521-3323, 9 p.Article

Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systemsSHIDONG LI; ABDULHAMID, Mohd F; BASARAN, Cemal et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 478-485, issn 1521-3323, 8 p.Article

Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip Interconnects : Wafer-level packagingWU, Wei-Cheng; CHANG, Edward Yi; HWANG, Ruey-Bing et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 362-371, issn 1521-3323, 10 p.Article

Electroplated Metal Buried Interconnect and Through-Wafer Metal-Filled Via Technology for High-Power Integrated ElectronicsJI, Chang-Hyeon; HERRAULT, Florian; HOPPER, Peter et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 3, pp 695-702, issn 1521-3323, 8 p.Article

FDTD Schemes With Minimal Numerical DispersionOGURTSOV, Stanislav; GEORGAKOPOULOS, Stavros V.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 199-204, issn 1521-3323, 6 p.Article

Fabrication Processes for Embedding Thin Chips in Flat Flexible SubstratesGOVAERTS, Jonathan; CHRISTIAENS, Wim; BOSMAN, Erwin et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 77-83, issn 1521-3323, 7 p.Article

Frequency-Division Bidirectional Communication Over Chip-to-Chip Channels : High-speed I/O channelsBICHAN, Mike; HOSSAIN, Masum; CHAN CARUSONE, Anthony et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 298-305, issn 1521-3323, 8 p.Article

Improving the Yield and Turn-Around Time of Focused Ion Beam Microsurgery of Integrated Circuits by LCVD MethodREMES, J; VÄHÄKANGAS, J; UUSIMÄKI, A et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 2, pp 497-502, issn 1521-3323, 6 p.Article

Integration of High Aspect Ratio Tapered Silicon Via for Silicon Carrier FabricationRANGANATHAN, N; EBIN, Liao; LINN, Linn et al.IEEE transactions on advanced packaging. 2009, Vol 32, Num 1, pp 62-71, issn 1521-3323, 10 p.Article