Application of the Underfill Model to Bump Arrangement and Dispensing Process DesignPENG, Sin-Wei; YOUNG, Wen-Bin.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 2, pp 122-128, issn 1521-334X, 7 p.Article

Defect Morphology and Texture in Sn, Sn-Cu, and Sn-Cu-Pb Electroplated Films : Tin whiskersSAROBOL, Pylin; PEDIGO, Aaron E; PENG SU et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 159-164, issn 1521-334X, 6 p.Article

Electrical Shorting Propensity of Tin Whiskers : Tin whiskersHAN, Sungwon; OSTERMAN, Michael; PECHT, Michael G et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 3, pp 205-211, issn 1521-334X, 7 p.Article

Measuring Manufacturing Yield for Gold Bumping Processes Under Dynamic Variance ChangePEARN, W. L; TAI, Y. T; CHIANG, W. L et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 2, pp 77-83, issn 1521-334X, 7 p.Article

Tin Whisker Test Development—Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data CollectionREYNOLDS, Heidi L; OSENBACH, John W; HENSHALL, Gregory et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 1, pp 1-15, issn 1521-334X, 15 p.Article

An Integrated Manufacturing System for the Design, Fabrication, and Measurement of Ultra-Precision Freeform OpticsKONG, L. B; CHEUNG, C. F; LEE, W. B et al.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 4, pp 244-254, issn 1521-334X, 11 p.Article

Simulation Methods for Predicting Fusing Current and Time for Encapsulated Wire BondsMALLIK, Aditi; STOUT, Roger.IEEE transactions on electronics packaging manufacturing. 2010, Vol 33, Num 4, pp 255-264, issn 1521-334X, 10 p.Article

Modeling of Soldering Quality by Using Artificial Neural NetworksLIUKKONEN, Mika; HILTUNEN, Teri; HAVIA, Elina et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 2, pp 89-96, issn 1521-334X, 8 p.Article

Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper DissolutionIZUTA, Goro; TANABE, Tsuyoshi; SUGANUMA, Katsuaki et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 3, pp 138-143, issn 1521-334X, 6 p.Article

Statistical Analysis of Transponder Packaging in UHF RFID SystemsMATS, Leonid; CAIN, J. T; MICKLE, Marlin H et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 2, pp 97-105, issn 1521-334X, 9 p.Article

Chemical and Mechanical Analysis of PCB Surface Treated by Argon Plasma to Enhance Interfacial AdhesionDONG KIL SHIN; HYO SUG LEE; IM, Jay et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 281-290, issn 1521-334X, 10 p.Article

Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder AlloyMYSORE, Kaushik; SUBBARAYAN, Ganesh; GUPTA, Vikas et al.IEEE transactions on electronics packaging manufacturing. 2009, Vol 32, Num 4, pp 221-232, issn 1521-334X, 12 p.Article

A Multiphase Fuzzy Logic Approach to Strategic Planning of a Reverse Supply Chain NetworkPOCHAMPALLY, Kishore K; GUPTA, Surendra M.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 72-82, issn 1521-334X, 11 p.Article

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA AssembliesPUTAALA, Jussi; KANGASVIERI, Tero; NOUSIAINEN, Olli et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 3, pp 240-247, issn 1521-334X, 8 p.Article

Geometric and Compaction Dependence of Printed Polymer-Based RFID Tag Antenna PerformanceLEUNG, Stanley Y. Y; LAM, David C. C.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 2, pp 120-125, issn 1521-334X, 6 p.Article

Implementing 0201s On High-Density Lead-Free Memory ModulesIYER, Satyanarayan; SAJJALA, Sandeep; DAMODARAN, Purushothaman et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 41-50, issn 1521-334X, 10 p.Article

Modified Face-Down Bonding of Ridge-Waveguide Lasers Using Hard SolderTEO, J. W. Ronnie; SHI, X. Q; YUAN, S et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 2, pp 159-167, issn 1521-334X, 9 p.Article

Structured-Light Based Sensing Using a Single Fixed Fringe Grating : Fringe Boundary Detection and 3-D ReconstructionJUN CHENG; CHUNG, Chi-Kit Ronald; LAM, Edmund Y et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 19-31, issn 1521-334X, 13 p.Article

Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress AnalysisYONG LIU; IRVING, Scott; LUK, Timwah et al.IEEE transactions on electronics packaging manufacturing. 2008, Vol 31, Num 1, pp 61-71, issn 1521-334X, 11 p.Article

Assembly of copper column interconnect flip chipLIN, Ta-Hsuan; MENEZES, Arun S; ANDROS, Frank et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 3, pp 206-212, issn 1521-334X, 7 p.Article

Fast heuristics for designing integrated E-waste reverse logistics networksWANG, I-Lin; YANG, Wen-Cheng.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 2, pp 147-154, issn 1521-334X, 8 p.Article

Mechanical characterization and performance optimization for GPU fan-sink cooling module assemblyCHEN, Ching-I; NI, Ching-Yu; LEE, Cheng-Chung et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 3, pp 173-181, issn 1521-334X, 9 p.Article

Performance of printed polymer-based RFID antenna on curvilinear surfaceLEUNG, Stanley Y. Y; LAM, David C. C; MEMBER, Senior et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 3, pp 200-205, issn 1521-334X, 6 p.Article

Processing and characterization of nanosilver pastes for die-attaching SiC devicesBAI, John G; CALATA, Jesus N; LU, Guo-Quan et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 4, pp 241-245, issn 1521-334X, 5 p.Article

Solder joint reliability in electronics under shock and vibration using explicit finite-element submodeling : Drop testingLALL, Pradeep; GUPTE, Sameep; CHOUDHARY, Prakriti et al.IEEE transactions on electronics packaging manufacturing. 2007, Vol 30, Num 1, pp 74-83, issn 1521-334X, 10 p.Article